The behavior of resistance high-g impact of EMC （epoxy molding compound） with two package models, small outline package （POS） and Globtop, was evaluated by experimental method used Hopkinson bar. At 120,000 g （ge...The behavior of resistance high-g impact of EMC （epoxy molding compound） with two package models, small outline package （POS） and Globtop, was evaluated by experimental method used Hopkinson bar. At 120,000 g （generated in the Hopkinson bar with widths about 70 μs） no damage in either the POS devices or the Globtop devices was observed. In order to enhance the EMC＇s ability of resistance high-g impact, buffering effect of epoxy resin was also studied. The experimental results above all show that EMC has a better performance of impact resistance at about 120,000 g, and epoxy resin can absorb the stress wave to have the protected ability. The study of this paper could serve as a basis for selection packaging materials and enhance its reliability in high-g impact environment.展开更多
Reference materials for quantitative determination of regulated heavy metals, such as Pb and Cd in electronic components, were designed and investigated in terms of stability and homogeneity. Reference materials with ...Reference materials for quantitative determination of regulated heavy metals, such as Pb and Cd in electronic components, were designed and investigated in terms of stability and homogeneity. Reference materials with two concentration levels of heavy metals were prepared by spiking Pb and Cd compounds to epoxy molding compounds made by mixing silica powders and epoxy resin. The concentration changes of the reference materials during stability test for 1 a were not observed. In the homogeneity assessment, the as-prepared reference materials were studied by using three different analytical tools, inductively coupled plasma atomic emission spectrometry (ICP-AES), X-ray fluoroescence spectrometry (XRF) and laser ablation ICP mass. The results show different homogeneities by the characteristics of analytical tools and the materials.展开更多
以硅烷偶联剂KH-560改性后的废环氧模塑料(EMC)粉末为填料,通过与聚丙烯(PP)熔融共混、模压成型,制备废EMC/PP复合材料。红外光谱和X射线衍射图谱表明,改性反应中KH-560与废EMC粉末之间相互作用明显,且经过改性得到的废EMC粉末与原粉末...以硅烷偶联剂KH-560改性后的废环氧模塑料(EMC)粉末为填料,通过与聚丙烯(PP)熔融共混、模压成型,制备废EMC/PP复合材料。红外光谱和X射线衍射图谱表明,改性反应中KH-560与废EMC粉末之间相互作用明显,且经过改性得到的废EMC粉末与原粉末相比,物相结构没有显著的变化。研究了改性前后,不同改性剂比例、不同废EMC粉末含量对复合材料力学性能的影响。结果表明,改性剂体积为20 m L时,填料为30%改性废EMC粉末的复合材料的拉伸强度和冲击强度最好。其中与添加未改性废EMC粉末的复合材料相比,其拉伸强度增加13. 3%。说明改性反应明显提高了废EMC粉末与PP之间的相容性,改性后的废EMC粉末有利于复合材料强度提升。改性前后的复合材料表面电阻率和体积电阻率没有明显变化,具有一定的防静电性。展开更多
基金Funded by the State Key Laboratory Foundation of China (No.9140C120704060C12)the Science and Technology Development Project of Universiti-esin of Shanxi Province
文摘The behavior of resistance high-g impact of EMC （epoxy molding compound） with two package models, small outline package （POS） and Globtop, was evaluated by experimental method used Hopkinson bar. At 120,000 g （generated in the Hopkinson bar with widths about 70 μs） no damage in either the POS devices or the Globtop devices was observed. In order to enhance the EMC＇s ability of resistance high-g impact, buffering effect of epoxy resin was also studied. The experimental results above all show that EMC has a better performance of impact resistance at about 120,000 g, and epoxy resin can absorb the stress wave to have the protected ability. The study of this paper could serve as a basis for selection packaging materials and enhance its reliability in high-g impact environment.
基金Project(2010-0008-276) supported by NCRC (National Core Research Center) program through the National Research Foundation of Korea funded by the Ministry of Education, Science and Technology
文摘Reference materials for quantitative determination of regulated heavy metals, such as Pb and Cd in electronic components, were designed and investigated in terms of stability and homogeneity. Reference materials with two concentration levels of heavy metals were prepared by spiking Pb and Cd compounds to epoxy molding compounds made by mixing silica powders and epoxy resin. The concentration changes of the reference materials during stability test for 1 a were not observed. In the homogeneity assessment, the as-prepared reference materials were studied by using three different analytical tools, inductively coupled plasma atomic emission spectrometry (ICP-AES), X-ray fluoroescence spectrometry (XRF) and laser ablation ICP mass. The results show different homogeneities by the characteristics of analytical tools and the materials.
文摘以硅烷偶联剂KH-560改性后的废环氧模塑料(EMC)粉末为填料,通过与聚丙烯(PP)熔融共混、模压成型,制备废EMC/PP复合材料。红外光谱和X射线衍射图谱表明,改性反应中KH-560与废EMC粉末之间相互作用明显,且经过改性得到的废EMC粉末与原粉末相比,物相结构没有显著的变化。研究了改性前后,不同改性剂比例、不同废EMC粉末含量对复合材料力学性能的影响。结果表明,改性剂体积为20 m L时,填料为30%改性废EMC粉末的复合材料的拉伸强度和冲击强度最好。其中与添加未改性废EMC粉末的复合材料相比,其拉伸强度增加13. 3%。说明改性反应明显提高了废EMC粉末与PP之间的相容性,改性后的废EMC粉末有利于复合材料强度提升。改性前后的复合材料表面电阻率和体积电阻率没有明显变化,具有一定的防静电性。
