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Comparative analysis on homogeneity of Pb and Cd in epoxy molding compounds
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作者 Kyun-Gmee LEE Yong-Keun SON +2 位作者 Jin-Sook LEE Tai-Min NOH Hee-Soo LEE 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2011年第A01期160-164,共5页
Reference materials for quantitative determination of regulated heavy metals, such as Pb and Cd in electronic components, were designed and investigated in terms of stability and homogeneity. Reference materials with ... Reference materials for quantitative determination of regulated heavy metals, such as Pb and Cd in electronic components, were designed and investigated in terms of stability and homogeneity. Reference materials with two concentration levels of heavy metals were prepared by spiking Pb and Cd compounds to epoxy molding compounds made by mixing silica powders and epoxy resin. The concentration changes of the reference materials during stability test for 1 a were not observed. In the homogeneity assessment, the as-prepared reference materials were studied by using three different analytical tools, inductively coupled plasma atomic emission spectrometry (ICP-AES), X-ray fluoroescence spectrometry (XRF) and laser ablation ICP mass. The results show different homogeneities by the characteristics of analytical tools and the materials. 展开更多
关键词 epoxy molding compound PB CD reference materials HOMOGENEITY
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High-g Impact Resistance for Epoxy Molding Compound
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作者 靳鸿 《Journal of Wuhan University of Technology(Materials Science)》 SCIE EI CAS 2010年第4期588-591,共4页
The behavior of resistance high-g impact of EMC (epoxy molding compound) with two package models, small outline package (POS) and Globtop, was evaluated by experimental method used Hopkinson bar. At 120,000 g (ge... The behavior of resistance high-g impact of EMC (epoxy molding compound) with two package models, small outline package (POS) and Globtop, was evaluated by experimental method used Hopkinson bar. At 120,000 g (generated in the Hopkinson bar with widths about 70 μs) no damage in either the POS devices or the Globtop devices was observed. In order to enhance the EMC's ability of resistance high-g impact, buffering effect of epoxy resin was also studied. The experimental results above all show that EMC has a better performance of impact resistance at about 120,000 g, and epoxy resin can absorb the stress wave to have the protected ability. The study of this paper could serve as a basis for selection packaging materials and enhance its reliability in high-g impact environment. 展开更多
关键词 epoxy molding compound (EMC) RELIABILITY high-g impact hopkinson bar
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