A single poly EEPROM cell circuit sharing the deep N-well of a cell array was designed using the logic process. The proposed cell is written by the FN tunneling scheme and the cell size is 41.26 μm2, about 37% smalle...A single poly EEPROM cell circuit sharing the deep N-well of a cell array was designed using the logic process. The proposed cell is written by the FN tunneling scheme and the cell size is 41.26 μm2, about 37% smaller than the conventional cell. Also, a small-area and low-power 512-bit EEPROM IP was designed using the proposed cells which was used for a 900 MHz passive UHF RFID tag chip. To secure the operation of the cell proposed with 3.3 V devices and the reliability of the used devices, an EEPROM core circuit and a DC-DC converter were proposed. Simulation results for the designed EEPROM IP based on the 0.18 μm logic process show that the power consumptions in read mode, program mode and erase mode are 11.82, 25.15, and 24.08 μW, respectively, and the EEPROM size is 0.12 mm2.展开更多
Write/erase degradation after endurance cycling due to electron trapping events in triple-gate flash memory have been detected and analyzed using a UV erasure method. Different from the commonly degradation phenomenon...Write/erase degradation after endurance cycling due to electron trapping events in triple-gate flash memory have been detected and analyzed using a UV erasure method. Different from the commonly degradation phenomenon, write-induced electron trapping in the floating gate oxide, electron trapping in tunneling oxide is observed in triple-gate flash memory. Further, the degradation due to single-electron locally trapping/de-trapping in hornshaped SuperFlash does not occur in the triple-gate flash cell. This is because of planar poly-to-poly erasing in the triple-gate flash cell instead of tip erasing in the horn-shaped SuperFlash cell. Moreover, by TCAD simulation, the trap location is identified and the magnitude of its density is quantified roughly.展开更多
基金Project(10039239) supported by the Industrial Strategic Technology Development Program Funded by the Ministry of Knowledge Economy, Korea
文摘A single poly EEPROM cell circuit sharing the deep N-well of a cell array was designed using the logic process. The proposed cell is written by the FN tunneling scheme and the cell size is 41.26 μm2, about 37% smaller than the conventional cell. Also, a small-area and low-power 512-bit EEPROM IP was designed using the proposed cells which was used for a 900 MHz passive UHF RFID tag chip. To secure the operation of the cell proposed with 3.3 V devices and the reliability of the used devices, an EEPROM core circuit and a DC-DC converter were proposed. Simulation results for the designed EEPROM IP based on the 0.18 μm logic process show that the power consumptions in read mode, program mode and erase mode are 11.82, 25.15, and 24.08 μW, respectively, and the EEPROM size is 0.12 mm2.
基金the funding by the National Natural Science Foundation of China(61704061 and 61974050)the financial support from the National Natural Science Foundation of China(11674119,11690030,and 11690032)+1 种基金the financial support from the National Natural Science Foundation of China(61905266)Shanghai Sailing Program(19YF1454600)。
文摘Write/erase degradation after endurance cycling due to electron trapping events in triple-gate flash memory have been detected and analyzed using a UV erasure method. Different from the commonly degradation phenomenon, write-induced electron trapping in the floating gate oxide, electron trapping in tunneling oxide is observed in triple-gate flash memory. Further, the degradation due to single-electron locally trapping/de-trapping in hornshaped SuperFlash does not occur in the triple-gate flash cell. This is because of planar poly-to-poly erasing in the triple-gate flash cell instead of tip erasing in the horn-shaped SuperFlash cell. Moreover, by TCAD simulation, the trap location is identified and the magnitude of its density is quantified roughly.
