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Reliability analysis of GaN-based light emitting diodes for solid state illumination 被引量:1
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作者 杨凌 马晓华 +1 位作者 冯倩 郝跃 《Chinese Physics B》 SCIE EI CAS CSCD 2008年第7期2696-2700,共5页
In this paper, we have discussed the effect of electrical stress on GaN light emitting diode (LED). With the lapse of time, the LED with an applied large current stress can reduce its current more than without such ... In this paper, we have discussed the effect of electrical stress on GaN light emitting diode (LED). With the lapse of time, the LED with an applied large current stress can reduce its current more than without such a stress under a large forward-voltage drop. Its scanning electron microscopy (SEM) image shows that there exist several pits on the surface of the p-metal. With an electrical stress applied, the number of pits greatly increases. We also find that the degradation of GaN LED is related to the oxidized Ni/Au ohmic contact to p-GaN. The electrical activation of H-passivated Mg acceptors is described in detail. Annealing is performed in ambient air for 10 min and the differential resistances at a forward-voltage drop of 5 V are taken to evaluate the activation of the Mg acceptors. These results suggest some mechanisms of degradation responsible for these phenomena, which are described in the paper. 展开更多
关键词 gan based led electrical stress PITS ANNEALING mechanism of degradation
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