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Heat dissipation enhancement method for finned heat sink for AGV motor driver's IGBT module
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作者 刘璇 ZHANG Mingchao +2 位作者 LIU Chengwen ZHOU Chuanan LV Xiaoling 《High Technology Letters》 EI CAS 2024年第2期170-178,共9页
With the widespread use of high-power and highly integrated insulated gate bipolar transistor(IGBT),their cooling methods have become challenging.This paper proposes a liquid cooling scheme for heavy-duty automated gu... With the widespread use of high-power and highly integrated insulated gate bipolar transistor(IGBT),their cooling methods have become challenging.This paper proposes a liquid cooling scheme for heavy-duty automated guided vehicle(AGV)motor driver in port environment,and improves heat dissipation by analyzing and optimizing the core component of finned heat sink.Firstly,the temperature distribution of the initial scheme is studied by using Fluent software,and the heat transfer characteristics of the finned heat sink are obtained through numerical analysis.Secondly,an orthogonal test is designed and combined with the response surface methodology to optimize the structural parameters of the finned heat sink,resulting in a 14.57%increase in the heat dissipation effect.Finally,the effectiveness of heat dissipation enhancement is verified.This work provides valuable insights into improving the heat dissipation of IGBT modules and heat sinks,and provides guidance for their future applications. 展开更多
关键词 finned heat sink insulated gate bipolar transistor(IGBT)module heat dissipation orthogonal test response surface methodology
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Computer simulation of Cu:AlOOH/water in a microchannel heat sink using a porous media technique and solved by numerical analysis AGM and FEM
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作者 S.A.Abdollahi P.Jalili +4 位作者 B.Jalili H.Nourozpour Y.Safari P.Pasha D.D.Ganji 《Theoretical & Applied Mechanics Letters》 CAS CSCD 2023年第3期177-187,共11页
Extensive improvements in small-scale thermal systems in electronic circuits,automotive industries,and microcomputers conduct the study of microsystems as essential.Flow and thermic field characteristics of the cohere... Extensive improvements in small-scale thermal systems in electronic circuits,automotive industries,and microcomputers conduct the study of microsystems as essential.Flow and thermic field characteristics of the coherent nanofluid-guided microchannel heat sink are described in this perusal.The porous media approximate was used to search the heat distribution in the expanded sheet and Cu:γ-AlOOH/water.A hybrid blend of Boehme copper and aluminum nanoparticles is evaluated to have a cooling effect on the microchannel heat sink.By using Akbari Ganji and finite element methods,linear and non-linear differential equations as well as simple dimensionless equations have been analyzed.The purpose of this study is to investigate the fluid and thermal parameters of copper hybrid solution added to water,such as Nusselt number and Darcy number so that we can reach the best cooling of the fluid.Also,by installing a piece of fin on the wall of the heat sink,the coefficient of conductive heat transfer and displacement heat transfer with the surrounding air fluid increases,and the efficiency of the system increases.The overall results show that expanding values on the NP(series heat transfer fluid system maximizes performance with temperatures)volume division of copper,as well as boehmite alumina particles,lead to a decrease within the stream velocity of the Cu:AlOOH/water.Increasing the volume fraction of nanoparticles in the hybrid mixture decreases the temperature of the solid surface and the hybrid nanofluid.The Brownian movement improves as the volume percentage of nanoparticles in the hybrid mixture grows,spreading the heat across the environment.As a result,heat transmission rates rise.As the Darcy number increases,the thermal field for solid sections and Cu:AlOOH/water improves. 展开更多
关键词 Finite element method AGM method MICROCHANNEL heat sink Porous media Cu:γ-AlOOH/water
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Evaluation on Heat Transferring Performance of Fabric Heat Sink by Finite Element Modeling
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作者 杨旭东 张华帅 +2 位作者 胡吉永 路玉环 李毓陵 《Journal of Donghua University(English Edition)》 EI CAS 2016年第4期619-624,共6页
Considering the limitation in current manufacturing technology of commercial pin fin heat sinks,a new fabric heat sink has been designed. However,it is lack of an understanding of the heat transferring performance of ... Considering the limitation in current manufacturing technology of commercial pin fin heat sinks,a new fabric heat sink has been designed. However,it is lack of an understanding of the heat transferring performance of this new kind of heat sink. In this study,the finite element method (FEM) was used to predict the heat transferring performance of fabric heat sink under the condition of natural convection and forced convection, and its heat transferring performance was compared with that of pin fin heat sink. The results showed that in the condition of natural convection the heat transferring performance of pin fin heat sink was better than that of fabric heat sink, and vice versa under the forced convection condition. 展开更多
关键词 fabric heat sink pin fin heat sink natural convection forced convection heat transferring
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Theoretic heat sink simulation and experimental investigation of the pyrolysis of substituted cyclohexanes 被引量:1
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作者 Daoan Sun Yongmei Du +5 位作者 Chunying Li Jianwei Zhang Juyou Lu Zhixuan Wang Jiaoyi Li Jian L 《Journal of Energy Chemistry》 SCIE EI CAS CSCD 2015年第1期119-125,共7页
Reaxgen program for the pyrolysis mechanism of cycloalkanes was adopted to simulate the heat sink of substituted cyclohexanes. Thermal cracking of cyclohexanes was performed to examine the cracking performance, wherei... Reaxgen program for the pyrolysis mechanism of cycloalkanes was adopted to simulate the heat sink of substituted cyclohexanes. Thermal cracking of cyclohexanes was performed to examine the cracking performance, wherein the substituent effects were detailedly discussed under supercritical condition. It was found that Reaxgen program played a good part in the screening and optimization of cyclohexanes. A good agreement with the experimental data for the mono-substituted and bi-substituted cyclohexanes was demonstrated, however, some deviation for the tri-substituted cyclohexanes were observed. The experiment results indicated that the gaseous product yield increased sharply for mono- substituted cyclohexanes with short substituents containing no more than two carbons. Nevertheless, continuous increase in the alkyl chain depressed the gaseous product yield smoothly. The cyclic substituent dramatically inhibited the pyrolysis of cyclohexanes. All the substituents but cyclohexyl had no obvious effect on the yield of hydrogen and olefins (≤C4). For bi-substituted cyclohexanes, the more close the distance between the two substituents, the higher the gaseous product yield was obtained. However, opposite result on the selectivity to hydrogen and olefins (≤C4) was generally obtained except 1,3-dimethylcyclohexane. The position of tri-substituents acted little significance on the gaseous product yield, as well as the selectivity to hydrogen and olefins (≤C4). 展开更多
关键词 reaxgen program PYROLYSIS heat sink substituted cyclohexanes gaseous product yield SELECTIVITY
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Integrated Behavior of Carbon and Copper Alloy Heat Sink Under Different Heat Loads and Cooling Conditions 被引量:1
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作者 李化 李建刚 +1 位作者 陈俊浚 胡建生 《Plasma Science and Technology》 SCIE EI CAS CSCD 2005年第4期2923-2925,共3页
An actively water-cooled limiter has been designed for the long pulse operation of an HT-7 device, by adopting an integrated structure-doped graphite and a copper alloy heat sink with a super carbon sheet serving as a... An actively water-cooled limiter has been designed for the long pulse operation of an HT-7 device, by adopting an integrated structure-doped graphite and a copper alloy heat sink with a super carbon sheet serving as a compliant layer between them. The behaviors of the integrated structure were evaluated in an electron beam facility under different heat loads and cooling conditions. The surface temperature and bulk temperature distribution were carefully measured by optical pyrometers and thermocouples under a steady state heat flux of 1 to 5 MW/m^2 and a water flow rate of 3 m^3/h, 4.5 m^3/h and 6 m^3/h, respectively. It was found that the surface temperature increased rapidly with the heat flux rising, but decreased only slightly with the water flow rate rising. The surface temperature reached approximately 1200℃ at 5 MW/m^2 of heat flux and 6 m^3/h of water flow. The primary experimental results indicate that the integrated design meets the requirements for the heat expelling capacity of the HT-7 device. A set of numerical simulations was also completed, whose outcome was in good accord with the experimental results. 展开更多
关键词 HT-7 tokamak carbon and copper alloy heat sink heat loads cooling conditions numerical simulation
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CFD investigation of the feasibility of polymer-based microchannel heat sink as thermal solution 被引量:1
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作者 Yue Seong Ong KuZilati KuShaari 《Chinese Journal of Chemical Engineering》 SCIE EI CAS CSCD 2020年第4期980-994,共15页
Microchannel heat sinks(MCHSs)are promising thermal solutions in miniaturized or compact devices.Lightweight aspect has been given huge emphasis in recent years.Metal-based materials are commonly used to fabricate MCH... Microchannel heat sinks(MCHSs)are promising thermal solutions in miniaturized or compact devices.Lightweight aspect has been given huge emphasis in recent years.Metal-based materials are commonly used to fabricate MCHSs due to their high thermal conductivity.Consequently,MCHSs are heavy due to the high density of these materials albeit the small footprint of MCHSs.Polymer-based materials are interesting alternatives.Despite their poor thermal conductivity,lightweight feature attracts the interest of researchers.Heat transfer is a conjugate process of heat conduction and heat convection.Poor heat conductions aspect may be compensated through enhancement of heat convection aspects.Although polymer-based materials have been used in microscale heat transfer studies,their focus was not on their feasibility.The present study aims to evaluate the feasibility of polymer-based MCHSs as thermal solutions.The effect of thermal conductivity of fabrication materials,including polymer-based PDMS,PTFE,PDMS/MWCNT,and metal-based aluminum,on the thermal performance of MCHSs was investigated and compared at various inlet flow rate,fluid thermal conductivity,and microchannel ratio at different constant heat fluxes using three-dimensional CFD approach.Results showed that the thermal performance of MCHSs was greatly affected by the heat conduction aspect in which poor heat conduction limited the thermal performance improvement due to enhanced heat convection aspects.This suggests polymer-based materials have the potential for heat transfer applications through thermal conductivity enhancement.This was confirmed in the further analysis using a recently proposed high thermal conductivity polymer-based graphite/epoxy MCHS and a hybrid-based PDMS/aluminum MCHS. 展开更多
关键词 Microchannel heat sink Thermal performance Thermal conductivity Microchannel ratio Computational fluid dynamic
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Thermal modeling optimization and experimental validation for a single concentrator solar cell system with a heat sink
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作者 崔敏 陈诺夫 +1 位作者 邓金祥 刘立英 《Chinese Physics B》 SCIE EI CAS CSCD 2013年第8期456-461,共6页
A single concentrator solar cell model with a heat sink is established to simulate the thermal performance of the system by varying the number, height, and thickness of fins, the base thickness and thermal resistance ... A single concentrator solar cell model with a heat sink is established to simulate the thermal performance of the system by varying the number, height, and thickness of fins, the base thickness and thermal resistance of the thermal conductive adhesive. Influence disciplines of those parameters on temperatures of the solar cell and heat sink are obtained. With optimized number, height and thickness of fins, and the thickness values of base of 8, 1.4 cm, 1.5 mm, and 2 mm, the lowest temperatures of the solar cell and heat sink are 41.7 ~C and 36.3 ~C respectively. A concentrator solar cell prototype with a heat sink fabricated based on the simulation optimized structure is built. Outdoor temperatures of the prototype are tested. Temperatures of the solar cell and heat sink are stabilized with time continuing at about 37 ℃-38 ℃ and 35 ℃-36 ℃respectively, slightly lower than the simulation results because of effects of the wind and cloud. Thus the simulation model enables to predict the thermal performance of the system, and the simulation results can be a reference for designing heat sinks in the field of single concentrator solar cells. 展开更多
关键词 heat sink concentrator solar cell thermal model COOLING
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Impact of nanoparticle shape on thermohydraulic performance of a nanofluid in an enhanced microchannel heat sink for utilization in cooling of electronic components
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作者 Mehdi Bahiraei Ali Monavari 《Chinese Journal of Chemical Engineering》 SCIE EI CAS CSCD 2021年第12期36-47,共12页
In this article,the thermal–hydraulic efficacy of a boehmite nanofluid with various particle shapes is evaluated inside a microchannel heat sink.The study is done for particle shapes of platelet,cylinder,blade,brick,... In this article,the thermal–hydraulic efficacy of a boehmite nanofluid with various particle shapes is evaluated inside a microchannel heat sink.The study is done for particle shapes of platelet,cylinder,blade,brick,and oblate spheroid at Reynolds numbers(Re)of 300,800,1300,and 1800.The particle volume fraction is assumed invariant for all of the nanoparticle shapes.The heat transfer coefficient(h),flow irregularities,pressure loss,and pumping power heighten by the elevation of the Re for all of the nanoparticle shapes.Also,the nanofluid having the platelet-shaped nanoparticles leads to the greatest h,and the nanofluid having the oblate spheroid particles has the lowest h and smallest pressure loss.In contrast,the nanofluid having the platelet-shaped nanoparticles leads to the highest pressure loss.The mean temperature of the bottom surface,thermal resistance,and temperature distribution uniformity decrease by the rise in the Reynolds number for all of the particle shapes.Also,the best distribution of the temperature and the lowest thermal resistance are observed for the suspension containing the platelet particles.Thereby,the thermal resistance of the nanofluid with the platelet particles shows a 9.5%decrement compared to that with the oblate spheroid particles at Re=300.For all the nanoparticle shapes,the figure of merit(FoM)uplifts by elevating the Re,while the nanofluids containing the brickand oblate spheroid-shaped nanoparticles demonstrate the highest FoM values. 展开更多
关键词 NANOFLUID Thermohydraulic performance Nanoparticle shape Microchannel heat sink Boehmite nanoparticles
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Heat Transfer Performance and Structural Optimization of a Novel Micro-channel Heat Sink
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作者 Jianhua Xiang Liangming Deng +3 位作者 Chao Zhou Hongliang Zhao Jiale Huang Sulian Tao 《Chinese Journal of Mechanical Engineering》 SCIE EI CAS CSCD 2022年第2期189-200,共12页
With the advent of the 5G era,the design of electronic equipment is developing towards thinness,intelligence and multi-function,which requires higher cooling performance of the equipment.Micro-channel heat sink is pro... With the advent of the 5G era,the design of electronic equipment is developing towards thinness,intelligence and multi-function,which requires higher cooling performance of the equipment.Micro-channel heat sink is promising for the heat dissipation of super-thin electronic equipment.In this study,thermal resistance theoretical model of the micro-channel heat sink was first established.Then,fabrication process of the micro-channel heat sink was introduced.Subsequently,heat transfer performance of the fabricated micro-channel heat sink was tested through the developed testing platform.Results show that the developed micro-channel heat sink has more superior heat dissipation performance over conventional metal solid heat sink and it is well suited for high power LEDs application.Moreover,the micro-channel structures in the heat sink were optimized by orthogonal test.Based on the orthogonal optimization,heat dissipation performance of the micro-channel radiator was further improved. 展开更多
关键词 MICRO-CHANNEL Phase change heat sink heat transfer performance testing Finite element simulation Orthogonal test
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Modeling and Simulation of a Hybrid Jet-Impingement/Micro-Channel Heat Sink
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作者 Taidong Xu Hao Liu +2 位作者 Dejun Zhang Yadong Li Xiaoming Zhou 《Fluid Dynamics & Materials Processing》 EI 2021年第1期109-121,共13页
With the progressive increase in the number of transistors that can be accommodated on a single integrated circuit,new strategies are needed to extract heat from these devices in an efficient way.In this regard method... With the progressive increase in the number of transistors that can be accommodated on a single integrated circuit,new strategies are needed to extract heat from these devices in an efficient way.In this regard methods based on the combination of the so-called“jet impingement”and“micro-channel”approaches seem extremely promising for possible improvement and future applications in electronics as well as the aerospace and biomedical fields.In this paper,a hybrid heat sink based on these two technologies is analysed in the frame of an integrated model.Dedicated CFD simulation of the coupled flow/temperature fields and orthogonal tests are performed in order to optimize the overall design.The influence of different sets of structural parameters on the cooling performance is examined.It is shown that an optimal scheme exists for which favourable performance can be obtained in terms of hot spot temperature decrease and thermal uniformity improvement. 展开更多
关键词 Jet impingement MICRO-CHANNEL heat sink numerical simulation orthogonal test
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Second Law Analysis and Optimization of Elliptical Pin Fin Heat Sinks Using Firefly Algorithm
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作者 Nawaf N.Hamadneh Waqar A.Khan Ilyas Khan 《Computers, Materials & Continua》 SCIE EI 2020年第11期1015-1032,共18页
One of the most significant considerations in the design of a heat sink is thermal management due to increasing thermal flux and miniature in size.These heat sinks utilize plate or pin fins depending upon the required... One of the most significant considerations in the design of a heat sink is thermal management due to increasing thermal flux and miniature in size.These heat sinks utilize plate or pin fins depending upon the required heat dissipation rate.They are designed to optimize overall performance.Elliptical pin fin heat sinks enhance heat transfer rates and reduce the pumping power.In this study,the Firefly Algorithm is implemented to optimize heat sinks with elliptical pin-fins.The pin-fins are arranged in an inline fashion.The nature-inspired metaheuristic algorithm performs powerfully and efficiently in solving numerical global optimization problems.Based on mass,energy,and entropy balance,three models are developed for thermal resistance,hydraulic resistance,and entropy generation rate in the heat sink.The major axis is used as the characteristic length,and the maximum velocity is used as the reference velocity.The entropy generation rate comprises the combined effect of thermal resistance and pressure drop.The total EGR is minimized by utilizing the firefly algorithm.The optimization model utilizes analytical/empirical correlations for the heat transfer coefficients and friction factors.It is shown that both thermal resistance and pressure drop can be simultaneously optimized using this algorithm.It is demonstrated that the performance of FFA is much better than PPA. 展开更多
关键词 Firefly algorithm mathematical models entropy generation rate elliptical pin-fin heat sinks thermal resistance pressure drop
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Effects of the porous medium and water-silver biological nanofluid on the performance of a newly designed heat sink by using first and second laws of thermodynamics
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作者 Amin Shahsavar Sajad Entezari +1 位作者 Davood Toghraie Pouya Barnoon 《Chinese Journal of Chemical Engineering》 SCIE EI CAS CSCD 2020年第11期2928-2937,共10页
The aim of this numerical investigation is to evaluate the laminar forced convection of biologically synthesized water-silver nanofluid through a heat sink(HS)filled with porous foam(PHS)using first and second laws of... The aim of this numerical investigation is to evaluate the laminar forced convection of biologically synthesized water-silver nanofluid through a heat sink(HS)filled with porous foam(PHS)using first and second laws of thermodynamics.The impacts of inlet velocity(V=0.5–3 m·s^-1)and volume fraction of nanofluid(φ=0–1%)on the performance metrics of HS are assessed and the outcomes are compared with those of the non-porous HS(NHS).The outcomes revealed that for both the PHS and NHS,the increase of V causes an intensification in convection coefficient,pumping power,and entropy generation due to fluid friction,while the maximum CPU temperature,thermal resistance,and entropy generation due to the heat transfer reduces by boosting V.Also,it was found that the augmentation of V results in intensification in convection coefficient,pumping power,overall hydrothermal performance,and frictional entropy generation,while the opposite is true for maximum CPU temperature,thermal resistance,and thermal entropy generation.Furthermore,it was reported that,except forφ=0.5%,the overall hydrothermal performance of NHS is better than that of PHS,while PHS has better second-law performance than NHS in all the studied cases.Also,it can be concluded that the best hydrothermal performance for PHS belongs toφ=1%and V=0.5 m·s^-1,while for NHS,these values are 1%and 2 m·s^-1. 展开更多
关键词 Porous medium heat sink First and second laws of thermodynamics Biologically prepared water-silver nanofluid
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A CMOS Compatible MEMS Pirani Vacuum Gauge with Monocrystal Silicon Heaters and Heat Sinks
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作者 张乐民 焦斌斌 +3 位作者 云世昌 孔延梅 辜志伟 陈大鹏 《Chinese Physics Letters》 SCIE CAS CSCD 2017年第2期52-55,共4页
We present a micro-Pirani vacuum gauge using the low-resistivity monocrystal silicon as the heaters and heat sinks fabricated by the post complementary metal oxide semiconductor (CMOS) microelectromechanical system ... We present a micro-Pirani vacuum gauge using the low-resistivity monocrystal silicon as the heaters and heat sinks fabricated by the post complementary metal oxide semiconductor (CMOS) microelectromechanical system (MEMS) process. The metal interconnection of the device is fabricated by a 0.5 μm standard CMOS process on 8-inch silicon wafer. Then, a SiO2-Si low-temperature fusion bonding is developed to bond the CMOS wafer and the MEMS wafer, with the electrical connection realized by the tungsten through silicon via process. Wafer- level A1Ge euteetic bonding is adopted to package the Pirani gauge in a non-hermetic cavity to protect the gauge from being damaged or contaminated in the dicing and assembling process, and to make it suitable for actual applications. To increase the accuracy of the test and restrain negative influence of temperature drift, the Wheatstone bridge structure is introduced. The test results show that before capping, the gauge has an average sensitivity of 1.04 × 104 K.W-1Torr-1 in dynamic range of 0.01 20 Torr. After capping, the sensitivity of the gauge does not decrease but increases to 1.12 × 104 K.W-1 Torr-1. 展开更多
关键词 A CMOS Compatible MEMS Pirani Vacuum Gauge with Monocrystal Silicon heaters and heat sinks
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关于“bow wave”和“heat sink”的正确译法
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作者 吴承康 《中国科技术语》 2009年第6期52-52,共1页
在概念上,bow wave应译为"头波"而不是"弓形波"。同样,heat sink应译为"热汇"而不是"热沉"。
关键词 弓形波 头波 热汇 热沉 英译
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Fabrication, Microstructure, Thermal and Electrical Properties of Copper Heat Sink Composites
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作者 Walid Daoush Ahmed Swidan +1 位作者 Gamal Abd El-Aziz Mohamed Abdelhalim 《Materials Sciences and Applications》 2016年第9期542-561,共21页
Copper as well as copper base composites reinforced with coated and uncoated 1 wt% diamond, graphite particles or short carbon fibers are prepared by powder metallurgy process. The reinforcement particles were encapsu... Copper as well as copper base composites reinforced with coated and uncoated 1 wt% diamond, graphite particles or short carbon fibers are prepared by powder metallurgy process. The reinforcement particles were encapsulated with silver as well as copper layer by using the electroless deposition technique to investigate the influence of the reinforcement surface coating on the microstructure, density, electrical and thermal properties of the sintered samples. The coated and the uncoated powders were cold compacted at 600 MPa, and then sintered at 1173 K (900&deg;C) for 2 h under hydrogen atmosphere. The phase composition, morphology and microstructure of the prepared powders as well as the copper base sintered composites were investigated using X-ray diffraction analysis (XRD) and Scanning Electron Microscope (SEM) equipped with an Energy Dispersive Spectrometer (EDS) respectively. The density of the sintered composites was measured by Archimedes method. The copper base consolidated composites had a density up to 96% and the reinforcement coated particles were distributed uniformly within the copper matrix better than the uncoated one. The electrical resistivity at room temperature and the heat transfer conduction of the produced samples were measured in a temperature range between 323 K (50&deg;C) and 393 K (120&deg;C). The results observed that the sintered materials prepared from the coated powder have lower electrical resistivity than the sintered materials prepared from the mixed powders. On the other hand the thermal conductivity values were calculated using the heat transfer conduction values by means of the Fourier formula. The results observed that the thermal conductivity of copper is (391 W/m&middot;K), 1 wt% diamond/Cu is (408 W/m&middot;K), 1 wt% graphite coated silver/Cu is (393 W/m&middot;K), 1 wt% Cu coated short carbon fiber/Cu is (393 W/m&middot;K), graphite/Cu is (383 W/m&middot;K) and short carbon fiber/Cu is (382 W/m&middot;K). The obtained composites are expected to be suitable for heat sink applications. The heat transfer testing experiments were done. The forced convection of the present work was done and compared with the previous work in the literature, and satisfactory agreement was achieved. 展开更多
关键词 heat sink Powder Metallurgy Matrix Composites Electrical Resistivity Thermal Conductivity Natural Forced Convection
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Fabrication, microstructure and properties of SiCp/Cu heat sink materials 被引量:2
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作者 KANG Suk-bong 《Rare Metals》 SCIE EI CAS CSCD 2006年第z2期232-236,共5页
Cu-coated powder was fabricated by electroless plating process, and the composition and morphology of coated powder were studied. Moreover, Cu-30, 40, 50 vol.%SiCp heat sink materials were fabricated by hot pressing u... Cu-coated powder was fabricated by electroless plating process, and the composition and morphology of coated powder were studied. Moreover, Cu-30, 40, 50 vol.%SiCp heat sink materials were fabricated by hot pressing using coated and uncoated powder. And the microstructure and thermophysical properties of the heat sink materials were also studied. The results show that SiCp particles distribute uniformly in heat sink materials and the interface between SiCp particles and Cu matrix is clear and well bonded. On the condition of same volume fraction of SiCp, the thermal conductivity of the material using coated powder is larger than that of the material using uncoated powder. Under experiment conditions, the thermal conductivity and coefficient of thermal expansion of Cu-30 vol.%SiCp heat sink material is 236.2 W·m-1·K-1 and 9.9×10-6/K (30-200 ℃) respectively. It provides important reference data for future experiments. 展开更多
关键词 heat sink material ELECTROLESS copper PLATING coefficient of THERMAL expansion THERMAL conductivity
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Thermal analysis of an LED module with a novelly assembled heat pipe heat sink 被引量:2
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作者 汤勇 陈丘 +3 位作者 关沃欢 李宗涛 余彬海 袁伟 《Journal of Central South University》 SCIE EI CAS CSCD 2017年第4期921-928,共8页
This work aims to improve the thermal performance of a light emitting diode(LED) module by employing a novelly assembled heat pipe heat sink. The heat pipe was embedded into the heat sink by a phase change expansion a... This work aims to improve the thermal performance of a light emitting diode(LED) module by employing a novelly assembled heat pipe heat sink. The heat pipe was embedded into the heat sink by a phase change expansion assembly(PCEA) process, which was developed by both finite element(FE) analysis and experiments. Heat transfer performance and optical performance of the LED modules were experimentally investigated and discussed. Compared to the LED module with a traditionally assembled heat pipe heat sink, the LED module employing the PCEA process exhibits about 20% decrease in the thermal resistance from the MCPCB to the heat pipe. The junction temperature is 4% lower and the luminous flux is 2% higher. The improvement in the thermal and optical performance is important to the high power LED applications. 展开更多
关键词 light EMITTING DIODE (LED) phase change assembly heat pipe heat sink thermal analysis
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Investigation of heat sink of endothermic hydrocarbon fuels 被引量:1
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作者 郭永胜 林瑞森 《Journal of Zhejiang University-Science A(Applied Physics & Engineering)》 SCIE EI CAS CSCD 2005年第7期632-635,共4页
Endothermic hydrocarbon fuels are advanced coolants for high-temperature structures of spacecraft. No data of tested-cooling-ability of endothermic fuels have been broadly discussed in literature. In this work a high-... Endothermic hydrocarbon fuels are advanced coolants for high-temperature structures of spacecraft. No data of tested-cooling-ability of endothermic fuels have been broadly discussed in literature. In this work a high-temperature flow calorimeter was designed, and the cooling capacity of six different hydrocarbon fuels were measured. Experimental results showed that these hydrocarbon fuels have capacity for cooling high-temperature structures, and that the cooling capacity of fuel N-1 can reach 3.15 M J/kg, which can nearly satisfy the requirement of thermal management for a Mach 3 cruise aircraft, whose heat sink requirement is about 3.5 M J/kg. The endothermic velocity of hydrocarbon fuels was also measured by the calorimeter. 展开更多
关键词 碳氢燃料 吸热性质 裂解反应 热量管理 冷却能力
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Thermal Analysis of High Power LED on Heat Sink 被引量:2
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作者 WANG Cai-feng NIU Ping-juan GAO Tie-cheng YANG Guang-hua FU Xian-song 《Semiconductor Photonics and Technology》 CAS 2008年第3期192-195,共4页
Thermal management of LED junction temperature is one of the fundamental technologies for LED lamp to ensure basic specifications in many aspects. Analysed is the high power LED's distribution on heat sink. Using ... Thermal management of LED junction temperature is one of the fundamental technologies for LED lamp to ensure basic specifications in many aspects. Analysed is the high power LED's distribution on heat sink. Using mathematical statistical methods, a formula is conlcuded to calculate the size of heat sink under LED safe working temperature, which provides a method to researchers and LED lamp manufacturers. 展开更多
关键词 二极管 集成技术 半导体 技术性能
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Forming technology of boiling structure on evaporation surface of phase-change heat sink for high-power light emitting diode 被引量:1
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作者 向建化 叶邦彦 +2 位作者 汤勇 周伟 胡志华 《Journal of Central South University》 SCIE EI CAS 2010年第3期544-548,共5页
Boiling structures on evaporation surface of red copper sheet with a diameter (D) of 10 mm and a wall thickness (h) of 1 mm were processed by the ploughing-extrusion (P-E) processing method, which is one part of the p... Boiling structures on evaporation surface of red copper sheet with a diameter (D) of 10 mm and a wall thickness (h) of 1 mm were processed by the ploughing-extrusion (P-E) processing method, which is one part of the phase-change heat sink for high power (HP) light emitting diode (LED). The experimental results show that two different structures of rectangular- and triangular-shaped micro-grooves are formed in P-E process. When P-E depth (ap), interval of helical grooves (dp) and rotation speed (n) are 0.12 mm, 0.2 mm and 100 r/min, respectively, the boiling structures of triangular-shaped grooves with the fin height of 0.15 mm that has good evaporation performance are obtained. The shapes of the boiling structures are restricted by dp and ap, and dp is determined by n and amount of feed (f). The ploughing speed has an important influence on the formation of groove structure in P-E process. 展开更多
关键词 发光二极管灯 表面结构 蒸发性能 高功率 沸腾 成形技术 相变 散热片
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