Direct ink writing to fabricate porous acetabular cups from titanium alloy

Acetabular cups,which are among themost important implants in total hip arthroplasty,are usually made from titanium alloys with high porosity and adequate mechanical properties.The current three-dimensional(3D)printing approaches to fabricate customized acetabular cups have some inherent disadvantages such as high cost and energy consumption,residual thermal stress,and relatively low efficiency.Thus,in this work,a direct ink writing method was developed to print a cup structure at room temperature,followed by multi-step heat treatment to form microscale porous structure within the acetabular cup.Our method is facilitated by the development of a self-supporting titanium-6 aluminum-4 vanadium(Ti64)ink that is composed of Ti64 particles,bentonite yield-stress additive,ultraviolet curable polymer,and photo-initiator.The effects of Ti64 and bentonite concentrations on the rheological properties and printability of inks were systematically investigated.Moreover,the printing conditions,geometrical limitations,and maximum curing depth were explored.Finally,some complex 3D structures,including lattices with different gap distances,honeycomb with a well-defined shape,and an acetabular cup with uniformly distributed micropores,were successfully printed/fabricated to validate the effectiveness of the proposed method.

A systematic printability study of direct ink writing towards high-resolution rapid manufacturing

Direct ink writing(DIW)holds enormous potential in fabricating multiscale and multi-functional architectures by virtue of its wide range of printable materials,simple operation,and ease of rapid prototyping.Although it is well known that ink rheology and processing parameters have a direct impact on the resolution and shape of the printed objects,the underlying mechanisms of these key factors on the printability and quality of DIW technique remain poorly understood.To tackle this issue,we systematically analyzed the printability and quality through extrusion mechanism modeling and experimental validating.Hybrid non-Newtonian fluid inks were first prepared,and their rheological properties were measured.Then,finite element analysis of the whole DIW process was conducted to reveal the flow dynamics of these inks.The obtained optimal process parameters(ink rheology,applied pressure,printing speed,etc)were also validated by experiments where high-resolution(<100μm)patterns were fabricated rapidly(>70 mm s^(-1)).Finally,as a process research demonstration,we printed a series of microstructures and circuit systems with hybrid inks and silver inks,showing the suitability of the printable process parameters.This study provides a strong quantitative illustration of the use of DIW for the high-speed preparation of high-resolution,high-precision samples.

Direct Ink Writing of Highly Conductive MXene Frames for Tunable Electromagnetic Interference Shielding and Electromagnetic Wave-Induced Thermochromism

The highly integrated and miniaturized next-generation electronic products call for high-performance electromagnetic interference(EMI)shielding materials to assure the normal operation of their closely assembled components.However,the most current techniques are not adequate for the fabrication of shielding materials with programmable structure and controllable shielding efficiency.Herein,we demonstrate the direct ink writing of robust and highly conductive Ti3C2Tx MXene frames with customizable structures by using MXene/AlOOH inks for tunable EMI shielding and electromagnetic wave-induced thermochromism applications.The as-printed frames are reinforced by immersing in AlCl_(3)/HCl solution to remove the electrically insulating AlOOH nanoparticles,as well as cross-link the MXene sheets and fuse the filament interfaces with aluminum ions.After freeze-drying,the resultant robust and porous MXene frames exhibit tunable EMI shielding efficiencies in the range of 25-80 dB with the highest electrical conductivity of 5323 S m−1.Furthermore,an electromagnetic wave-induced thermochromic MXene pattern is assembled by coating and curing with thermochromic polydimethylsiloxane on a printed MXene pattern,and its color can be changed from blue to red under the high-intensity electromagnetic irradiation.This work demonstrates a direct ink printing of customizable EMI frames and patterns for tuning EMI shielding efficiency and visualizing electromagnetic waves.

Direct ink writing of 3D-Honeycombed CL-20 structures with low critical size

3D-Honeycombed CL-20 structures with low critical size of detonation have been fabricated successfully for intelligent weapon systems using a micro-flow direct ink writing(DIW) technology.The CL-20-based explosive ink for DIW technology was prepared by a two-component adhesive system with waterborne polyurethane(WPU) and ethyl cellulose(EC).Not only the preparation of the explosive ink but also the principle of DIW process have been investigated systematically.The explosive ink displayed stro ng shea rthinning behavior that permitted layer-by-laye r deposition from a fine nozzle onto a substrate to produce complex shapes.The EC content was varied to alter the pore structure distribution and rheological behavior of ink samples after curing.The deposited explosive composite materials are of a honeycombed structure with high porosity,and the pore size distribution increases with the increase of EC content.No phase change was observed during the preparation process.Both WPU and EC show good compatibility with CL-20 particles.Apparently high activation energy was realized in the CL-20-based composite ink compared with that of the refined CL-20 due to the presence of non-energetic but stable WPU.The detonation performance of the composite materials can be precisely controlled by an adjustment in the content of binders.The 3D honeyco mbed CL-20 structures,which are fabricated by DIW technology,have a very small critical detonation size of less than 69 μm,as demonstrated by wedge shaped charge test.The ink can be used to create 3D structures with complex geometries not possible with traditional manufacturing techniques,which presents a bright future for the development of intelligent weapon systems.

3D direct writing and micro detonation of CL-20 based explosive ink containing O/W emulsion binder

The booming development of DIW technology present an unprecedented prospect in energetic materials field and has attracted great interest due to its relative simplicity and high flexibility of manufacturing.Herein,a novel CL-20 based explosive ink formulation have been developed successfully for MEMS initiation systems via DIW technology.We designed PVA/GAP into an oil-in-water(O/W)emulsion,in the way that the aqueous solution of PVA as water phase,the ethyl acetate solution of GAP as oil phase,the combination of Tween 80 and SDS as emulsifier,BPS as a curing agent of GAP.The ideal formulation with good shear-thinning rheology properties and clear gel point was prepared using only 10 wt%emulsion.The dual-cured network formed during the curing process made the printed sample have good mechanical properties.The printed samples had satisfactory molding effect without cracks or fractures,the crystal form of CL-20 not changed and the thermal stability have improved.Deposition of explosive inks via DIW in micro-scale grooves had excellent detonation performances,which critical detonation size was 1×0.045 mm,detonation velocity was 7129 m/s and when the corner reaching 150°can still detonated stably.This study may open new avenues for developing binder systems in explosive ink formulations.

Reshapeable,rehealable and recyclable sensor fabricated by direct ink writing of conductive composites based on covalent adaptable network polymers

Covalent adaptable network(CAN)polymers doped with conductive nanoparticles are an ideal candidate to create reshapeable,rehealable,and fully recyclable electronics.On the other hand,3D printing as a deterministic manufacturing method has a significant potential to fabricate electronics with low cost and high design freedom.In this paper,we incorporate a conductive composite consisting of polyimine CAN and multi-wall carbon nanotubes into direct-ink-writing 3D printing to create polymeric sensors with outstanding reshaping,repairing,and recycling capabilities.The developed printable ink exhibits good printability,conductivity,and recyclability.The conductivity of printed polyimine composites is investigated at different temperatures and deformation strain levels.Their shape-reforming and Joule heating-induced interfacial welding effects are demonstrated and characterized.Finally,a temperature sensor is 3D printed with defined patterns of conductive pathways,which can be easily mounted onto 3D surfaces,repaired after damage,and recycled using solvents.The sensing capability of printed sensors is maintained after the repairing and recycling.Overall,the 3D printed reshapeable,rehealable,and recyclable sensors possess complex geometry and extend service life,which assist in the development of polymer-based electronics toward broad and sustainable applications.

Direct ink writing of multifunctional gratings with gel-like MXene/norepinephrine ink for dynamic electromagnetic interference shielding and patterned Joule heating

Intelligent electromagnetic interference(EMI)shielding modulators with a wide tuning range and cyclic stability are urgently needed but their fabrication remains challenging.A gel-like MXene/norepinephrine ink is developed and multifunctional MXene gratings with wide EMI shielding effectiveness(SE)tuning range,superior reversibility,and high mechanical flexibility are constructed by direct ink writing approach for dynamic EMI shielding and patterned Joule heating applications.The modulable MXene/norepinephrine grating with a high conductivity of 3510 S·cm-1 can conveniently realize the seamless modulation of the EMI SE by adjusting the angle between the MXene grating filaments and the electric field of the incident electromagnetic waves,offering highly reversible switching between shielding“On”(28.0 dB)and“Off”(0.5 dB)states.Notably,due to the optimized integration of the MXene ink and the rationally designed pattern,a superior specific EMI SE of 95,688.2 dB·cm^(2)·g^(-1) is achieved in the“On”state.Furthermore,the MXene/norepinephrine ink can be used to fabricate many complex patterned gratings with superior stability,instant responsibility,and superb mechanical flexibility,exhibiting a unique patterned Joule heating behavior.Direct writing of multifunctional gratings paves a means for developing intelligent EMI shielding materials,wearable electronic devices,and advanced thermal management materials.

Enhancing electrolyte ion diffusion via direct ink writing pillar array structure of graphene electrodes for high-performance microsupercapacitors

The graphene-based microsupercapacitors(MSCs)suffer from graphene aggregation issue in electrodes.It reduces the electrolyte ions transportation in the electrodes to degrade the charge storage ability of MSCs,hampering their practical application.Increasing the electrolyte ions transportation in the electrodes can boost the charge storage ability of MSCs.Herein,we design and experimentally realize pillar array structure of graphene electrodes for MSCs by direct ink writing technology.The graphene electrodes with pillar array structure increase the contact area with electrolyte and short the electrolyte ions transport path,facilitating electrolyte ions transport in electrodes.The MSCs exhibit high areal capacitance of 25.67 mF·cm^(−2),high areal energy density of 20.54μWh·cm^(−2),and high power density of 1.45 mW·cm^(−2).One single MSCs can power timer for 10 min and pressure sensor more than 160 min,showing high practical application possibility.This work provides a new avenue for developing high performance MSCs.

基于DIW工艺的ZrO_(2)/PDMS复合陶瓷材料可打印性能研究

针对ZrO_(2)材料应用于手机背板以及其他3C电子产品的需求,以氧化锆作为分散相,PDMS作为连续相,将墨水直写工艺与该复合陶瓷材料的成型制备方法相结合,研究ZrO_(2)/PDMS复合陶瓷材料的可打印性能。在试验研究中,对不同分散相含量的浆料进行流变测试,测试结果表明配制的浆料具有非牛顿流体特性,当ZrO_(2)体积分数在25%~30%时,浆料用于墨水直写打印时较易挤出且成型较好,此时浆料的储能模量在10^5~10^6Pa,临界屈服应力在142~264 Pa。在此基础上,研究了不同配比、针头直径与挤出速度对挤出纤维形貌的影响,结果表明纤维膨胀比与变形比随着分散相含量的增加而减少,随着针头直径与挤出速度的增加而增加;在低分散相含量时更容易达到材料的临界屈服应力,纤维膨胀比和变形比大,纤维表面缺陷少,高分散相含量时材料强度提高,纤维膨胀比和变形比低,但较难挤出,且容易出现熔体破裂现象。当ZrO_(2)体积分数为28%,针头直径为1 mm,挤出速度为6 mm/s时纤维成型质量最优,表明ZrO_(2)/PDMS复合陶瓷材料可用于墨水直写工艺,从而为后续陶瓷构件的制造奠定基础。

陶瓷材料的DIW工艺在陶瓷基金刚石工具中应用的关键技术问题

浆料的直写成形技术(DIW)是一种基于浆料挤出的3D打印技术,其具有能耗低、成本低、打印速度快、无结构设计限制等优点。在概述DIW技术应用于陶瓷基金刚石工具优势的基础上,对其应用过程中的原料选择、浆料制备、打印适性及脱脂、烧结工艺等关键步骤进行探讨,并指出在浆料制备环节中需要重点关注的粉体团聚问题。同时,分析一些DIW制造工艺的研究实例。最后,指出DIW工艺制造陶瓷基金刚石工具应解决的关键问题。

基于DIW的“互锁”型层状钛基复合材料成型及其力学性能

采用浆料直写打印(direct ink writing,DIW)技术对0.8%(体积分数,下同)BNNSs/TC4浆料和TC4浆料进行双材料互嵌打印,构建层间“互锁”界面。结合DIW和快速热压烧结(fast hot pressed sintering,FHPS)技术得到纳米TiB增强的层间“互锁”型致密层状TC4-TiB/TC4复合材料,并对其力学性能进行研究。结果表明:烧结后成功保留了层间“互锁”结构;利用DIW制备的层间“互锁”型层状TC4-TiB/TC4复合材料与未作构型的增强相均匀分布的0.4%TiB/TC4复合材料相比,强度提升了9.1%,达到1206 MPa,但韧性并未下降。分析发现,“互锁”的层间界面使裂纹发生极大的偏转,阻碍裂纹扩展,提升整体材料的韧性,为成型复杂强韧复合材料构件提供了思路。

基于DIW工艺的PDMS+SiC浆料性能研究

本文采用SiC粉、聚二甲基硅氧烷(PDMS)、固化剂为原料制备浆料,研究了SiC含量对浆料黏度、流动性和悬浮稳定性的影响规律;采用气动式墨水直写打印设备,探索SiC含量、挤出压力和喷嘴直径对浆料挤出性能的影响规律。结果表明,随着SiC含量的增加,浆料的黏度逐渐增加、流动性逐渐降低。不同SiC含量的浆料在实验范围内均具有较好的沉降稳定性。增大喷嘴直径以及提高挤出压力均使得浆料挤出量增加。当喷嘴直径为0.33mm时,浆料能够稳定挤出。

直写成型用碳化硅浆料及其流变性能研究

碳化硅(SiC)凭借高强度、轻质性以及耐高温性能等优势已成为时下应用最广泛的陶瓷材料之一。传统的制备方法生产周期长、成本高且难以制造相对复杂结构的陶瓷。本文利用直写成型方法制备三维复杂结构的SiC陶瓷,研究分散剂含量、pH值、固相体积分数和增稠剂等因素对SiC浆料流变性能的影响,制备可打印的SiC浆料并直写成型,获得SiC的三维点阵结构。结果表明:调节分散剂含量能使浆料黏度获得最低值;pH值影响分散剂的解离度进而改变浆料的黏度;固相体积分数越高,打印结构完整性越好;添加甲基纤维素(MC)可增加浆料的黏度和剪切弹性模量,使其可打印。优化的SiC浆料配方为:分散剂聚丙烯酸(PAA)质量分数为0.01%,固相体积分数为63%和MC质量分数为0.04%,pH>10。

喷头流道结构参数对高黏度含能材料直写成型3D打印挤出过程稳定性影响

为了研究直写成型技术(DIW)中挤出系统的喷头流道结构参数(锥角角度、出口直径、成型段长度)对含能材料挤出过程的流体流动影响,研究建立了基于Polyfow Extrusion模块的高黏度含能材料挤出模型,并采用直写成型3D打印工况的挤出实验对其进行了验证。研究通过所建立的模型分析了锥角角度范围90°~130°,出口直径0.75~2 mm以及成型段长度5~20 mm对高黏度含能材料挤出过程的影响。结果表明:采用Polyflow Extrusion模块可以较准确地模拟复合含能材料的流动行为,同时发现锥角为100°、喷头出口直径为1.5~1.75 mm时挤出成型过程相对稳定、挤出膨胀较小,且成型段的增长会在增大所需入口压强的同时减小出口膨胀效应。

基于FSR嵌入的智能泡沫在气动夹爪的应用

如何控制工业夹爪对易损物体的夹持力是一件具有挑战的任务,通常是利用有着力传感器的电动夹爪进行反馈控制,但这种方法昂贵且额外增加了夹爪的复杂程度。基于直书写3D打印,设计了一种内嵌力敏电阻器(FSR)的智能硅橡胶泡沫,安装在气动夹爪的指尖,不仅能监测夹持状态,还能在气压超过阈值后一定范围内,保持夹持力的恒定,以保护物体。实验结果表明:智能泡沫在4~12 N的工作范围内,误差不超过1.5N。当气压在450~560kPa范围内,能维持夹持力约14.6N。

无压烧结工艺对浆料直写式定向多孔铜组织及致密度的影响

管式炉无压烧结工艺对浆料直写(Direct ink writing,DIW)式定向多孔铜的组织和致密性起决定性作用。本工作通过浆料直写和烧结制备定向多孔铜,通过X射线衍射仪(XRD)和扫描电子显微镜(SEM)对比高纯氩气和Ar-H_(2)混合气下烧结后的定向多孔铜的微观组织,分析烧结时定向多孔铜的氧化行为。在不同烧结参数下对定向多孔铜进行烧结处理,研究烧结温度以及保温时间对定向多孔铜致密度的影响规律。结果表明:在高纯氩气下烧结时,定向多孔铜发生严重氧化并生成Cu_(2)O,而Ar-H_(2)混合气通过还原作用有效避免定向多孔铜的氧化;烧结温度1100℃、保温时间6 h为最佳烧结工艺参数,在此条件下,定向多孔铜的致密度达到了87.2%,收缩率为33.3%。本研究可为管式炉无压烧结DIW打印多孔铜提供理论指导。

BC/CS复合水凝胶的3D打印工艺研究

以细菌纤维素(BC)和壳聚糖(CS)为基质的水凝胶同时具有细菌纤维素的高生物相容性和壳聚糖的抗菌性能,在伤口敷料、组织工程等领域获得了广泛的应用,但其3D打印仍面临困难。本文利用BC和CS的物理特性和其交联机制,制备出可用于3D打印的BC/CS复合水凝胶油墨,同时使用纳米粘土作为流变改性剂,提升水凝胶的自支撑能力。对于交联方法,不再采用传统的浸泡方式,使用喷雾器将戊二醛溶液均匀喷洒在打印样品表面,既不会破坏样品的结构,也可以达到交联的目的。接着,构建了一种适合BC/CS复合水凝胶打印的3D打印系统,并在此基础上研究分析了喷头挤出压力、移动速度、打印高度对水凝胶精度的影响。本文提出的方法有望实现BC/CS复合水凝胶的墨水直写(DIW)打印提供指导。

热解温度对直写3D打印石墨烯/SiC_(p)/SiC复合材料性能的影响

通过在碳化硅前驱体聚碳硅烷(PCS)溶液中加入石墨烯/SiC_(p)复合粉末,获得石墨烯/SiC_(p)/PCS浆料,采用直写3D打印(DIW)和高温烧结相结合制备了石墨烯/SiC_(p)/SiC复合材料。PCS在不同热解温度下具有不同的产物与性能,本文研究了热解温度对石墨烯/SiC_(p)/SiC复合材料性能的影响。800℃时PCS转化为非晶SiCxOy,随着温度升高至1500℃,非晶SiCxOy逐渐生成导电性更好的β-SiC与游离碳,石墨烯/SiC_(p)/SiC复合材料的电导率从0.93 S·m^(-1)升高至670 S·m^(-1)。1200℃时,复合材料抗压强度和容积密度分别达到最大的12.3 MPa和1.49 g·cm^(-3)。该研究提供了一种基于PCS浆料的直写3D打印工艺制备高导电轻质多孔石墨烯/SiC_(p)/SiC复合陶瓷的方法。

废旧棉用于直接油墨书写3D打印面料及服装

为实现废旧棉织物的绿色和高值化利用,将废旧棉织物经漂白、活化后再溶解在LiCl/DMAc溶剂中,加入羟乙基纤维素以调节油墨的可打印性。对处理前后的废旧棉织物的外观形貌及内部结构分析,发现处理后废旧棉织物有助于进一步的溶解。对油墨的流变性能研究,发现油墨表现出剪切变薄的行为。通过直接油墨书写3D打印技术成功制备出纤维素面料,改善打印面料的舒适性。讨论3D打印纤维素面料的形貌结构、机械强度和舒适性等。结果表明:与3D打印PLA面料相比,3D打印纤维素面料在柔韧性和润湿性方面都有所改善,其机械强度能满足服用要求,各项性能更接近于棉织物。最后,使用纤维素油墨打印不同花型的面料和服装,扩大纺织材料在3D打印领域的应用。这种新颖方法将废旧棉织物得到再利用,也为3D打印柔性面料和服装带来了广阔的前景。

火工品装药增材制造技术研究现状与发展趋势

增材制造技术是基于数字化加工的新一代先进快速成型技术,因其在火工品装药中能够有效发挥高精度、高安全和自动化连续生产的优势而受到广泛关注。本文介绍了喷墨打印技术、墨水直写技术和基于光固化的墨水打印技术的工作原理和特点,综述了这3种增材制造技术在火工品装药领域的研究现状,分析了相关技术的发展趋势,以期为火工品装药以及武器装备的数智化发展提供参考。