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Thermal conductivity model of filled polymer composites 被引量:9
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作者 Ming-xia Shen Yin-xin Cui Jing He Yao-ming Zhang 《International Journal of Minerals,Metallurgy and Materials》 SCIE EI CAS CSCD 2011年第5期623-631,共9页
Theoretical and empirical models for predicting the thermal conductivity of polymer composites were summarized since the 1920s.The effects of particle shape,filler amount,dispersion state of fillers,and interfacial th... Theoretical and empirical models for predicting the thermal conductivity of polymer composites were summarized since the 1920s.The effects of particle shape,filler amount,dispersion state of fillers,and interfacial thermal barrier on the thermal conductivity of filled polymer composites were investigated,and the agreement of experimental data with theoretical models in literatures was discussed.Silica with high thermal conductivity was chosen to mix with polyvinyl-acetate (EVA) copolymer to prepare SiO2/EVA co-films.Experimental data of the co-films' thermal conductivity were compared with some classical theoretical and empirical models.The results show that Agari's model,the mixed model,and the percolation model can predict well the thermal conductivity of SiO2/EVA co-films. 展开更多
关键词 polymer matrix composites thermal conductivity mathematical models polyvinyl acetates SILICA filled polymers.
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DYNAMIC RHEOLOGICAL BEHAVIOR OF POLYPROPYLENE FILLED WITH ULTRA-FINE POWDERED RUBBER PARTICLES 被引量:7
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作者 郑强 《Chinese Journal of Polymer Science》 SCIE CAS CSCD 2004年第4期363-367,共5页
Dynamic rheological characteristics of polypropylene (PP) filled with ultra-fine full-vulcanized powdered rubber (UFPR) composed of styrene-butadiene copolymer were studied through dynamic rheological measurements on ... Dynamic rheological characteristics of polypropylene (PP) filled with ultra-fine full-vulcanized powdered rubber (UFPR) composed of styrene-butadiene copolymer were studied through dynamic rheological measurements on an Advanced Rheometric Expansion System (ARES). A specific viscoelastic phenomenon, i.e. 'the second plateau', appeared at low frequencies, and exhibits a certain dependence on the amount of rubber particles and the dispersion state in the matrix. This phenomenon is attributed to the formation of aggregation structure of rubber particles. The analyses of Cole-Cole diagrams of the dynamic viscoelastic functions suggest that the heterogeneity of the composites is enhanced on increasing both particle content and temperature. 展开更多
关键词 POLYPROPYLENE Ultra-fine powdered rubber filled polymers Dynamic rheological behavior Aggregation of fillers
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Investigation on mechanism of polymer filling in high-aspect-ratio trenches for through-silicon-via(TSV) application 被引量:1
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作者 DING YingTao YAN YangYang +3 位作者 CHEN QianWen WANG ShiWei CHEN Xiu CHEN YueYang 《Science China(Technological Sciences)》 SCIE EI CAS 2014年第8期1616-1625,共10页
Vacuum-assisted spin-coating is an effective polymer filling technology for sidewall insulating of through-silicon-via(TSV).This paper investigated the flow mechanism of the vacuum-assisted polymer filling process bas... Vacuum-assisted spin-coating is an effective polymer filling technology for sidewall insulating of through-silicon-via(TSV).This paper investigated the flow mechanism of the vacuum-assisted polymer filling process based on experiments and numerical simulation,and studied the effect of vacuum pressure,viscosity of polymer and aspect-ratio of trench on the filling performance.A 2D axisymmetric model,consisting of polymer partially filled into the trench and void at the bottom of trench,was developed for the computational fluid dynamics(CFD)simulation.The simulation results indicate that the vacuum-assisted polymer filling process goes through four stages,including bubble formation,bubble burst,air elimination and polymer re-filling.Moreover,the simulation results suggest that the pressure significantly affects the bubble formation and the polymer re-filling procedure,and the polymer viscosity and the trench aspect-ratio influence the duration of air elimination. 展开更多
关键词 through-silicon-via (TSV) vacuum process polymer filling computational fluid dynamics (CFD)
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