Computational thermodynamics and kinetics were used to design the Pb-free micro-solders for replacing the conventional Sn-Pb solders because of the health and environmental safety problem. On the basis of CALPHAD (Cal...Computational thermodynamics and kinetics were used to design the Pb-free micro-solders for replacing the conventional Sn-Pb solders because of the health and environmental safety problem. On the basis of CALPHAD (Calculation of Phase Diagrams) method we can easily calculate properties such as the liquidus projection, isothermal and vertical sectional diagrams and phase fraction in multi-component system including Ag, Bi, Cu, In, Sb, Sn, Zn and Pb elements. In addition, other related information such as the surface tension, viscosity of the liquid phase and solidification simulation can also be obtained. DICTRA (Diffusion Controlled Transformation) software was used to simulate the interfacial reactions between substrate and Pb-free solders, which can easily give the information on the growth of intermetallic compounds and moving speed of interface between substrate and solders etc.展开更多
The effects of Bi addition on the growth of intermetallic compound (IMC) formation in Sn-3.8Ag-0.7Cu solder joints were investigated. The test samples were prepared by conventional surface mounting technology. To inve...The effects of Bi addition on the growth of intermetallic compound (IMC) formation in Sn-3.8Ag-0.7Cu solder joints were investigated. The test samples were prepared by conventional surface mounting technology. To investigate the element diffusion and the growth kinetics of intermetallics formation in solder joint, isothermal aging test was performed at temperatures of 100, 150, and 190℃, respectively. The optical microscope (OM) and scanning electron microscope (SEM) were used to observe microstructure evolution of solder joint and to estimate the thickness and the grain size of the intermetallic layers. The IMC phases were identified by energy dispersive X-ray (EDX) and X-ray diffractometer (XRD). The results clearly show that adding about 1.0% Bi in Sn-Ag-Cu solder alloy system can refine the grain size of the IMC and inhibit the excessive IMC growth in solder joints, and therefore improve the reliability of the Pb-free solder joints. Through observation of the microstructural evolution of the solder joints, the mechanism of inhibition of IMC growth due to Bi addition was proposed.展开更多
This study was to develop the flame retardant (FR) protective clothing which had multifunction such anti-bacterial, UV cut, FR function with water repellent and water vapor permeable laminating textiles for industrial...This study was to develop the flame retardant (FR) protective clothing which had multifunction such anti-bacterial, UV cut, FR function with water repellent and water vapor permeable laminating textiles for industrial workers. First of all, the FR yarn and FR textiles were developed for this purpose. Second, the comparison analysis between the halogen laminating textiles and halogen-free laminating textiles were tested to figure out the eco-friendly laminating method. Third, the flame retardant ability was compared the halogen laminated textiles to halogen-free laminated textiles. LOI, UV protection ratio, antibiosis after 50 laundry test, water proof pressure, and moisture permeability of developed textiles were tested. GC-HR-TOF-MS was used for analysis of laminating film (halogen and halogen-free). 4.1 wt% TiO2 yarn showed antibacterial function (Pneumococcus & Staphylococcus aureus: 99.9%), UV Protection (UVA: 90.8, UVB: 92.1), and LOI (33.6). The chosen optimal compounding ratio for PU compound of HRF and HFFR were as followed: PU resin 58.3%, DMF (Dimethyl formamide, δ = 12.2) 8.3%, MEK (Methylethylketone) 8.3% and FR (flame retardants) 25.0%. Binder for laminating should not be included over 10% of FRs because of adhesion between textiles and FR laminating film. There were detected phosphorus compounds in the textiles treated by halogenated type flame retardants and halogenated-free type flame retardants. There were not any detected harmful compounds from all textile samples.展开更多
The experimental tests of tensile for lead-flee solder Sn-3.5Ag were performed for the general work temperatures range from 11 to 90 ℃ and strain rate range from 5 × 10^-5 to 2 × 10^-2s^-1, and its stress--...The experimental tests of tensile for lead-flee solder Sn-3.5Ag were performed for the general work temperatures range from 11 to 90 ℃ and strain rate range from 5 × 10^-5 to 2 × 10^-2s^-1, and its stress--strain curves were compared to those of solder Sn-37Pb. The parameters in Anand model for solder Sn-3.5Ag were fitted based on experimental data and nonlinear fitting method, and its validity was checked by means of experimental data. Furthermore, the Anand model was used in the FEM analysis to evaluate solder joint thermal cycle reliability. The results show that solder Sn-3.5Ag has a better creep resistance than solder Sn-37Pb. The maximum stress is located at the upper right comer of the outmost solder joint from the symmetric center, and thermal fatigue life is predicted to be 3.796 × 10^4 cycles under the calculated conditions.展开更多
文摘Computational thermodynamics and kinetics were used to design the Pb-free micro-solders for replacing the conventional Sn-Pb solders because of the health and environmental safety problem. On the basis of CALPHAD (Calculation of Phase Diagrams) method we can easily calculate properties such as the liquidus projection, isothermal and vertical sectional diagrams and phase fraction in multi-component system including Ag, Bi, Cu, In, Sb, Sn, Zn and Pb elements. In addition, other related information such as the surface tension, viscosity of the liquid phase and solidification simulation can also be obtained. DICTRA (Diffusion Controlled Transformation) software was used to simulate the interfacial reactions between substrate and Pb-free solders, which can easily give the information on the growth of intermetallic compounds and moving speed of interface between substrate and solders etc.
文摘The effects of Bi addition on the growth of intermetallic compound (IMC) formation in Sn-3.8Ag-0.7Cu solder joints were investigated. The test samples were prepared by conventional surface mounting technology. To investigate the element diffusion and the growth kinetics of intermetallics formation in solder joint, isothermal aging test was performed at temperatures of 100, 150, and 190℃, respectively. The optical microscope (OM) and scanning electron microscope (SEM) were used to observe microstructure evolution of solder joint and to estimate the thickness and the grain size of the intermetallic layers. The IMC phases were identified by energy dispersive X-ray (EDX) and X-ray diffractometer (XRD). The results clearly show that adding about 1.0% Bi in Sn-Ag-Cu solder alloy system can refine the grain size of the IMC and inhibit the excessive IMC growth in solder joints, and therefore improve the reliability of the Pb-free solder joints. Through observation of the microstructural evolution of the solder joints, the mechanism of inhibition of IMC growth due to Bi addition was proposed.
文摘This study was to develop the flame retardant (FR) protective clothing which had multifunction such anti-bacterial, UV cut, FR function with water repellent and water vapor permeable laminating textiles for industrial workers. First of all, the FR yarn and FR textiles were developed for this purpose. Second, the comparison analysis between the halogen laminating textiles and halogen-free laminating textiles were tested to figure out the eco-friendly laminating method. Third, the flame retardant ability was compared the halogen laminated textiles to halogen-free laminated textiles. LOI, UV protection ratio, antibiosis after 50 laundry test, water proof pressure, and moisture permeability of developed textiles were tested. GC-HR-TOF-MS was used for analysis of laminating film (halogen and halogen-free). 4.1 wt% TiO2 yarn showed antibacterial function (Pneumococcus & Staphylococcus aureus: 99.9%), UV Protection (UVA: 90.8, UVB: 92.1), and LOI (33.6). The chosen optimal compounding ratio for PU compound of HRF and HFFR were as followed: PU resin 58.3%, DMF (Dimethyl formamide, δ = 12.2) 8.3%, MEK (Methylethylketone) 8.3% and FR (flame retardants) 25.0%. Binder for laminating should not be included over 10% of FRs because of adhesion between textiles and FR laminating film. There were detected phosphorus compounds in the textiles treated by halogenated type flame retardants and halogenated-free type flame retardants. There were not any detected harmful compounds from all textile samples.
基金Project(50376076) supported by the National Natural Science Foundation of China
文摘The experimental tests of tensile for lead-flee solder Sn-3.5Ag were performed for the general work temperatures range from 11 to 90 ℃ and strain rate range from 5 × 10^-5 to 2 × 10^-2s^-1, and its stress--strain curves were compared to those of solder Sn-37Pb. The parameters in Anand model for solder Sn-3.5Ag were fitted based on experimental data and nonlinear fitting method, and its validity was checked by means of experimental data. Furthermore, the Anand model was used in the FEM analysis to evaluate solder joint thermal cycle reliability. The results show that solder Sn-3.5Ag has a better creep resistance than solder Sn-37Pb. The maximum stress is located at the upper right comer of the outmost solder joint from the symmetric center, and thermal fatigue life is predicted to be 3.796 × 10^4 cycles under the calculated conditions.
