11.2 W/mm power density AlGaN/GaN high electron-mobility transistors on a GaN substrate

In this letter,high power density AlGaN/GaN high electron-mobility transistors(HEMTs)on a freestanding GaN substrate are reported.An asymmetricΓ-shaped 500-nm gate with a field plate of 650 nm is introduced to improve microwave power performance.The breakdown voltage(BV)is increased to more than 200 V for the fabricated device with gate-to-source and gate-to-drain distances of 1.08 and 2.92μm.A record continuous-wave power density of 11.2 W/mm@10 GHz is realized with a drain bias of 70 V.The maximum oscillation frequency(f_(max))and unity current gain cut-off frequency(f_(t))of the AlGaN/GaN HEMTs exceed 30 and 20 GHz,respectively.The results demonstrate the potential of AlGaN/GaN HEMTs on freestanding GaN substrates for microwave power applications.

High-Quality and Strain-Relaxation GaN Epilayer Grown on SiC Substrates Using AIN Buffer and AlGaN Interlayer

We study the effect of the AlGaN interlayer on structural quality and strain engineering of the GaN films grown on SiC substrates with an AlN buffer layer, hnproved structural quality and tensile stress releasing are realized in unintentionally doped GaN thin films grown on 6H-SiC substrates by metal organic chemical vapor deposition. Using the optimized AlGaN interlayer, we find that the full width at half maximum of x-ray diffraction peaks for GaN decreases dramatically, indicating an improved crystalline quality. Meanwhile, it is revealed that the biaxial tensile stress in the GaN film is significantly reduced from the Raman results. Photoluminescence spectra exhibit a shift of the peak position of the near-band-edge emission, as well as the integrated intensity ratio variation of the near-band-edge emission to the yellow luminescence band. Thus by optimizing the AlGaN interlayer, we could acquire the high-quality and strain-relaxation GaN epilayer with large thickness on SiC substrates.

Morphological and Microstructural Evolution and Related Impurity Incorporation in Non-Polar a-Plane GaN Grown on r-Sapphire Substrates

Effects of the growth temperature on morphological and microstructural evolution of a-plane GaN films grown on r-plane sapphires by metal organic chemical vapor deposition are investigated by atomic force microscopy and secondary ion mass spectroscopy （SIMS）. Surface morphology, structural quality and related impurity incorpora- tion are very sensitive to the growth temperature. A significant difference of yellow luminescence is observed and attributed to the incorporation of carbon into GaN films, which is confirmed by SIMS analysis. Our results show that the sample with triangular-pit morphology has sample with pentagon-like pit morphology, which is significantly higher concentrations of oxygen than the other induced by the existence of an N-face in triangular pits.

Improved Semipolar(11(2|-)2) GaN Quality Grown on m-Plane Sapphire Substrates by Metal Organic Chemical Vapor Deposition Using Self-Organized SiN_x Interlayer

The effect of a self-organized SiNs interlayer on the defect density of （1122） semipolar GaN grown on 7n-plane sapphire is studied by transmission electron microscopy, atomic force microscopy and high resolution x-ray diffrac- tion. The SiNx interlayer reduces the c-type dislocation density from 2.5 ×10^10 cm^-2 to 5 ×10^8 cm 2. The SiNx interlayer produces regions that are free from basal plane stacking faults （BSFs） and dislocations. The overall BSF density is reduced from 2.1×10^5 cm-1 to 1.3×10^4 cm^-1. The large dislocations and BSF reduction in semipolar （1122） GaN with the SiNx, interlayer result from two primary mechanisms. The first mechanism is the direct dislocation blocking by the SiNx interlayer, and the second mechanism is associated with the unique structure character of （1122） semipolar GaN.

Fabrication of InAlGaN/GaN High Electron Mobility Transistors on Sapphire Substrates by Pulsed Metal Organic Chemical Vapor Deposition

Nearly lattice-matched InAIGaN/GaN heterostructure is grown on sapphire substrates by pulsed metal organic chemical vapor deposition and excellent high electron mobility transistors are fabricated on this heterostructure. The electron mobility is 1668.08cm2/V.s together with a high two-dimensional-electron-gas density of 1.43 × 10^13 cm-2 for the InAlCaN/CaN heterostructure of 2Onto InAlCaN quaternary barrier. High electron mobility transistors with gate dimensions of 1 × 50 μm2 and 4μm source-drain distance exhibit the maximum drain current of 763.91 mA/mm, the maximum extrinsic transconductance of 163.13 mS/mm, and current gain and maximum oscillation cutoff frequencies of 11 GHz and 21 GHz, respectively.

Heterogeneous Growth of ZnO Crystal on GaN/Al_(2)O_(3) Substrate

Hydrothermal(HT)ZnO substrates were usually used as seeds for the vapor growth of ZnO crystals.In this work,ZnO bulk crystals were grown using the relatively low-cost GaN/AlOsubstrates as seeds by chemical vapor transport(CVT).With the increase of growth time,the dislocation densities in the crystal decreased from about 1×10^(6) to 6×10^(3) cm^(-2).The carrier concentration decreased from 1.24×10^(19) to 1.57×10^(17)cm^(-3),while the carrier mobility increased from 63.8 to 179 cm^(2)/(V·s).The optical transmittance in the VIS-NIR wavelength increased significantly in combination with the decreasing dislocation densities and impurity concentrations.The dislocation lines and related fast diffusion paths gradually decreased and disappeared in the late growth stage,and the crystal qualities were consequently improved.The experimental results show that the properties of as-grown ZnO crystals are comparable with bulk ZnO grown on the HT substrates to some extent.The GaN/Al_(2)O_(3) seeds may have a potential application value in the industrial production of ZnO single crystals.

Low threading dislocation density in GaN films grown on patterned sapphire substrates

The growth process of three-dimensional growth mode（3D） switching to two-dimensional growth mode （2D） is investigated when GaN films are grown on cone-shaped patterned sapphire substrates by metal-organic chemical vapor deposition.The growth condition of the 3D-2D growth process is optimized to reduce the threading dislocation density（TDD）.It is found that the condition of the 3D layer is critical.The 3D layer keeps growing under the conditions of lowⅤ/Ⅲratio,low temperature,and high pressure until its thickness is comparable to the height of the cone-shaped patterns.Then the 3D layer surrounds the cone-shaped patterns and has inclined side facets and a top（0001） plane.In the following 2D-growth process,inclined side facets coalesce quickly and the interaction of TDs with the side facets causes the TDs to bend over.As a result,the TDD of GaN films can decrease to 1×10~8 cm^（-2）,giving full-width at half maximum values of 211 and 219 arcsec for（002） and（102） omega scans, respectively.

Investigation of β-Ga2O3 films and β-Ga2O3/GaN heterostructures grown by metal organic chemical vapor deposition

In this work,(-201)β-Ga2O3 films are grown on GaN substrate by metal organic chemical vapor deposition(MOCVD).It is revealed that theβ-Ga2O3 film grown on GaN possesses superior crystal quality,material homogeneity and surface morphology than the results of common heteroepitaxialβ-Ga2O3 film based on sapphire substrate.Further,the relevance between the crystal quality of epitaxialβ-Ga2O3 film and theβ-Ga2O3/GaN interface behavior is investigated.Transmission electron microscopy result indicates that the interface atom refactoring phenomenon is beneficial to relieve the mismatch strain and improve the crystal quality of subsequentβ-Ga2O3 film.Moreover,the energy band structure ofβ-Ga2O3/GaN heterostructure grown by MOCVD is investigated by X-ray photoelectron spectroscopy and a large conduction band offset of 0.89 eV is obtained.The results in this work not only convincingly demonstrate the advantages ofβ-Ga2O3 films grown on GaN substrate,but also show the great application potential of MOCVDβ-Ga2O3/GaN heterostructures in microelectronic applications.