The solder joint reliability of a 0.5mm lead pitch, 240-pin quad flat package(QFP) was studied by nonlinear finite element analysis(FEA). The stress/strain distributions within the solder joints and the maximum plas...The solder joint reliability of a 0.5mm lead pitch, 240-pin quad flat package(QFP) was studied by nonlinear finite element analysis(FEA). The stress/strain distributions within the solder joints and the maximum plastic strain range of the solder joints were determined. Based on the calculated maximum plastic strain range the thermal fatigue life of the solder joints was calculated using Coffin-Manson equation. The influences of shape parameters including volume of solder joint, pad size and stand-off on the thermal fatigue life of the solder joints were also studied. The results show that the stress and strain distribution in the solder joint are not uniform; the interface between the lead and the solder joint is the high stress and strain region; the maximum stress and stain occur at the topmost point where the solder joint intersects with the inner side of the lead. The solder joint cracks should occur firstly at this point and propagate along the interface between the solder and the lead. The solder joint with the pad size of 1.25mm×0.35mm, the stand-off of 0.02mm and the solder volume of 0.026mm^3 has longer fatigue life than that of any others. These optimal parameters have been applied in practice to assemble the 240-pin, 0.5mm pitch QFP.展开更多
In a fine adjustment mechanism of the second crystal in a double-crystal monochromator, a compression spring is usually used as a return force element, but it often produces permanent deform after some time. A novel f...In a fine adjustment mechanism of the second crystal in a double-crystal monochromator, a compression spring is usually used as a return force element, but it often produces permanent deform after some time. A novel fine adjust- ment mechanism is put forward, which utilizes permanent-magnet as the return force element instead of a compres- sion spring. Its principle and advantages of adjusting the pitch angle and the roll angle are analyzed, and the structure parameters of the permanent-magnet, which is the key part of the fine adjustment mechanism, are optimized. The magnetically adsorbed fine adjustment mechanism has been testified and applied successfully in the double-crystal monochromator of 4W1B beam line in Beijing Synchrotron Radiation Facility (BSRF).展开更多
随着焊盘间距的减小和引线数目的增多,键合失效的发生也越来越频繁。系统分析了影响高密度球键合质量的各种主要因素得出在诸多因素中金属熔球(FAB free air ball)直径,引线摆动幅度和劈刀顶端形状等三个因素对键合质量的影响最大。文...随着焊盘间距的减小和引线数目的增多,键合失效的发生也越来越频繁。系统分析了影响高密度球键合质量的各种主要因素得出在诸多因素中金属熔球(FAB free air ball)直径,引线摆动幅度和劈刀顶端形状等三个因素对键合质量的影响最大。文中介绍了线弧固定技术,紫外线金属熔球控制工艺和新型劈刀等三种能有效减少键合失效的新工艺和新方法。展开更多
基金Project(02336060) supported by the Natural Science Foundation of Guangxi Province , China
文摘The solder joint reliability of a 0.5mm lead pitch, 240-pin quad flat package(QFP) was studied by nonlinear finite element analysis(FEA). The stress/strain distributions within the solder joints and the maximum plastic strain range of the solder joints were determined. Based on the calculated maximum plastic strain range the thermal fatigue life of the solder joints was calculated using Coffin-Manson equation. The influences of shape parameters including volume of solder joint, pad size and stand-off on the thermal fatigue life of the solder joints were also studied. The results show that the stress and strain distribution in the solder joint are not uniform; the interface between the lead and the solder joint is the high stress and strain region; the maximum stress and stain occur at the topmost point where the solder joint intersects with the inner side of the lead. The solder joint cracks should occur firstly at this point and propagate along the interface between the solder and the lead. The solder joint with the pad size of 1.25mm×0.35mm, the stand-off of 0.02mm and the solder volume of 0.026mm^3 has longer fatigue life than that of any others. These optimal parameters have been applied in practice to assemble the 240-pin, 0.5mm pitch QFP.
文摘In a fine adjustment mechanism of the second crystal in a double-crystal monochromator, a compression spring is usually used as a return force element, but it often produces permanent deform after some time. A novel fine adjust- ment mechanism is put forward, which utilizes permanent-magnet as the return force element instead of a compres- sion spring. Its principle and advantages of adjusting the pitch angle and the roll angle are analyzed, and the structure parameters of the permanent-magnet, which is the key part of the fine adjustment mechanism, are optimized. The magnetically adsorbed fine adjustment mechanism has been testified and applied successfully in the double-crystal monochromator of 4W1B beam line in Beijing Synchrotron Radiation Facility (BSRF).
基金Nanjing University of Aeronautics and Astronautics Doctoral Dissertation Innovation and Excellence Producing Foundation (BCXJ09-07)the Six Kind Skilled Personnel Project of Jiangsu Province (06-E-020)the Jiangsu General Colleges and Universities Postgraduate Scientific Research Innovative Plan (CX09B-074Z)
文摘随着焊盘间距的减小和引线数目的增多,键合失效的发生也越来越频繁。系统分析了影响高密度球键合质量的各种主要因素得出在诸多因素中金属熔球(FAB free air ball)直径,引线摆动幅度和劈刀顶端形状等三个因素对键合质量的影响最大。文中介绍了线弧固定技术,紫外线金属熔球控制工艺和新型劈刀等三种能有效减少键合失效的新工艺和新方法。
