The (DC-GDPAU) is a DC glow discharge plasma experiment that was designed, established, and operated in the Physics Department at Ain Shams University (Egypt). The aim of this experiment is to study and improve some p...The (DC-GDPAU) is a DC glow discharge plasma experiment that was designed, established, and operated in the Physics Department at Ain Shams University (Egypt). The aim of this experiment is to study and improve some properties of a printed circuit board (PCB) by exposing it to the plasma. The device consists of cylindrical discharge chamber with movable parallel circular copper electrodes (cathode and anode) fixed inside it. The distance between them is 12 cm. This plasma experiment works in a low-pressure range (0.15 - 0.70 Torr) for Ar gas with a maximum DC power supply of 200 W. The Paschen curves and electrical plasma parameters (current, volt, power, resistance) characterized to the plasma have been measured and calculated at each cm between the two electrodes. Besides, the electron temperature and ion density are obtained at different radial distances using a double Langmuir probe. The electron temperature (<em>KT<sub>e</sub></em>) was kept stable in range 6.58 to 10.44 eV;whereas the ion density (<em>ni</em>) was in range from 0.91 × 10<sup>10</sup> cm<sup><span style="white-space:nowrap;">−</span>3</sup> to 1.79 × 10<sup>10</sup> cm<sup><span style="white-space:nowrap;">−</span>3</sup>. A digital optical microscope (800×) was employed to draw a comparison between the pre-and after effect of exposure to plasma on the shaping of the circuit layout. The experimental results show that the electrical conductivity increased after plasma exposure, also an improvement in the adhesion force in the Cu foil surface. A significant increase in the conductivity can be directly related to the position of the sample surfaces as well as to the time of exposure. This shows the importance of the obtained results in developing the PCBs manufacturing that uses in different microelectronics devices like those onboard of space vehicles.展开更多
The solid holdup,in a 150 mm-ID×2460 mm-height gas-liquid-solid expanded bed with air,water and glass beads(the diameter of particles is 0.6-0.8 mm)was firstly investigated based on the immersion-type online mult...The solid holdup,in a 150 mm-ID×2460 mm-height gas-liquid-solid expanded bed with air,water and glass beads(the diameter of particles is 0.6-0.8 mm)was firstly investigated based on the immersion-type online multiphase measuring instrument,and bubble behavior was studied via the BVW-2 double electrical conductivity probe.The effect of the superficial gas velocity and liquid velocity on the expanded ratio,the transition ratio,the bubble rising velocity,the gas holdup and the solid holdup was studied.It is discovered that compared with the gas velocity,the liquid velocity has stronger impact on the expanded ratio,but it is opposite for the transition ratio.The average gas holdup and solid holdup increase linearly as the superficial gas velocity goes up.Among it,the gas holdup increases greater in the center,while the solid holdup increases greater near the wall.Compared with it,when the superficial liquid velocity rises,the average gas holdup hardly changes,but the average solid holdup keeps decreasing,especially the solid holdup distributes flatter with the increase of the superficial liquid velocity.展开更多
文摘The (DC-GDPAU) is a DC glow discharge plasma experiment that was designed, established, and operated in the Physics Department at Ain Shams University (Egypt). The aim of this experiment is to study and improve some properties of a printed circuit board (PCB) by exposing it to the plasma. The device consists of cylindrical discharge chamber with movable parallel circular copper electrodes (cathode and anode) fixed inside it. The distance between them is 12 cm. This plasma experiment works in a low-pressure range (0.15 - 0.70 Torr) for Ar gas with a maximum DC power supply of 200 W. The Paschen curves and electrical plasma parameters (current, volt, power, resistance) characterized to the plasma have been measured and calculated at each cm between the two electrodes. Besides, the electron temperature and ion density are obtained at different radial distances using a double Langmuir probe. The electron temperature (<em>KT<sub>e</sub></em>) was kept stable in range 6.58 to 10.44 eV;whereas the ion density (<em>ni</em>) was in range from 0.91 × 10<sup>10</sup> cm<sup><span style="white-space:nowrap;">−</span>3</sup> to 1.79 × 10<sup>10</sup> cm<sup><span style="white-space:nowrap;">−</span>3</sup>. A digital optical microscope (800×) was employed to draw a comparison between the pre-and after effect of exposure to plasma on the shaping of the circuit layout. The experimental results show that the electrical conductivity increased after plasma exposure, also an improvement in the adhesion force in the Cu foil surface. A significant increase in the conductivity can be directly related to the position of the sample surfaces as well as to the time of exposure. This shows the importance of the obtained results in developing the PCBs manufacturing that uses in different microelectronics devices like those onboard of space vehicles.
基金supported by the National Natural Science Foundation of China(Nos.91834303,22008169)the Open Research Fund of State Key Laboratory of Multiphase Complex Systems(No.MPCS-2019-D-11).
文摘The solid holdup,in a 150 mm-ID×2460 mm-height gas-liquid-solid expanded bed with air,water and glass beads(the diameter of particles is 0.6-0.8 mm)was firstly investigated based on the immersion-type online multiphase measuring instrument,and bubble behavior was studied via the BVW-2 double electrical conductivity probe.The effect of the superficial gas velocity and liquid velocity on the expanded ratio,the transition ratio,the bubble rising velocity,the gas holdup and the solid holdup was studied.It is discovered that compared with the gas velocity,the liquid velocity has stronger impact on the expanded ratio,but it is opposite for the transition ratio.The average gas holdup and solid holdup increase linearly as the superficial gas velocity goes up.Among it,the gas holdup increases greater in the center,while the solid holdup increases greater near the wall.Compared with it,when the superficial liquid velocity rises,the average gas holdup hardly changes,but the average solid holdup keeps decreasing,especially the solid holdup distributes flatter with the increase of the superficial liquid velocity.