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Equivalent Impedance Parameter Calculation of Three-phase Symmetrical Loads for Harmonic Source Location
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作者 Yi Zhang Bijie Liu +2 位作者 Caihua Lin Zhenguo Shao Yuncong Xu 《Journal of Modern Power Systems and Clean Energy》 SCIE EI CSCD 2024年第1期251-260,共10页
The equivalent impedance parameters of loads have been widely used to identify and locate the harmonic sources.However,the existing calculation methods suffer from outliers caused by the zero-crossing of the denominat... The equivalent impedance parameters of loads have been widely used to identify and locate the harmonic sources.However,the existing calculation methods suffer from outliers caused by the zero-crossing of the denominator.These outliers can result in inaccuracy and unreliability of harmonic source location.To address this issue,this paper proposes an innovative method of equivalent impedance parameter calculation of three-phase symmetrical loads that avoid outliers.The correctness and effectiveness of the proposed method are verified by simulations on Simulink using actual monitoring data.The results show that the proposed method is not only simple and easy to implement but also highly accurate. 展开更多
关键词 abc-αβtransformation equivalent impedance parameters of load harmonic source location nonlinear load power quality
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COMPACT FOUR-COMPONENT 2-D FDFD METHOD WITH EQUIVALENT SURFACE IMPEDANCE BOUNDARY CONDITION FOR MULTILAYER METAL-COATED WAVEGUIDE 被引量:1
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作者 赵伟 赵永久 +2 位作者 邓宏伟 姜万顺 宁曰民 《Transactions of Nanjing University of Aeronautics and Astronautics》 EI 2010年第3期275-279,共5页
A compact four-component two-dimensional (2-D) finite-difference frequency domain (FDFD) method with the equivalent surface impedance boundary condition is used to analyze the dispersion characteristics of multila... A compact four-component two-dimensional (2-D) finite-difference frequency domain (FDFD) method with the equivalent surface impedance boundary condition is used to analyze the dispersion characteristics of multilayer metal-coated waveguides. According to the equivalent surface impedance boundary condition,the relationship between transverse field components on the boundary can be easily depicted. Once the eigen equation is solved,the propagation constant can be obtained as the eigen value for a given frequency. Results of the proposed method agaree well with those of high frequency structure simulator(HFSS). 展开更多
关键词 WAVEGUIDES eigen equation equivalent surface impedance boundary condition propagation constant
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Hybrid Multi-Infeed Interaction Factor Calculation Method Considering Voltage Regulation Control Characteristics of Voltage Source Converter
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作者 Shan Liu Chengbin Chi +3 位作者 Fengze Han Yanan Wu Lin Zhu Tuo Wang 《Energy Engineering》 EI 2024年第8期2257-2273,共17页
Voltage source converter based high voltage direct current(VSC-HVDC)can participate in voltage regulation by flexible control to help maintain the voltage stability of the power grid.In order to quantitatively evaluat... Voltage source converter based high voltage direct current(VSC-HVDC)can participate in voltage regulation by flexible control to help maintain the voltage stability of the power grid.In order to quantitatively evaluate its influence on the voltage interaction between VSC-HVDC and line commutated converter based high voltage direct current(LCC-HVDC),this paper proposes a hybrid multi-infeed interaction factor(HMIIF)calculation method considering the voltage regulation control characteristics of VSC-HVDC.Firstly,for a hybrid multi-infeed high voltage direct current system,an additional equivalent operating admittance matrix is constructed to characterize HVDC equipment characteristics under small disturbance.Secondly,based on the characteristic curve between the reactive power and the voltage of a certain VSC-HVDC project,the additional equivalent operating admittance of VSC-HVDC is derived.The additional equivalent operating admittance matrix calculation method is proposed.Thirdly,the equivalent bus impedance matrix is obtained by modifying the alternating current(AC)system admittance matrix with the additional equivalent operating admittance matrix.On this basis,the HMIIF calculation method based on the equivalent bus impedance ratio is proposed.Finally,the effectiveness of the proposed method is verified in a hybrid dual-infeed high voltage direct current system constructed in Power Systems Computer Aided Design(PSCAD),and the influence of voltage regulation control on HMIIF is analyzed. 展开更多
关键词 Hybrid multi-infeed high voltage direct current system hybrid multi-infeed interaction factor control modes equivalent node impedance ratio voltage interaction characteristics
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The Equivalent Parameters for the Narrow Series Slot on a Sectoral Waveguide
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作者 Lu Shanwei, Zhuang Yan & Gao Wenjun ( Dept. of Elect. Eng., Beijing University of Aeronautics and Astronautics, 100083, P. R. China ) 《Journal of Systems Engineering and Electronics》 SCIE EI CSCD 1997年第1期39-45,共7页
The exact and approximate expressions for the field components of the TE modes in a sectoral waveguide are presented. Using the equivalence principle, the electric field distribution on the aperture surfaces of a narr... The exact and approximate expressions for the field components of the TE modes in a sectoral waveguide are presented. Using the equivalence principle, the electric field distribution on the aperture surfaces of a narrow transverse slot cut in the curved broad wall of a sectoral waveguide is solved by the moment method (Galerkin's method). lmportant results such as the scattering parameter, the normalized equivalent series impedance, the resonant resistance and resonant length are studied. 展开更多
关键词 equivalent series impedance Sectoral waveguide Moment method.
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4-component 2-D CFDFD method in analysis of lossy circular waveguide with fractal rough surface
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作者 邓宏伟 赵永久 +2 位作者 刘冰 姜万顺 宁曰民 《Journal of Shanghai University(English Edition)》 CAS 2011年第3期185-189,共5页
In this paper, equivalent surface impedance boundary condition (ESIBC), which takes fractal parameters (D, G) into SIBC, is implemented in the 4-component 2-D compact finite difference frequency domain (2-D CFDFD... In this paper, equivalent surface impedance boundary condition (ESIBC), which takes fractal parameters (D, G) into SIBC, is implemented in the 4-component 2-D compact finite difference frequency domain (2-D CFDFD) method to an- alyze the propagation characteristics of lossy circular waveguide with fractal rough surface based on Weierstrass-Mandelbrot (W-M) function. Fractal parameters’ effects on attenuation constant are presented in the 3 mm lossy circular waveguide, and the attenuation constants of the first three modes vary monotonically with scaling constant (G) and decrease as the fractal dimension (D) increasing. 展开更多
关键词 FRACTAL ROUGHNESS 2-D compact fimte difference frequency domain (2-D CFDFD) equivalent surface impedance boundary condition (ESIBC) attenuation constant
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Analysis and optimization of TSV–TSV coupling in three-dimensional integrated circuits 被引量:1
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作者 赵颖博 董刚 杨银堂 《Journal of Semiconductors》 EI CAS CSCD 2015年第4期172-179,共8页
Through silicon via (TSV)-TSV coupling is detrimental to the performance of three-dimensional (3D) integrated circuits (ICs) with the major negative effect of introducing coupling noise. In order to obtain an ac... Through silicon via (TSV)-TSV coupling is detrimental to the performance of three-dimensional (3D) integrated circuits (ICs) with the major negative effect of introducing coupling noise. In order to obtain an accurate estimation of the coupling level from TSV-TSV in the early design stage, this paper first proposes an impedance- level model of the coupling channel between TSVs based on a two-port network, and then derives the formula of the coupling coefficient to describe the TSV-TSV coupling effect. The accuracy of the formula is validated by comparing the results with 3D full-wave simulations. Furthermore, a design technique for optimizing the coupling between adjacent coupled signal TSVs is proposed. Through SPICE simulations, the proposed technique shows its feasibility to reduce the coupling noise for both a simple TSV-TSV circuit and a complicated circuit with more TSVs, and demonstrates its potential for designers in achieving the goal of improving the electrical pertbrmance of3D ICs. 展开更多
关键词 3D integration though silicon vias (TSVs) two-port network equivalent impedance noise couplingreduction
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