Research on Ultrasonic Vibration Grinding of the Hard and Brittle Materials

It is well known that grinding techniques are main methods to machine hard and brittle materials such as engineering ceramics. But the conventional grinding has many shortcomings such as poorer surface finish, quicker wear and tear of grinding tools, lower efficiency and so on. Ultrasonic vibration grinding （UVG） which combines ultrasonic machining and grinding emerged as a developing and promising technique in recent years. In this paper, experimental studies on UVG were conducted on several kinds of hard and brittle material by altering processing parameters such as vibration frequency and its amplitude, diamond abrasive grit size, cutting depth, feeding speed and rotary speed of tools. The experimental results show that alteration in any of above mentioned parameters will bring effects on the processed surface finish of these materials. Of them, the diamond abrasive grit size has the greatest. Moreover, conventional grinding experiments were also carried out on these materials. By comparison, it was found that the UVG is superior to the conventional method in terms of the ground surface quality, the working efficiency and the wear rate of tools.

Femtosecond laser-induced periodic surface structures on hard and brittle materials

Hard and brittle materials have high hardness,excellent optical stability,chemical stability,and high thermal stability.Hence,they have huge application potential in various fields,such as optical components,substrate materials,and quantum information,especially under harsh conditions,such as high temperatures and high pressures.Femtosecond laser direct writing technology has greatly promoted the development of femtosecond laser-induced periodic surface structure(Fs-LIPSS or LIPSS by a femtosecond laser)applications of hard and brittle materials due to its high precision,controllability,and three-dimensional processing ability.Thus far,LIPSSs have been widely used in material surface treatment,optoelectronic devices,and micromechanics.However,a consensus has not been reached regarding the formation mechanism of LIPSSs on hard and brittle materials.In this paper,three widely accepted LIPSS formation mechanisms are introduced,and the characteristics and applications of LIPSSs on diamonds,silicon,silicon carbide,and fused silica surfaces in recent years are summarized.In addition,the application prospects and challenges of LIPSSs on hard and brittle materials by a femtosecond laser are discussed.

Advances in molecular dynamics simulation of ultra-precision machining of hard and brittle materials

Hard and brittle materials, such as silicon, SiC, and optical glasses, are widely used in aerospace, military, integrated circuit, and other fields because of their excellent physical and chemical properties. However, these materials display poor machinability because of their hard and brittle properties. Damages such as surface micro-crack and subsurface damage often occur during machining of hard and brittle materials. Ultra-precision machining is widely used in processing hard and brittle materials to obtain nanoscale machining quality. However, the theoretical mechanism underlying this method remains unclear. This paper provides a review of present research on the molecular dynamics simulation of ultra-precision machining of hard and brittle materials. The future trends in this field are also discussed.

Methods for Detection of Subsurface Damage:A Review

Subsurface damage is easily induced in machining of hard and brittle materials because of their particular mechani?cal and physical properties. It is detrimental to the strength,performance and lifetime of a machined part. To manu?facture a high quality part,it is necessary to detect and remove the machining induced subsurface damage by the subsequent processes. However,subsurface damage is often covered with a smearing layer generated in a machining process,it is rather di cult to directly observe and detect by optical microscopy. An e cient detection of subsur?face damage directly leads to quality improvement and time saving for machining of hard and brittle materials. This paper presents a review of the methods for detection of subsurface damage,both destructive and non?destructive. Although more reliable,destructive methods are typically time?consuming and confined to local damage infor?mation. Non?destructive methods usually su er from uncertainty factors,but may provide global information on subsurface damage distribution. These methods are promising because they can provide a capacity of rapid scan and detection of subsurface damage in spatial distribution.

Research on Cutting Force of Ultrasonic Diamond Wire Saw

Based on impulse and vibration machining theories,a mathematical model of cutting force for the electroplated diamond ultrasonic wire saw was established using superposition principle.The differences between the cutting forces with and without ultrasonic effect were analyzed theoretically and experimentally.The results indicate that the cutting force of diamond wire increases along with the spindle speed decrease and the lateral pressure increase.The force in ultrasonic vibration cutting is about 20% to 30% less than that in conventional cutting.Also,the cutting trajectory of single diamond grit in sawing process is simulated,and the reason that the ultrasonic vibration can reduce the cutting force is explained further.

High Efficiency ELID Grinding of Garnet Ferrite

Hard and brittle materials such as ferrite, optical glass and ceramics have been widely used in many fields because of their good characteristics and still gain more attentions. However, it is difficult to machine and get good surface quality. Some parts made of these materials have large machining allowances and need to be produced with large batch, but the machining efficiency is very low with usual grinding method. So it is of great importance to research the high efficiency grinding technology of hard and brittle materials. Electrolytic in-process dressing (ELID) grinding is a new grinding technology which has been adopted to the ultra-precision machining of hard and brittle materials. With the function of in-process dressing of metal bond diamond and CBN wheel, ELID grinding has the ability to keep the sharpness of the wheel surface and is widely used in fine abrasive grinding, but it also has the potentialities to high efficiency grinding. In this paper, the mechanism of ELID grinding and its grinding performance are analyzed, then the cast iron bond diamond wheels and ELID grinding device are used on a surface grinder to research the feasibility of ELID grinding to high efficiency grinding. To make comparison, the garnet ferrite (YAG) work piece has been machined in plunge grinding both by ELID grinding and by the resin bond diamond wheel. The grinding force and surface quality are tested and analyzed. It has been found that the grinding force of the cast iron bond diamond wheel with ELID grinding is apparently smaller than that of the resin bond diamond wheel. Under the same conditions, it is about 2/5～3/5 as the force using the resin bond diamond wheel. So with the same grinder and machining conditions, ELID grinding can machine work piece with greater depth of cut. Because of the smaller grinding force, it is also beneficial to avoid the edge collapse of the work piece and keep the integrity of the grinding surface. This experiment shows that the grinding efficiency can be highly improved and the surface quality be ensured by applying ELID grinding technology and adopting large grinding depth. The results indicate that the ELID grinding technology can be effectively used in the high efficiency machining of garnet ferrite and other hard and brittle materials.