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Effect of stress paths on failure mechanism and progressive damage of hard-brittle rock 被引量:2
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作者 CHEN Zi-quan HE Chuan +1 位作者 HU Xiong-yu MA Chun-chi 《Journal of Mountain Science》 SCIE CSCD 2021年第9期2486-2502,共17页
During deep buried hard-brittle rock tunnel excavation,the surrounding rock experiences a complicated stress path and stress adjustment process.Once the adjusted stress exceeds the ultimate bearing capacity of rockmas... During deep buried hard-brittle rock tunnel excavation,the surrounding rock experiences a complicated stress path and stress adjustment process.Once the adjusted stress exceeds the ultimate bearing capacity of rockmass,a rock failure mode defined as stress-cracking type will occur.In order to investigate the effect of stress paths on failure mechanism and progressive damage of deep-buried rockmass,the cyclic loading-unloading,loading-unloading,uniaxial,conventional and unloading triaxial compression tests on samples of hard-brittle sandstone were conducted.According to the experimental results,increase in the confining pressure was beneficial to improve the mechanical parameters of rock,but it will reduce the brittle failure features.Compared with conventional triaxial compression,the sandstone under unloading state had more remarkable stress drop and unstable failure characteristics.Meanwhile,it was found that the energy dissipation and energy release in the whole process of rock deformation were the internal power of driven rock progressive damage.With the increase of confining pressure,the energy hardening and energy accumulation features of rock were weakened,while the progressive damage evolution characteristics could be enhanced.In unloading state,more energy could be converted into elastic energy in the energy softening phase(σeb-σP),so that the prepeak damage rate of rock was lower than that of conventional triaxial compression state.Thus,the energy dissipation rate of rock after peak strength decreased linearly with the increase of confining pressure under conventional triaxial compression state,while in unloading state it showed the opposite law. 展开更多
关键词 hard-brittle rock Stress path Confining pressure Failure mechanism Progressive damage
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Micro-Grinding Performance of Hard-Brittle Chip Materials in Precision Micro-Grinding Microgroove
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作者 ZHANG Long XIE Jin +1 位作者 ZHU Limin LU Yanjun 《Journal of Shanghai Jiaotong university(Science)》 EI 2018年第S1期70-76,共7页
The micro-structure on hard-brittle chip materials(HBCMs) surface can produce predominant functions and features. The micro-grinding with diamond wheel micro-tip is an efficient method to machine microstructure on HBC... The micro-structure on hard-brittle chip materials(HBCMs) surface can produce predominant functions and features. The micro-grinding with diamond wheel micro-tip is an efficient method to machine microstructure on HBCMs. However, different HBCMs and crystal orientation may have a significant influence on the micro-grinding performance. In this paper, the micro-grinding performance along different crystal orientation of HBCMs is investigated. First, a dressed 600~#diamond grinding wheel is used to micro-grind micro-structure on HBCMs. Then, the experiment of micro-grinding force test is completed. Finally, the quality of microgroove,the grinding ratio and the micro-grinding force are investigated and they are related to the crystal orientation of HBCMs. It is shown that the stronger resistance to the micro-crack propagation has the best quality of microgroove and the smallest grinding ratio. Moreover, the hardest single-crystal SiC has the best machinability and the micro-grinding force is 38.9%, 10.8% and 46.8% less than the one of sapphire, single-crystal Si and quartz glass, respectively. The direction to micro-grind easily is the crystal orientation 1010 for single-crystal SiC and sapphire. In addition, the micro-grinding force increases with the increase of the micro-grinding depth and feed rate and decreases with the increase of the grinding wheel speed. 展开更多
关键词 precision micro-grinding crystal orientation hard-brittle chip materials(HBCMs)
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