In this study, dielectric barrier discharge plasma and ozone(O_3) were combined to synergistically degrade trans-ferulic acid(FA), and the effect of water quality on FA degradation was studied. The results showed that...In this study, dielectric barrier discharge plasma and ozone(O_3) were combined to synergistically degrade trans-ferulic acid(FA), and the effect of water quality on FA degradation was studied. The results showed that 96.9% of FA was degraded after 40 min treatment by the plasma/O_3 process. FA degradation efficiency increased with the p H values. The presence of suspended solid and humic acid inhibited FA degradation. FA degradation efficiency increased as the water temperature increased to 30 °C. However, the further increase in water temperature was adverse for FA degradation. Effects of common inorganic ions on FA degradation were also investigated. The addition of Cl^- inhibited the FA degradation, whileCO_3^(2-) had both negative and positive influences on FA degradation.NO_3^- andSO_4^(2-) did not have significant effect on FA degradation. Fe^(3+)and Cu^(2+)benefited FA degradation through the Fenton-like and catalytic ozonation reactions.展开更多
The kinetic energy of ions in dielectric barrier discharge plasmas are analysed theoretically using the model of binary collisions between ions and gas molecules. Langevin equation for ions in other gases, Blanc law f...The kinetic energy of ions in dielectric barrier discharge plasmas are analysed theoretically using the model of binary collisions between ions and gas molecules. Langevin equation for ions in other gases, Blanc law for ions in mixed gases, and the two-temperature model for ions at higher reduced field are used to determine the ion mobility. The kinetic energies of ions in CH4 ＋ Ar（He） dielectric barrier discharge plasma at a fixed total gas pressure and various Ar （He） concentrations are calculated. It is found that with increasing Ar （He） concentration in CH4 ＋ Ar （He） from 20% to 83%, the CH4＋ kinetic energy increases from 69.6 （43.9） to 92.1 （128.5）eV, while the Ar＋ （He＋） kinetic energy decreases from 97 （145.2） to 78.8 （75.5）eV. The increase of CH4＋ kinetic energy is responsible for the increase of hardness of diamond-like carbon films deposited by CH4 ＋ Ar （He） dielectric barrier discharge without bias voltage over substrates.展开更多
Plasma polymerized fluorocarbon （FC） films have been deposited on silicon substrates from dielectric barrier discharge （DBD） plasma of C4Fs at room temperature under a pressure of 25～125 Pa. The effects of the di...Plasma polymerized fluorocarbon （FC） films have been deposited on silicon substrates from dielectric barrier discharge （DBD） plasma of C4Fs at room temperature under a pressure of 25～125 Pa. The effects of the discharge pressure and frequency of power supply on the films have been systematically investigated. FC films with a less cross linked structure may be formed at a relatively high pressure. Increase in the frequency of power supply leads to a significant increase in the deposition rate. Static contact angle measurements show that deposited FC films have a stable, hydrophobic surface property. All deposited films show smooth surfaces with an atomic surface roughness. The relationship between plasma parameters and the properties of the deposited FC films are discussed.展开更多
文摘In this study, dielectric barrier discharge plasma and ozone(O_3) were combined to synergistically degrade trans-ferulic acid(FA), and the effect of water quality on FA degradation was studied. The results showed that 96.9% of FA was degraded after 40 min treatment by the plasma/O_3 process. FA degradation efficiency increased with the p H values. The presence of suspended solid and humic acid inhibited FA degradation. FA degradation efficiency increased as the water temperature increased to 30 °C. However, the further increase in water temperature was adverse for FA degradation. Effects of common inorganic ions on FA degradation were also investigated. The addition of Cl^- inhibited the FA degradation, whileCO_3^(2-) had both negative and positive influences on FA degradation.NO_3^- andSO_4^(2-) did not have significant effect on FA degradation. Fe^(3+)and Cu^(2+)benefited FA degradation through the Fenton-like and catalytic ozonation reactions.
基金Project supported by the National Natural Science Foundation of China （Grant No 10405005）.
文摘The kinetic energy of ions in dielectric barrier discharge plasmas are analysed theoretically using the model of binary collisions between ions and gas molecules. Langevin equation for ions in other gases, Blanc law for ions in mixed gases, and the two-temperature model for ions at higher reduced field are used to determine the ion mobility. The kinetic energies of ions in CH4 ＋ Ar（He） dielectric barrier discharge plasma at a fixed total gas pressure and various Ar （He） concentrations are calculated. It is found that with increasing Ar （He） concentration in CH4 ＋ Ar （He） from 20% to 83%, the CH4＋ kinetic energy increases from 69.6 （43.9） to 92.1 （128.5）eV, while the Ar＋ （He＋） kinetic energy decreases from 97 （145.2） to 78.8 （75.5）eV. The increase of CH4＋ kinetic energy is responsible for the increase of hardness of diamond-like carbon films deposited by CH4 ＋ Ar （He） dielectric barrier discharge without bias voltage over substrates.
基金National Natural Science Foundation of China(No.10405005)
文摘Plasma polymerized fluorocarbon （FC） films have been deposited on silicon substrates from dielectric barrier discharge （DBD） plasma of C4Fs at room temperature under a pressure of 25～125 Pa. The effects of the discharge pressure and frequency of power supply on the films have been systematically investigated. FC films with a less cross linked structure may be formed at a relatively high pressure. Increase in the frequency of power supply leads to a significant increase in the deposition rate. Static contact angle measurements show that deposited FC films have a stable, hydrophobic surface property. All deposited films show smooth surfaces with an atomic surface roughness. The relationship between plasma parameters and the properties of the deposited FC films are discussed.
