We summarize our work of the optoelectronic devices based on Germanium-tin （GeSn） alloys assisted with the Si3N4liner stressor in mid-infrared （MIR） domains. The device characteristics are thoroughly analyzed by t...We summarize our work of the optoelectronic devices based on Germanium-tin （GeSn） alloys assisted with the Si3N4liner stressor in mid-infrared （MIR） domains. The device characteristics are thoroughly analyzed by the strain distribution,band structure, and absorption characteristics. Numerical and analytical methods show that with optimal structural pa-rameters, the device performance can be further improved and the wavelength application range can be extended to 2~5 μm in the mid-infrared spectra. It is demonstrated that this proposed strategy provides an effective technique for the strained-GeSn devices in future optical designs, which will be competitive for the optoelectronics applications in mid-infrared wavelength.展开更多
The performance enhancement of conventional Si MOSFETs through device scaling is becoming increasingly difficult.The application of high mobility channel materials is one of the most promising solutions to overcome th...The performance enhancement of conventional Si MOSFETs through device scaling is becoming increasingly difficult.The application of high mobility channel materials is one of the most promising solutions to overcome the bottleneck.The Ge and GeSn channels attract a lot of interest as the alternative channel materials,not only because of the high carrier mobility but also the superior compatibility with typical Si CMOS technology.In this paper,the recent progress of high mobility Ge and GeSn MOSFETs has been investigated,providing feasible approaches to improve the performance of Ge and GeSn devices for future CMOS technologies.展开更多
Resistive RAM is a promising, relatively new type of memory with fast switching characteristics. Metal chalcogenide films have been used as the amorphous semiconductor layer in these types of devices. The amount of cr...Resistive RAM is a promising, relatively new type of memory with fast switching characteristics. Metal chalcogenide films have been used as the amorphous semiconductor layer in these types of devices. The amount of crystallinity present in the films may be important for both reliable operation and increased longevity of the devices. Germanium sulfide films can be used for these devices, and a possible way to tune the crystalline content of the films is by substituting Sn for some of the Ge atoms in the film. Thin films of GexSnySz containing varying amounts of tin were deposited in a plasma enhanced chemical vapor deposition reactor. Films with 2%, 8%, 15%, 26%, and 34% atomic percentage Sn were deposited to determine crystallinity and structural information with XRD and Raman spectroscopy. Based on these depositions it was determined that at about 8% Sn content and below, the films were largely amorphous, and at about 26% Sn and above, they appeared to be largely crystalline. At 15% Sn composition, which is between 8% and 26%, the film is more a mixture of the two phases. Based on this information, current-voltage (IV) curves of simple memory switching devices were constructed at 5% Sn (in the amorphous region), at 25% Sn (in the crystalline region), and at 15% (in the mixed region). Based on the IV curves from these devices, the 15% composition gave the best overall switching behavior suggesting that a certain degree of order in the semiconductor layer is important for RRAM devices.展开更多
基金The authors thank National Natural Science Foundation of China （Grant No. 61534004, 61604112 and 61622405）.
文摘We summarize our work of the optoelectronic devices based on Germanium-tin （GeSn） alloys assisted with the Si3N4liner stressor in mid-infrared （MIR） domains. The device characteristics are thoroughly analyzed by the strain distribution,band structure, and absorption characteristics. Numerical and analytical methods show that with optimal structural pa-rameters, the device performance can be further improved and the wavelength application range can be extended to 2~5 μm in the mid-infrared spectra. It is demonstrated that this proposed strategy provides an effective technique for the strained-GeSn devices in future optical designs, which will be competitive for the optoelectronics applications in mid-infrared wavelength.
基金This work was supported,in part,by the Zhejiang Provincial Natural Science Foundation of China under Grant LR18F040001the Fundamental Research Funds for the Central Universities。
文摘The performance enhancement of conventional Si MOSFETs through device scaling is becoming increasingly difficult.The application of high mobility channel materials is one of the most promising solutions to overcome the bottleneck.The Ge and GeSn channels attract a lot of interest as the alternative channel materials,not only because of the high carrier mobility but also the superior compatibility with typical Si CMOS technology.In this paper,the recent progress of high mobility Ge and GeSn MOSFETs has been investigated,providing feasible approaches to improve the performance of Ge and GeSn devices for future CMOS technologies.
文摘Resistive RAM is a promising, relatively new type of memory with fast switching characteristics. Metal chalcogenide films have been used as the amorphous semiconductor layer in these types of devices. The amount of crystallinity present in the films may be important for both reliable operation and increased longevity of the devices. Germanium sulfide films can be used for these devices, and a possible way to tune the crystalline content of the films is by substituting Sn for some of the Ge atoms in the film. Thin films of GexSnySz containing varying amounts of tin were deposited in a plasma enhanced chemical vapor deposition reactor. Films with 2%, 8%, 15%, 26%, and 34% atomic percentage Sn were deposited to determine crystallinity and structural information with XRD and Raman spectroscopy. Based on these depositions it was determined that at about 8% Sn content and below, the films were largely amorphous, and at about 26% Sn and above, they appeared to be largely crystalline. At 15% Sn composition, which is between 8% and 26%, the film is more a mixture of the two phases. Based on this information, current-voltage (IV) curves of simple memory switching devices were constructed at 5% Sn (in the amorphous region), at 25% Sn (in the crystalline region), and at 15% (in the mixed region). Based on the IV curves from these devices, the 15% composition gave the best overall switching behavior suggesting that a certain degree of order in the semiconductor layer is important for RRAM devices.
