研究了 Ga_2O_3/Al_2O_3 膜反应自组装制备 GaN 薄膜。首先利用磁控溅射法在硅衬底上制备 Ga_2O_3/Al2O3膜,再将Ga_2O_3/Al_2O_3 膜在高纯氨气气氛中氨化反应得到了 GaN 薄膜。用 X 射线衍射(XRD),X 光光电子能谱(XPS)、扫描电镜(SEM)...研究了 Ga_2O_3/Al_2O_3 膜反应自组装制备 GaN 薄膜。首先利用磁控溅射法在硅衬底上制备 Ga_2O_3/Al2O3膜,再将Ga_2O_3/Al_2O_3 膜在高纯氨气气氛中氨化反应得到了 GaN 薄膜。用 X 射线衍射(XRD),X 光光电子能谱(XPS)、扫描电镜(SEM)、透射电镜(TEM)和 荧光光谱(PL)对样品进行结构、组分、形貌和发光特性的分析。测试结果表明:用此方法得到了六方纤锌矿结构的 GaN 晶体膜。展开更多
A1GaN/GaN fin-shaped metal-oxide-semiconductor high-electron-mobility transistors （fin-MOSHEMTs） with dif- ferent fin widths （30Ohm and lOOnm） on sapphire substrates are fabricated and characterized. High-quality ...A1GaN/GaN fin-shaped metal-oxide-semiconductor high-electron-mobility transistors （fin-MOSHEMTs） with dif- ferent fin widths （30Ohm and lOOnm） on sapphire substrates are fabricated and characterized. High-quality self-Migned Al2O3 gate dielectric underneath an 80-nm T-shaped gate is employed by Muminum self-oxidation, which induces 4 orders of magnitude reduction in the gate leakage current. Compared with conventional planar MOSHEMTs, short channel effects of the fabricated fin-MOSHEMTs are significantly suppressed due to the tri- gate structure, and excellent de characteristics are obtained, such as extremely fiat output curves, smaller drain induced barrier lower, smaller subthreshold swing, more positive threshold voltage, higher transconductance and higher breakdown voltage.展开更多
Surface leakage currents of A1GaN/GaN high electron mobility transistors are investigated by utilizing a circular double-gate structure to eliminate the influence of mesa leakage current. Different mechanisms are foun...Surface leakage currents of A1GaN/GaN high electron mobility transistors are investigated by utilizing a circular double-gate structure to eliminate the influence of mesa leakage current. Different mechanisms are found under various passivation conditions. The mechanism of the surface leakage current with AI2 03 passivation follows the two-dimensional variable range hopping model, while the mechanism of the surface leakage current with SiN passivation follows the Frenkel-Poole trap assisted emission. Two trap levels are found in the trap-assisted emission. One trap level has a barrier height of 0.22eV for the high electric field, and the other trap level has a barrier height of 0.12eV for the low electric field.展开更多
In this paper, Al2O3 ultrathin film used as the surface passivation layer for A1GaN/GaN high electron mobility transistor （HEMT） is deposited by thermal atomic layer deposition （ALD）, thereby avoiding plasma-induc...In this paper, Al2O3 ultrathin film used as the surface passivation layer for A1GaN/GaN high electron mobility transistor （HEMT） is deposited by thermal atomic layer deposition （ALD）, thereby avoiding plasma-induced damage and erosion to the surface. A comparison is made between the surface passivation in this paper and the conventional plasma enhanced chemical vapor deposition （PECVD） SiN passivation. A remarkable reduction of the gate leakage current and a significant increase in small signal radio frequency （RF） performance are achieved after applying Al2O3＋BCB passivation. For the Al2O3＋BCB passivated device with a 0.7μm gate, the value of fmax reaches up to 100 GHz, but it decreases to 40 GHz for SiN HEMT. The fmax/ft ratio （〉 4） is also improved after Al2O3＋BCB passivation. The capacitancevoltage （C-V） measurement demonstrates that Al2O3＋BCB HEMT shows quite less density of trap states （on the order of magnitude of 1010 cm-2） than that obtained at commonly studied SiN HEMT.展开更多
A simple and easily operated technique was developed to fabricate GaN films. GaN films possessing hexagonal wurtzite structure were fabricated on Si（111） substrates with ZnO buffer layers through nitriding Ga2O3 fil...A simple and easily operated technique was developed to fabricate GaN films. GaN films possessing hexagonal wurtzite structure were fabricated on Si（111） substrates with ZnO buffer layers through nitriding Ga2O3 films in the tube quartz furnace. ZnO buffer layers and Ga3O3 films were deposited on Si substrates in turn by using radio frequncy magnetron sputtering system before the nitriding process. The structure and composition of GaN films were studied by X-ray diffraction,selected area electron diffraction and Fourier transform infrared spectrophotometer. The morphologies of GaN films were studied by scanning electron microscopy. The results show that ZnO buffer layer improves the crystalline quality and the surface morphology of the films relative to the films grown directly on silicon substrates. The measurement result of room-temperature photoluminescence spectrum indicates that the photoluminescence peaks locate at 365 nm and 422 nm.展开更多
This paper discusses the effect of N2 plasma treatment before dielectric deposition on the electrical performance of a Al203/AlGaN/GaN metal-insulator-semiconductor high electron mobility transistor （MISHEMT）,with A...This paper discusses the effect of N2 plasma treatment before dielectric deposition on the electrical performance of a Al203/AlGaN/GaN metal-insulator-semiconductor high electron mobility transistor （MISHEMT）,with Al203 deposited by atomic layer deposition.The results indicated that the gate leakage was decreased two orders of magnitude after the Al203/AlGaN interface was pretreated by N2 plasma.Furthermore,effects of N2 plasma pretreatrnent on the electrical properties of the AlGaN/Al2O3 interface were investigated by x-ray photoelectron spectroscopy measurements and the interface quality between Al203 and AlGaN film was improved.展开更多
Two types of enhancement-mode(E-mode)AlGaN/GaN metal-insulator-semiconductor high-electron-mobility transistors(MIS-HEMTs)with different gate insulators are fabricated on Si substrates.The HfO2 gate insulator and the ...Two types of enhancement-mode(E-mode)AlGaN/GaN metal-insulator-semiconductor high-electron-mobility transistors(MIS-HEMTs)with different gate insulators are fabricated on Si substrates.The HfO2 gate insulator and the Al2O3 gate insulator each with a thickness of 30 nm are grown by the plasma-enhanced atomic layer deposition(PEALD).The energy band diagrams of two types of dielectric MIS-HEMTs are compared.The breakdown voltage(VBR)of HfO2 dielectric layer and Al2O3 dielectric layer are 9.4 V and 15.9 V,respectively.With the same barrier thickness,the transconductance of MIS-HEMT with HfO2 is larger.The threshold voltage(Vth)of the HfO2 and Al2O3 MIS-HEMT are 2.0 V and 2.4 V,respectively,when the barrier layer thickness is 0 nm.The C-V characteristics are in good agreement with the Vth's transfer characteristics.As the barrier layer becomes thinner,the drain current density decreases sharply.Due to the dielectric/AlGaN interface is very close to the channel,the scattering of interface states will lead the electron mobility to decrease.The current collapse and the Ron of Al2O3 MIS-HEMT are smaller at the maximum gate voltage.As Al2O3 has excellent thermal stability and chemical stability,the interface state density of Al2O3/AlGaN is less than that of HfO2/AlGaN.展开更多
Frequency dependent conductance measurements are implemented to investigate the interface states in Al2O3/A1GaN/GaN metal-oxide-semiconductor （MOS） structures. Two types of device structures, namely, the recessed ga...Frequency dependent conductance measurements are implemented to investigate the interface states in Al2O3/A1GaN/GaN metal-oxide-semiconductor （MOS） structures. Two types of device structures, namely, the recessed gate structure （RGS） and the normal gate structure （NGS）, are studied in the experiment. Interface trap parameters includ-ing trap density Dit, trap time constant ιit, and trap state energy ET in both devices have been determined. Furthermore, the obtained results demonstrate that the gate recess process can induce extra traps with shallower energy levels at the Al2O3/AlGaN interface due to the damage on the surface of the AlGaN barrier layer resulting from reactive ion etching （RIE）.展开更多
This paper studies systematically the drain current collapse in AlGaN/GaN metal-oxide-semiconductor high electron mobility transistors （MOS-HEMTs） by applying pulsed stress to the device. Low-temperature layer of Al...This paper studies systematically the drain current collapse in AlGaN/GaN metal-oxide-semiconductor high electron mobility transistors （MOS-HEMTs） by applying pulsed stress to the device. Low-temperature layer of Al2O3 ultrathin film used as both gate dielectric and surface passivation layer was deposited by atomic layer deposition （ALD）. For HEMT, gate turn-on pulses induced large current collapse. However, for MOS-HEMT, no significant current collapse was found in the gate turn-on pulsing mode with different pulse widths, indicating the good passivation effect of ALD Al2O3. A small increase in Id in the drain pulsing mode is due to the relieving of self-heating effect. The comparison of synchronously dynamic pulsed Id - Vds characteristics of HEMT and MOS-HEMT further demonstrated the good passivation effect of ALD Al2O3.展开更多
文摘研究了 Ga_2O_3/Al_2O_3 膜反应自组装制备 GaN 薄膜。首先利用磁控溅射法在硅衬底上制备 Ga_2O_3/Al2O3膜,再将Ga_2O_3/Al_2O_3 膜在高纯氨气气氛中氨化反应得到了 GaN 薄膜。用 X 射线衍射(XRD),X 光光电子能谱(XPS)、扫描电镜(SEM)、透射电镜(TEM)和 荧光光谱(PL)对样品进行结构、组分、形貌和发光特性的分析。测试结果表明:用此方法得到了六方纤锌矿结构的 GaN 晶体膜。
基金Supported by the National Natural Science Foundation of China under Grant No 61306113
文摘A1GaN/GaN fin-shaped metal-oxide-semiconductor high-electron-mobility transistors （fin-MOSHEMTs） with dif- ferent fin widths （30Ohm and lOOnm） on sapphire substrates are fabricated and characterized. High-quality self-Migned Al2O3 gate dielectric underneath an 80-nm T-shaped gate is employed by Muminum self-oxidation, which induces 4 orders of magnitude reduction in the gate leakage current. Compared with conventional planar MOSHEMTs, short channel effects of the fabricated fin-MOSHEMTs are significantly suppressed due to the tri- gate structure, and excellent de characteristics are obtained, such as extremely fiat output curves, smaller drain induced barrier lower, smaller subthreshold swing, more positive threshold voltage, higher transconductance and higher breakdown voltage.
基金Supported by the National High-Technology Research and Development Program of China under Grant No 2014AA032602the National Natural Science Foundation of China under Grant Nos 61474115 and 61501421
文摘Surface leakage currents of A1GaN/GaN high electron mobility transistors are investigated by utilizing a circular double-gate structure to eliminate the influence of mesa leakage current. Different mechanisms are found under various passivation conditions. The mechanism of the surface leakage current with AI2 03 passivation follows the two-dimensional variable range hopping model, while the mechanism of the surface leakage current with SiN passivation follows the Frenkel-Poole trap assisted emission. Two trap levels are found in the trap-assisted emission. One trap level has a barrier height of 0.22eV for the high electric field, and the other trap level has a barrier height of 0.12eV for the low electric field.
文摘In this paper, Al2O3 ultrathin film used as the surface passivation layer for A1GaN/GaN high electron mobility transistor （HEMT） is deposited by thermal atomic layer deposition （ALD）, thereby avoiding plasma-induced damage and erosion to the surface. A comparison is made between the surface passivation in this paper and the conventional plasma enhanced chemical vapor deposition （PECVD） SiN passivation. A remarkable reduction of the gate leakage current and a significant increase in small signal radio frequency （RF） performance are achieved after applying Al2O3＋BCB passivation. For the Al2O3＋BCB passivated device with a 0.7μm gate, the value of fmax reaches up to 100 GHz, but it decreases to 40 GHz for SiN HEMT. The fmax/ft ratio （〉 4） is also improved after Al2O3＋BCB passivation. The capacitancevoltage （C-V） measurement demonstrates that Al2O3＋BCB HEMT shows quite less density of trap states （on the order of magnitude of 1010 cm-2） than that obtained at commonly studied SiN HEMT.
基金Projects(90301002 90201025) supported by the National Natural Science Foundation of China
文摘A simple and easily operated technique was developed to fabricate GaN films. GaN films possessing hexagonal wurtzite structure were fabricated on Si（111） substrates with ZnO buffer layers through nitriding Ga2O3 films in the tube quartz furnace. ZnO buffer layers and Ga3O3 films were deposited on Si substrates in turn by using radio frequncy magnetron sputtering system before the nitriding process. The structure and composition of GaN films were studied by X-ray diffraction,selected area electron diffraction and Fourier transform infrared spectrophotometer. The morphologies of GaN films were studied by scanning electron microscopy. The results show that ZnO buffer layer improves the crystalline quality and the surface morphology of the films relative to the films grown directly on silicon substrates. The measurement result of room-temperature photoluminescence spectrum indicates that the photoluminescence peaks locate at 365 nm and 422 nm.
基金Project supported by National Advanced Research Program (Grant No 51308030102)Xi’an Applied Materials Innovation Fund (Grant No XA-AM-200616)National Natural Science Foundation of China (Grant Nos 60506020 and 60676048)
文摘This paper discusses the effect of N2 plasma treatment before dielectric deposition on the electrical performance of a Al203/AlGaN/GaN metal-insulator-semiconductor high electron mobility transistor （MISHEMT）,with Al203 deposited by atomic layer deposition.The results indicated that the gate leakage was decreased two orders of magnitude after the Al203/AlGaN interface was pretreated by N2 plasma.Furthermore,effects of N2 plasma pretreatrnent on the electrical properties of the AlGaN/Al2O3 interface were investigated by x-ray photoelectron spectroscopy measurements and the interface quality between Al203 and AlGaN film was improved.
基金the National Natural Science Foundation of China(Grant Nos.61974111,11690042,and 61974115)the National Pre-research Foundation of China(Grant No.31512050402)the Fund of Innovation Center of Radiation Application,China(Grant No.KFZC2018040202).
文摘Two types of enhancement-mode(E-mode)AlGaN/GaN metal-insulator-semiconductor high-electron-mobility transistors(MIS-HEMTs)with different gate insulators are fabricated on Si substrates.The HfO2 gate insulator and the Al2O3 gate insulator each with a thickness of 30 nm are grown by the plasma-enhanced atomic layer deposition(PEALD).The energy band diagrams of two types of dielectric MIS-HEMTs are compared.The breakdown voltage(VBR)of HfO2 dielectric layer and Al2O3 dielectric layer are 9.4 V and 15.9 V,respectively.With the same barrier thickness,the transconductance of MIS-HEMT with HfO2 is larger.The threshold voltage(Vth)of the HfO2 and Al2O3 MIS-HEMT are 2.0 V and 2.4 V,respectively,when the barrier layer thickness is 0 nm.The C-V characteristics are in good agreement with the Vth's transfer characteristics.As the barrier layer becomes thinner,the drain current density decreases sharply.Due to the dielectric/AlGaN interface is very close to the channel,the scattering of interface states will lead the electron mobility to decrease.The current collapse and the Ron of Al2O3 MIS-HEMT are smaller at the maximum gate voltage.As Al2O3 has excellent thermal stability and chemical stability,the interface state density of Al2O3/AlGaN is less than that of HfO2/AlGaN.
基金Project supported by the National Basic Research Program of China(Grant No.2011CBA00606)
文摘Frequency dependent conductance measurements are implemented to investigate the interface states in Al2O3/A1GaN/GaN metal-oxide-semiconductor （MOS） structures. Two types of device structures, namely, the recessed gate structure （RGS） and the normal gate structure （NGS）, are studied in the experiment. Interface trap parameters includ-ing trap density Dit, trap time constant ιit, and trap state energy ET in both devices have been determined. Furthermore, the obtained results demonstrate that the gate recess process can induce extra traps with shallower energy levels at the Al2O3/AlGaN interface due to the damage on the surface of the AlGaN barrier layer resulting from reactive ion etching （RIE）.
基金Project supported by NSFC (Grant No 60736033)National 973 Basic Research Project (Grant No 51327020301)
文摘This paper studies systematically the drain current collapse in AlGaN/GaN metal-oxide-semiconductor high electron mobility transistors （MOS-HEMTs） by applying pulsed stress to the device. Low-temperature layer of Al2O3 ultrathin film used as both gate dielectric and surface passivation layer was deposited by atomic layer deposition （ALD）. For HEMT, gate turn-on pulses induced large current collapse. However, for MOS-HEMT, no significant current collapse was found in the gate turn-on pulsing mode with different pulse widths, indicating the good passivation effect of ALD Al2O3. A small increase in Id in the drain pulsing mode is due to the relieving of self-heating effect. The comparison of synchronously dynamic pulsed Id - Vds characteristics of HEMT and MOS-HEMT further demonstrated the good passivation effect of ALD Al2O3.
