在高溅射功率900 W 下用RF磁控溅射方法制备了厚为630-780nm的Fe-Ti-N薄膜,结果表明:当膜成分(原了分数, ％.下同)在Fe-3.9Ti-8.8N和Fe-3.3Ti-13.5N范围内,薄膜由α’和Ti2N沉淀组成,磁化强度4πMs超过纯铁,最商可达2.38T:而矫顽力Hc下...在高溅射功率900 W 下用RF磁控溅射方法制备了厚为630-780nm的Fe-Ti-N薄膜,结果表明:当膜成分(原了分数, ％.下同)在Fe-3.9Ti-8.8N和Fe-3.3Ti-13.5N范围内,薄膜由α’和Ti2N沉淀组成,磁化强度4πMs超过纯铁,最商可达2.38T:而矫顽力Hc下降为89 A/m.可以满足针对1.55 Gb/cm2高存储密度的GMR/感应式复合读写磁头中写入磁头的需要.N原子进入α-Fe使α’具有高饱和磁化强度;Ti的加入,阻止α’→α’+γ’的分解,稳定了强铁磁性相α’.是Fe-Ti-N具有高饱和磁化强度的原因.由于由晶粒度引起的对Hc的影响程度HcD与晶粒度D有以下关系:HcD∝D6,晶粒度控制非常重要.N原了进入α+Fe点阵的八面体间隙,引起极大的畸变,使晶粒碎化.提高溅射功率也使晶粒度下降.两者共同作用,能使晶粒度下降到约14nm,使Hc下降,晶界是择优沉淀地点,在α’晶界上沉淀Ti2N能起钉扎作用,阻止晶界迁移,使纳米晶α’不能长大。展开更多
The electroplating behavior of nanocrystalline CoNiFe soft magnetic thin film with high saturation magnetic flux density (Bs>2.1 T) and low coercivity (Hc) was investigated using cyclic voltammetry and chronoampero...The electroplating behavior of nanocrystalline CoNiFe soft magnetic thin film with high saturation magnetic flux density (Bs>2.1 T) and low coercivity (Hc) was investigated using cyclic voltammetry and chronoamperometry methods in conjunction with the scanning electron microscopy (SEM/EDX). The results show that, under the experimental conditions, the co-deposition of CoNiFe film behaves anomalously due to the atomic radii of iron series elements following the order of rFe>rCo>rNi. In the case of lower electroplating current density, the co-deposition of CoNiFe film follows a 3-D progressive nucleation/growth mechanism, while in the case of higher electroplating current density, which follows a 3-D instantaneous nucleation/growth mechanism. Meanwhile, the change of nucleation mechanism of CoNiFe film with electroplating current density was interpreted theoretically in the light of quantum chemistry.展开更多
文摘The electroplating behavior of nanocrystalline CoNiFe soft magnetic thin film with high saturation magnetic flux density (Bs>2.1 T) and low coercivity (Hc) was investigated using cyclic voltammetry and chronoamperometry methods in conjunction with the scanning electron microscopy (SEM/EDX). The results show that, under the experimental conditions, the co-deposition of CoNiFe film behaves anomalously due to the atomic radii of iron series elements following the order of rFe>rCo>rNi. In the case of lower electroplating current density, the co-deposition of CoNiFe film follows a 3-D progressive nucleation/growth mechanism, while in the case of higher electroplating current density, which follows a 3-D instantaneous nucleation/growth mechanism. Meanwhile, the change of nucleation mechanism of CoNiFe film with electroplating current density was interpreted theoretically in the light of quantum chemistry.
