A novel approach of jet polishing for interior surface of small-grooved components using three developed setups

It is a challenge to polish the interior surface of an additively manufactured component with complex structures and groove sizes less than 1 mm.Traditional polishing methods are disabled to polish the component,meanwhile keeping the structure intact.To overcome this challenge,small-grooved components made of aluminum alloy with sizes less than 1 mm were fabricated by a custom-made printer.A novel approach to multi-phase jet(MPJ)polishing is proposed,utilizing a self-developed polisher that incorporates solid,liquid,and gas phases.In contrast,abrasive air jet(AAJ)polishing is recommended,employing a customized polisher that combines solid and gas phases.After jet polishing,surface roughness(Sa)on the interior surface of grooves decreases from pristine 8.596μm to 0.701μm and 0.336μm via AAJ polishing and MPJ polishing,respectively,and Sa reduces 92%and 96%,correspondingly.Furthermore,a formula defining the relationship between linear energy density and unit defect volume has been developed.The optimized parameters in additive manufacturing are that linear energy density varies from 0.135 J mm^(-1)to 0.22 J mm^(-1).The unit area defect volume achieved via the optimized parameters decreases to 1/12 of that achieved via non-optimized ones.Computational fluid dynamics simulation results reveal that material is removed by shear stress,and the alumina abrasives experience multiple collisions with the defects on the heat pipe groove,resulting in uniform material removal.This is in good agreement with the experimental results.The novel proposed setups,approach,and findings provide new insights into manufacturing complex-structured components,polishing the small-grooved structure,and keeping it unbroken.

Energy beam-based direct and assisted polishing techniques for diamond:A review

Diamond is a highly valuable material with diverse industrial applications,particularly in the fields of semiconductor,optics,and high-power electronics.However,its high hardness and chemical stability make it difficult to realize high-efficiency and ultra-low damage machining of diamond.To address these challenges,several polishing methods have been developed for both single crystal diamond(SCD)and polycrystalline diamond(PCD),including mechanical,chemical,laser,and ion beam processing methods.In this review,the characteristics and application scope of various polishing technologies for SCD and PCD are highlighted.Specifically,various energy beam-based direct and assisted polishing technologies,such as laser polishing,ion beam polishing,plasma-assisted polishing,and laser-assisted polishing,are summarized.The current research progress,material removal mechanism,and infuencing factors of each polishing technology are analyzed.Although some of these methods can achieve high material removal rates or reduce surface roughness,no single method can meet all the requirements.Finally,the future development prospects and application directions of different polishing technologies are presented.

Stress-Induced Deformation of Thin Copper Substrate in Double-Sided Lapping

Double-sided lapping is an precision machining method capable of obtaining high-precision surface.However,during the lapping process of thin pure copper substrate,the workpiece will be warped due to the influence of residual stress,including the machining stress and initial residual stress,which will deteriorate the flatness of the workpiece and ultimately affect the performance of components.In this study,finite element method(FEM)was adopted to study the effect of residual stress-related on the deformation of pure copper substrate during double-sided lapping.Considering the initial residual stress of the workpiece,the stress caused by the lapping and their distribution characteristics,a prediction model was proposed for simulating workpiece machining deformation in lapping process by measuring the material removal rate of the upper and lower surfaces of the workpiece under the corresponding parameters.The results showed that the primary cause of the warping deformation of the workpiece in the doublesided lapping is the redistribution of initial residual stress caused by uneven material removal on the both surfaces.The finite element simulation results were in good agreement with the experimental results.

An Uncertainty Analysis of Downward Pressure Applied to the Wafer Based on a Flexible Airbag by a Double Side Polishing Machine

The process of wafer polishing is known to be highly demanding,and even small deviations in the processing parameters can have a significant impact on the quality of the wafers obtained.During the process of wafer polishing,maintaining a constant pressure value applied by the polishing head is essential to achieve the desired flatness of the wafer.The accuracy of the downward pressure output by the polishing head is a crucial factor in producing flat wafers.In this paper,the uncertainty component of downward pressure is calculated and its measurement uncertainty is evaluated,and a method for calculating downward pressure uncertainty traceable to international basic unit is established.Therefore,the reliability of double side polishing machine has been significantly improved.

Pingyao Hand-Polished Lacquerware

PINGYAO hand-polished lacquerware has been widely considered as one of the four most famed lacquerware types in China.It originated more than 2,000 years ago in what is called Pingyao County today,in Jinzhong City,central China’s Shanxi Province.Its fame is due to the exquisite and unique skill of polishing lacquered coating with bare hands during the manufacturing process.This quaint and durable lacquerware boasts both aesthetic and practical values,and is characterized by its distinguished appearance and glossy sheen.It comes in the forms of jewelry boxes,utensils and stationery,screens and furniture.

Effects Optimization of Bio-Polishing Industrial Process Parameters

The purpose of this study is to select an appropriate commercial neutral cellulase enzyme for denim garments bio-polishing to achieve specific industrial goals. A full factorial experimental design was used to evaluate the effect of factors considered in the optimization of the bio-polishing process (fabric ID: x1, treatment time: x2, treatment temperature: x3, enzyme concentration: x4, storage time: x5, inactivation step: x6 and enzyme type: x7). Experiments were conducted using laboratory washing machine. Subjective evaluation was performed at a pilot and at an industrial scale. Tear, tensile strength and subjective evaluation concerning hand feel, fabric color, indigo dye pocket back staining and fuzziness extent were evaluated. Results showed that x6 and x7 had significant effects on the fabric tear and tensile strength loss. In the optimization, the great dependence between observed and predicted tear strength and tensile strength loss, the correlation coefficient of the models (R2 > 0.85) and the important value of F-ratio proved the validity of the models. Results showed that denim leg panels treated with the enzyme Lava-Cell NSZ presented a minimum loss of tear and tensile strength. A low-temperature and time enzymatic bio-polishing process was developed at industrial scale.

Composite Adaptive Control of Belt Polishing Force for Aero-engine Blade

The existing methods for blade polishing mainly focus on robot polishing and manual grinding.Due to the difficulty in high-precision control of the polishing force,the blade surface precision is very low in robot polishing,in particular,quality of the inlet and exhaust edges can not satisfy the processing requirements.Manual grinding has low efficiency,high labor intensity and unstable processing quality,moreover,the polished surface is vulnerable to burn,and the surface precision and integrity are difficult to ensure.In order to further improve the profile accuracy and surface quality,a pneumatic flexible polishing force-exerting mechanism is designed and a dual-mode switching composite adaptive control(DSCAC) strategy is proposed,which combines Bang-Bang control and model reference adaptive control based on fuzzy neural network(MRACFNN) together.By the mode decision-making mechanism,Bang-Bang control is used to track the control command signal quickly when the actual polishing force is far away from the target value,and MRACFNN is utilized in smaller error ranges to improve the system robustness and control precision.Based on the mathematical model of the force-exerting mechanism,simulation analysis is implemented on DSCAC.Simulation results show that the output polishing force can better track the given signal.Finally,the blade polishing experiments are carried out on the designed polishing equipment.Experimental results show that DSCAC can effectively mitigate the influence of gas compressibility,valve dead-time effect,valve nonlinear flow,cylinder friction,measurement noise and other interference on the control precision of polishing force,which has high control precision,strong robustness,strong anti-interference ability and other advantages compared with MRACFNN.The proposed research achieves high-precision control of the polishing force,effectively improves the blade machining precision and surface consistency,and significantly reduces the surface roughness.

Chemical Mechanical Polishing of Glass Substrate with α-Alumina-g-Polystyrene Sulfonic Acid Composite Abrasive

Abrasive is the one of key influencing factors during chemical mechanical polishing（CMP） process. Currently, α-Alumina （α-Al2O3） particle, as a kind of abrasive, has been widely used in CMP slurries, but their high hardness and poor dispersion stability often lead to more surface defects. After being polished with composite particles, the surface defects of work pieces decrease obviously. So the composite particles as abrasives in slurry have been paid more attention. In order to reduce defect caused by pure α-Al2O3 abrasive, α-alumina-g-polystyrene sulfonic acid （α-Al2O3-g-PSS） composite abrasive was prepared by surface graft polymerization. The composition, structure and morphology of the product were characterized by Fourier transform infrared spectroscopy（FTIR）, X-ray photoelectron spectroscopy（XPS）, time-of-flight secondary ion mass spectroscopy（TOF-SIMS）, and scanning electron microscopy（SEM）, respectively. The results show that polystyrene sulfonic acid grafts onto α-Al2O3, and has well dispersibility. Then, the chemical mechanical polishing performances of the composite abrasive on glass substrate were investigated with a SPEEDFAM-16B-4M CMP machine. Atomic force microscopy（AFM） images indicate that the average roughness of the polished glass substrate surface can be decreased from 0.835 nm for pure α-Al2O3 abrasive to 0.583 nm for prepared α-Al2O3-g-PSS core-shell abrasive. The research provides a new and effect way to improve the surface qualities during CMP.

Computer Controlled Polishing of the Off-axis Aspheric Mirrors

In this paper, the manufacturing and testing procedures to make large off-axis aspherical mirrors are presented. The difficulties in polishing and testing for both circular aperture and rectangular aperture mirrors are previewed, and a possible solution is given. The two mirrors have been polished by means of CCOS, and the final accuracy is 25nm rms for 770mm×210mm rectangular mirror and 20nm rms for φ600mm circular mirror. These results just meet the optical tolerances specified by the designer, and the manufacturing and testing procedures presented here show good ability to make the large off-axis aspherical mirrors.

Research on Abrasives in the Chemical Mechanical Polishing Process for Silicon Nitride Balls

Silicon nitride (Si 3N 4) has been the main material for balls in ceramic ball bearings, for its lower density, high strength, high hardness, fine thermal stability and anticorrosive, and is widely used in various fields, such as high speed and high temperature areojet engines, precision machine tools and chemical engineer machines. Silicon nitride ceramics is a kind of brittle and hard material that is difficult to machining. In the traditional finishing process of silicon nitride balls, balls are lapped by expensive diamond abrasive. The machining is inefficiency and the cost is high, but also lots of pits, scratch subsurface micro crazes and dislocations will be caused on the surface of the balls, the performance of the ball bearings would be declined seriously. In these year, a kind of new technology known as chemical mechanical polishing is introduced in the ultraprecision machining process of ceramic balls. In this technology, abrasives such as ZrO 2, CeO 2 whose hardness is close to or lower than the work material (Si 3N 4) are used to polishing the balls. In special slurry, these abrasives can chemo-mechanically react with the work material and environment (air or water) to generate softer material (SiO 2). And the resultants will be removed easily at 0.1 nm level. So the surface defects can be minimized, very smooth surface (Ra=4 nm) and fine sphericity (0.15～0.25 μm ) can be obtained, and the machining efficiency is also improved. The action mechanism of the abrasives in the chemical mechanical polishing process in finishing of silicon nitride ball will be introduced in this paper.

Effects of Polishing on Proximate Composition,Physico-Chemical Characteristics,Mineral Composition and Antioxidant Properties of Pigmented Rice

The effects of polishing on proximate compositions,physico-chemical characteristics,mineral compositions and antioxidant properties of the rice flours obtained from three different pigmented rice varieties(Chak-hao Angangba,Chak-hao Amubi and Chak-hao Poireiton) were investigated.The rice varieties were significantly(P < 0.05) different in the contents of the test characteristics.Lipids,ash,minerals,phytochemicals(phenolic acids and flavonoids) and 2,2-diphenyl-1-picrylhydrazyl(DPPH) activity of rice flours were decreased after polishing(9% degree of milling),while amylose content and lightness were increased.X-ray diffraction pattern of rice flours exhibited A-type crystalline pattern with reflections at 15.1o,17.1o,18.2o and 23.0o.Pasting properties and transition temperatures were decreased after polishing treatment.Polishing resulted in changes in the crystallinity,enthalpy and morphology of rice flours.

Parameters Optimization of a Novel 5-DOF Gasbag Polishing Machine Tool

The research on the parameters optimization for gasbag polishing machine tools, mainly aims at a better kinematics performance and a design scheme. Serial structural arm is mostly employed in gasbag polishing machine tools at present, but it is disadvantaged by its complexity, big inertia, and so on. In the multi-objective parameters optimization, it is very difficult to select good parameters to achieve excellent performance of the mechanism. In this paper, a statistics parameters optimization method based on index atlases is presented for a novel 5-DOF gasbag polishing machine tool. In the position analyses, the structure and workspace for a novel 5-DOF gasbag polishing machine tool is developed, where the gasbag polishing machine tool is advantaged by its simple structure, lower inertia and bigger workspace. In the kinematics analyses, several kinematics performance evaluation indices of the machine tool are proposed and discussed, and the global kinematics performance evaluation atlases are given. In the parameters optimization process, considering the assembly technique, a design scheme of the 5-DOF gasbag polishing machine tool is given to own better kinematics performance based on the proposed statistics parameters optimization method, and the global linear isotropic performance index is 0.5, the global rotational isotropic performance index is 0.5, the global linear velocity transmission performance index is 1.012 3 m/s in the case of unit input matrix, the global rotational velocity transmission performance index is 0.102 7 rad/s in the case of unit input matrix, and the workspace volume is 1. The proposed research provides the basis for applications of the novel 5-DOF gasbag polishing machine tool, which can be applied to the modern industrial fields requiring machines with lower inertia, better kinematics transmission performance and better technological efficiency.

Surface Polishing of 6H-SiC Substrates

The surface polishing for silicon carbide （SIC） substrates was investigated and results were presented for mechanical polishing （MP） and chemo-mechanical polishing （CMP）. High quality surfaces were obtained after CMP with colloidal silica. The removal mechanism of scratches in MP and detailed physical and chemical process during CMP were analyzed. The effects of MP and CMP on the surface roughness were assessed by optical microscopy （OM）, atomic force microscopy （AFM） and step profilometry. KOH etching and high resolution X-ray diffractometry （H RXRD） were applied to evaluate the subsurface damage of 6H-SiC substrates.

Numerical Analysis of Nd:YAG Pulsed Laser Polishing CVD Self-standing Diamond Film

Chemical vapor deposited （CVD） diamond film has broad application foreground in high-tech fields. But polycrystalline CVD self-standing diamond thick film has rough surface and non-uniform thickness that adversely affect its extensive applications. Laser polishing is a useful method to smooth self-standing diamond film. At present, attentions have been focused on experimental research on laser polishing, but the revealing of theoretical model and the forecast of polishing process are vacant. The paper presents a finite element model to simulate and analyze the mechanism of laser polishing diamond based on laser thermal conduction theory. The experimental investigation is also carried out on Nd：YAG pulsed laser smoothing diamond thick film. The simulation results have good accordance with the results of experimental results. The temperature and thermal stress fields are investigated at different incidence angles and parameters of Nd：YAG pulsed laser. The pyramidal-like roughness of diamond thick film leads to the non-homogeneous temperature fields. The temperature at the peak of diamond film is much higher than that in the valley, which leads to the smoothing of diamond thick film. The effect of laser parameters on the surface roughness and thickness of graphite transition layer is also carried out. The results show that high power density laser makes the diamond surface rapid heating, evaporation and sublimation after its graphitization. It is also found that the good polish quality of diamond thick film can be obtained by a combination of large incident angle, moderate laser pulsed energy, large repetition rate and moderate laser pulse width. The results obtained here provide the theoretical basis for laser polishing diamond film with high efficiency and high quality.

Material Removal Model Considering Influence of Curvature Radius in Bonnet Polishing Convex Surface

The bonnet tool polishing is a novel, advanced and ultra-precise polishing process, by which the freeform surface can be polished. However, during the past few years, not only the key technology of calculating the dwell time and controlling the surface form in the bonnet polishing has been little reported so far, but also little attention has been paid to research the material removal function of the convex surface based on the geometry model considering the influence of the curvature radius. Firstly in this paper, for realizing the control of the freeform surface automatically by the bonnet polishing, on the basis of the simplified geometric model of convex surface, the calculation expression of the polishing contact spot on the convex surface considering the influence of the curvature radius is deduced, and the calculation model of the pressure distribution considering the influence of the curvature radius on the convex surface is derived by the coordinate transformation. Then the velocity distribution model is built in the bonnet polishing the convex surface. On the basis of the above research and the semi-experimental modified Preston equation obtained from the combination method of experimental and theoretical derivation, the material removal model of the convex surface considering the influence of the curvature radius in the bonnet polishing is established. Finally, the validity of the model through the simulation method has been validated. This research presents an effective prediction model and the calculation method of material removal for convex surface in bonnet polishing and prepares for the bonnet polishing the free surface numerically and automatically.

Surface Roughness and Roundness of Bearing Raceway Machined by Floating Abrasive Polishing and Their Effects on Bearing's Running Noise

As the two most important indexes of bearing raceway, surface roughness and roundness have significant influence on bearing noise. Some researchers have carried out studies in this field, however, reason and extent of the influence of raceway surface geometric characteristics on bearing running noise are not perfectly clear up to now. In this paper, the raceway of 6309 type bearing＇s inner and outer ring is machined by floating abrasive polishing adopting soft abrasive pad. Surface roughness parameters, arithmetical mean deviation of the profile Ra, the point height of irregularities Rz, maximum height of the profile Rmax and roundness fof raceways, are measured before and after machining, and the change rules of the measured results are studied. The study results show that the floating abrasive polishing can reduce the surface geometric errors of bearing raceway evidently. The roundness error is reduced by 25%, Rm^x value is reduced by 35.5%, Rz value is reduced by 22% and Ra value is reduced by 5%. By analyzing the change of the geometrical parameters and the shape difference of the raceway before and after machining, it is found that the floating abrasive polishing method can affect the roundness error mainly by modifying the local deviation of the raceway＇s surface profile. Bearings with different raceway surface geometrical parameter value are assembled and the running noise is tested. The test results show that Ra has a little, Rmax and Rz have a measurable, and the roundness error has a significant influence on the running noise. From the viewpoint of controlling bearings＇ running noise, raceway roundness error should be strictly controlled, and for the surface roughness parameters, R,n^x and Rz should be mainly controlled. This paper proposes an effective method to obtain the low noise bearing by machining the raceway with floating abrasive polishing after super finishing.

Damage mechanisms during lapping and mechanical polishing CdZnTe wafers

CdZnTe wafers were machined by lapping and mechanical polishing processes,and their surface and subsurface damages were investigated.The surface damages are mainly induced by three-body abrasive wear and embedded abrasive wear during lapping process.A new damage type,which is induced by the indentation of embedded abrasives,is found in the subsurface.When a floss pad is used to replace the lapping plate during machining,the surface damage is mainly induced by two-body abrasive and three-body abrasive wear,and the effect of embedded abrasives on the surface is greatly weakened.Moreover,this new damage type nearly disappears on the subsurface.

Effect of Roasting Conditions of Rich Cerium Rare Earth Carbonate on Crystallite Morphology and Polishing Ability of Ceria-Based Rare Earth Oxide

The granule shape and crystal structure of the the ceria-based rare earth oxide which were roasted at 600～1050 ℃ for 2～6 h and then cooled in furnace, cooled out of furnace or cooled in water were studied by means of XRD and SEM. The results revealed that the rich cerium rare earth carbonate could be changed into the rare earth oxide which was a kind of sandwich made of globose granule whose diameter was between 0.5～3.0 μm after being roasted in 900 ℃ for 2 h. This kind of crystal lattice in rare earth oxide belonged to face-centered cubic lattice and its space between crystal surface {111} and {200} (viz. L111 and L200) would enlarge as the roasting temperature increasing. With increasing roasting temperature, L111 would rise straightly upward, and L200 would rise straightly upward when roasting time was 2～4 h but changed little when roasting time was 4～6 h. The glass-polishing experiments found that the polishing ability of the ceria-based rare earth oxide was the best as L111 was 43～53 nm and the L200 was 43～56 nm.

An Investigation on a Tin Fixed Abrasive Polishing Pad with Phyllotactic Pattern for Polishing Wafer

In order to improve the polishing ability of polishing pads, a kind of polishing pad with the tin fixed abrasive blocks, which are arranged based on the phyllotaxis theory of biology, was designed and fabricated by the use of electroplating technology, and also its polishing ability for JGS-2 wafer was investigated by polishing experiments. The research results show that the phyllotactic parameters of the polishing pad influence the arrangement density of the tin fixed abrasive blocks, the polishing pad with phyllotactic pattern is feasibly fabricated by the use of electroplating technology, and the good polishing result can be obtained by using the polishing pad with phyllotactic pattern to polish a wafer when the diameter D of the tin fixed abrasive block is between Φ1.3 mm and Φ1.4 mm, and the phyllotactic coefficient k between 1.0 and 1.1,respectively.

Preparation of Non-spherical Colloidal Silica Nanoparticle and Its Application on Chemical Mechanical Polishing of Sapphire

Non-spherical colloidal silica nanoparticle was prepared by a simple new method, and its particle size distribution and shape morphology were characterized by dynamic light scattering(DLS) and the Focus Ion Beam(FIB) system. This kind of novel colloidal silica particles can be well used in chemical mechanical polishing(CMP) of sapphire wafer surface. And the polishing test proves that non-spherical colloidal silica slurry shows much higher material removal rate(MRR) with higher coefficient of friction(COF) when compared to traditional large spherical colloidal silica slurry with particle size 80 nm by DLS. Besides, sapphire wafer polished by non-spherical abrasive also has a good surface roughness of 0.460 6 nm. Therefore, non-spherical colloidal silica has shown great potential in the CMP field because of its higher MRR and better surface roughness.