Static Random Access Memory(SRAM) based Field Programmable Gate Array(FPGA) is widely applied in the field of aerospace, whose anti-SEU(Single Event Upset) capability becomes more and more important. To improve anti-F...Static Random Access Memory(SRAM) based Field Programmable Gate Array(FPGA) is widely applied in the field of aerospace, whose anti-SEU(Single Event Upset) capability becomes more and more important. To improve anti-FPGA SEU capability, the registers of the circuit netlist are tripled and divided into three categories in this study. By the packing algorithm, the registers of triple modular redundancy are loaded into different configurable logic block. At the same time, the packing algorithm considers the effect of large fan-out nets. The experimental results show that the algorithm successfully realize the packing of the register of Triple Modular Redundancy(TMR). Comparing with Timing Versatile PACKing(TVPACK), the algorithm in this study is able to obtain a 11% reduction of the number of the nets in critical path, and a 12% reduction of the time delay in critical path on average when TMR is not considered. Especially, some critical path delay of circuit can be improved about 33%.展开更多
在充满挑战的半导体商业环境中,封测代工(outsourced semiconductor assembly and test)工业能被预见到会有一个稳定的,在许多产品细分上强有力的增长。整个半导体行业兼并收购的活动进行得如火如荼,这对封测代工厂来说意味着越来越少...在充满挑战的半导体商业环境中,封测代工(outsourced semiconductor assembly and test)工业能被预见到会有一个稳定的,在许多产品细分上强有力的增长。整个半导体行业兼并收购的活动进行得如火如荼,这对封测代工厂来说意味着越来越少的客户群。中国的封测代工生意任道而重远,扩张兼并的脚步仍在大踏步前行。展开更多
基金Supported by the National Natural Science Foundation of China(No.61106033)
文摘Static Random Access Memory(SRAM) based Field Programmable Gate Array(FPGA) is widely applied in the field of aerospace, whose anti-SEU(Single Event Upset) capability becomes more and more important. To improve anti-FPGA SEU capability, the registers of the circuit netlist are tripled and divided into three categories in this study. By the packing algorithm, the registers of triple modular redundancy are loaded into different configurable logic block. At the same time, the packing algorithm considers the effect of large fan-out nets. The experimental results show that the algorithm successfully realize the packing of the register of Triple Modular Redundancy(TMR). Comparing with Timing Versatile PACKing(TVPACK), the algorithm in this study is able to obtain a 11% reduction of the number of the nets in critical path, and a 12% reduction of the time delay in critical path on average when TMR is not considered. Especially, some critical path delay of circuit can be improved about 33%.
文摘在充满挑战的半导体商业环境中,封测代工(outsourced semiconductor assembly and test)工业能被预见到会有一个稳定的,在许多产品细分上强有力的增长。整个半导体行业兼并收购的活动进行得如火如荼,这对封测代工厂来说意味着越来越少的客户群。中国的封测代工生意任道而重远,扩张兼并的脚步仍在大踏步前行。
