Study on precision dicing process of SiC wafer with diamond dicing blades

An innovative method for high-speed micro-dicing of SiC has been proposed using two types of diamond dicing blades,a resin-bonded dicing blade and a metal-bonded dicing blade.The experimental research investigated the radial wear of the dicing blade,the maximum spindle current,the surface morphology of the SiC die,the number of chips longer than 10μm,and the chipped area,which depend on the dicing process parameters such as spindle speed,feed speed,and cutting depth.The chipping fractures in the SiC had obvious brittle fracture characteristics.The performance of the metal-bonded dicing blade was inferior to that of the resin-bonded dicing blade.The cutting depth has the greatest influence on the radial wear of the dicing blade,the maximum spindle current,and the damage to the SiC wafer.The next most important parameter is the feed speed.The parameter with the least influence is the spindle speed.The main factor affecting the dicing quality is blade vibration caused by spindle vibration.The optimal SiC dicing was for a resin-bonded dicing blade with a spindle speed of 20000 rpm,a feed speed of 4 mm/s,and a cutting depth of 0.1 mm.To improve dicing quality and tool performance,spindle vibrations should be reduced.This approach may enable high-speed dicing of SiC wafers with less dicing damage.

Improvement of a Dicing Blade Using Direction Controlled Whisker by Electric Field

In the recent years, the light sensitive resin has be en greatly improved. Its application includes rapid prototyping, bonding, protec tive coating and sealing. A new application to using light sensitive resin inste ad of heat sensitive resin as bonding material in dicing blade is being progress ed by authors. This paper discusses the way in which the mechanical feature of t he new kinds of dicing blades had been greatly improved via adding whisker into light sensitive resin. Considering the enhancing function of whisker in length d irection is greater than that in diameter direction, an electric field was appli ed to make the direction of whisker in resin along with the direction of the load of dicing blade. In the electric field, a whisker in the resin is swerved to the direction of the electric force before the resin is solidified by ultravi olet radiation. The result shows that controlling the direction of whisker in th e resin by applying an electric field can finally greatly improve the mechanical property of dicing blade that can be used in processing the semi-conduct.

Optical properties of He^(+)-implanted and diamond blade-diced terbium gallium garnet crystal planar and ridge waveguides

Terbium gallium garnet(Tb_(3)Ga_(5)O_(12),TGG)crystal can be used to fabricate various magneto-optical devices due to its optimal Faraday effect.In this work,400-keV He^(+)ions with a fluence of 6.0×10^(16)ions/cm^(2)are irradiated into the TGG crystal for the planar waveguide formation.The precise diamond blade dicing with a rotation speed of 2×10^(4)rpm and a cutting velocity of 0.1 mm/s is performed on the He^(+)-implanted TGG planar waveguide for the ridge structure.The darkmode spectrum of the He^(+)-implanted TGG planar waveguide is measured by the prism-coupling method,thereby obtaining the relationship between the reflected light intensity and the effective refractive index.The refractive index profile of the planar waveguide is reconstructed by the reflectivity calculation method.The near-field light intensity distribution of the planar waveguide and the ridge waveguide are recorded by the end-face coupling method.The He^(+)-implanted and diamond blade-diced TGG crystal planar and ridge waveguides are promising candidates for integrated magneto-optical devices.