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Numerical calculation on temperature field of FGH95 alloy droplet during rapid solidification 被引量:1
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作者 Huanming Chen and Benfu Hu Materials Science and Engineering School, University of Science and Technology Beijing, Beijing 100083,China Physics and Electrical Information Engineering School, Ningxia University, Yinchuan 750021,China 《Journal of University of Science and Technology Beijing》 CSCD 2003年第3期51-54,共4页
The temperature field of FGH95 alloy droplet atomized by plasma rotatingelectrode processing (PREP) during solidification has been calculated through numerical analysisbased on equivalent sensible heat capacity method... The temperature field of FGH95 alloy droplet atomized by plasma rotatingelectrode processing (PREP) during solidification has been calculated through numerical analysisbased on equivalent sensible heat capacity method. And thus the relational curves among temperaturegradient of solid-liquid interface, moving velocity of solid-liquid interface and solid fractionduring solidification have been presented. The results indicate that the relation between averagetemperature gradient of solid-liquid interface and droplet size, and the relation between averagemoving velocity of solid-liquid interface and droplet size can be expressed during solidification. 展开更多
关键词 fgh95 alloy droplet temperature field numerical calculation
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