With the widespread use of high-power and highly integrated insulated gate bipolar transistor(IGBT),their cooling methods have become challenging.This paper proposes a liquid cooling scheme for heavy-duty automated gu...With the widespread use of high-power and highly integrated insulated gate bipolar transistor(IGBT),their cooling methods have become challenging.This paper proposes a liquid cooling scheme for heavy-duty automated guided vehicle(AGV)motor driver in port environment,and improves heat dissipation by analyzing and optimizing the core component of finned heat sink.Firstly,the temperature distribution of the initial scheme is studied by using Fluent software,and the heat transfer characteristics of the finned heat sink are obtained through numerical analysis.Secondly,an orthogonal test is designed and combined with the response surface methodology to optimize the structural parameters of the finned heat sink,resulting in a 14.57%increase in the heat dissipation effect.Finally,the effectiveness of heat dissipation enhancement is verified.This work provides valuable insights into improving the heat dissipation of IGBT modules and heat sinks,and provides guidance for their future applications.展开更多
Extensive improvements in small-scale thermal systems in electronic circuits,automotive industries,and microcomputers conduct the study of microsystems as essential.Flow and thermic field characteristics of the cohere...Extensive improvements in small-scale thermal systems in electronic circuits,automotive industries,and microcomputers conduct the study of microsystems as essential.Flow and thermic field characteristics of the coherent nanofluid-guided microchannel heat sink are described in this perusal.The porous media approximate was used to search the heat distribution in the expanded sheet and Cu:γ-AlOOH/water.A hybrid blend of Boehme copper and aluminum nanoparticles is evaluated to have a cooling effect on the microchannel heat sink.By using Akbari Ganji and finite element methods,linear and non-linear differential equations as well as simple dimensionless equations have been analyzed.The purpose of this study is to investigate the fluid and thermal parameters of copper hybrid solution added to water,such as Nusselt number and Darcy number so that we can reach the best cooling of the fluid.Also,by installing a piece of fin on the wall of the heat sink,the coefficient of conductive heat transfer and displacement heat transfer with the surrounding air fluid increases,and the efficiency of the system increases.The overall results show that expanding values on the NP(series heat transfer fluid system maximizes performance with temperatures)volume division of copper,as well as boehmite alumina particles,lead to a decrease within the stream velocity of the Cu:AlOOH/water.Increasing the volume fraction of nanoparticles in the hybrid mixture decreases the temperature of the solid surface and the hybrid nanofluid.The Brownian movement improves as the volume percentage of nanoparticles in the hybrid mixture grows,spreading the heat across the environment.As a result,heat transmission rates rise.As the Darcy number increases,the thermal field for solid sections and Cu:AlOOH/water improves.展开更多
Considering the limitation in current manufacturing technology of commercial pin fin heat sinks,a new fabric heat sink has been designed. However,it is lack of an understanding of the heat transferring performance of ...Considering the limitation in current manufacturing technology of commercial pin fin heat sinks,a new fabric heat sink has been designed. However,it is lack of an understanding of the heat transferring performance of this new kind of heat sink. In this study,the finite element method (FEM) was used to predict the heat transferring performance of fabric heat sink under the condition of natural convection and forced convection, and its heat transferring performance was compared with that of pin fin heat sink. The results showed that in the condition of natural convection the heat transferring performance of pin fin heat sink was better than that of fabric heat sink, and vice versa under the forced convection condition.展开更多
Reaxgen program for the pyrolysis mechanism of cycloalkanes was adopted to simulate the heat sink of substituted cyclohexanes. Thermal cracking of cyclohexanes was performed to examine the cracking performance, wherei...Reaxgen program for the pyrolysis mechanism of cycloalkanes was adopted to simulate the heat sink of substituted cyclohexanes. Thermal cracking of cyclohexanes was performed to examine the cracking performance, wherein the substituent effects were detailedly discussed under supercritical condition. It was found that Reaxgen program played a good part in the screening and optimization of cyclohexanes. A good agreement with the experimental data for the mono-substituted and bi-substituted cyclohexanes was demonstrated, however, some deviation for the tri-substituted cyclohexanes were observed. The experiment results indicated that the gaseous product yield increased sharply for mono- substituted cyclohexanes with short substituents containing no more than two carbons. Nevertheless, continuous increase in the alkyl chain depressed the gaseous product yield smoothly. The cyclic substituent dramatically inhibited the pyrolysis of cyclohexanes. All the substituents but cyclohexyl had no obvious effect on the yield of hydrogen and olefins (≤C4). For bi-substituted cyclohexanes, the more close the distance between the two substituents, the higher the gaseous product yield was obtained. However, opposite result on the selectivity to hydrogen and olefins (≤C4) was generally obtained except 1,3-dimethylcyclohexane. The position of tri-substituents acted little significance on the gaseous product yield, as well as the selectivity to hydrogen and olefins (≤C4).展开更多
An actively water-cooled limiter has been designed for the long pulse operation of an HT-7 device, by adopting an integrated structure-doped graphite and a copper alloy heat sink with a super carbon sheet serving as a...An actively water-cooled limiter has been designed for the long pulse operation of an HT-7 device, by adopting an integrated structure-doped graphite and a copper alloy heat sink with a super carbon sheet serving as a compliant layer between them. The behaviors of the integrated structure were evaluated in an electron beam facility under different heat loads and cooling conditions. The surface temperature and bulk temperature distribution were carefully measured by optical pyrometers and thermocouples under a steady state heat flux of 1 to 5 MW/m^2 and a water flow rate of 3 m^3/h, 4.5 m^3/h and 6 m^3/h, respectively. It was found that the surface temperature increased rapidly with the heat flux rising, but decreased only slightly with the water flow rate rising. The surface temperature reached approximately 1200℃ at 5 MW/m^2 of heat flux and 6 m^3/h of water flow. The primary experimental results indicate that the integrated design meets the requirements for the heat expelling capacity of the HT-7 device. A set of numerical simulations was also completed, whose outcome was in good accord with the experimental results.展开更多
Microchannel heat sinks(MCHSs)are promising thermal solutions in miniaturized or compact devices.Lightweight aspect has been given huge emphasis in recent years.Metal-based materials are commonly used to fabricate MCH...Microchannel heat sinks(MCHSs)are promising thermal solutions in miniaturized or compact devices.Lightweight aspect has been given huge emphasis in recent years.Metal-based materials are commonly used to fabricate MCHSs due to their high thermal conductivity.Consequently,MCHSs are heavy due to the high density of these materials albeit the small footprint of MCHSs.Polymer-based materials are interesting alternatives.Despite their poor thermal conductivity,lightweight feature attracts the interest of researchers.Heat transfer is a conjugate process of heat conduction and heat convection.Poor heat conductions aspect may be compensated through enhancement of heat convection aspects.Although polymer-based materials have been used in microscale heat transfer studies,their focus was not on their feasibility.The present study aims to evaluate the feasibility of polymer-based MCHSs as thermal solutions.The effect of thermal conductivity of fabrication materials,including polymer-based PDMS,PTFE,PDMS/MWCNT,and metal-based aluminum,on the thermal performance of MCHSs was investigated and compared at various inlet flow rate,fluid thermal conductivity,and microchannel ratio at different constant heat fluxes using three-dimensional CFD approach.Results showed that the thermal performance of MCHSs was greatly affected by the heat conduction aspect in which poor heat conduction limited the thermal performance improvement due to enhanced heat convection aspects.This suggests polymer-based materials have the potential for heat transfer applications through thermal conductivity enhancement.This was confirmed in the further analysis using a recently proposed high thermal conductivity polymer-based graphite/epoxy MCHS and a hybrid-based PDMS/aluminum MCHS.展开更多
A single concentrator solar cell model with a heat sink is established to simulate the thermal performance of the system by varying the number, height, and thickness of fins, the base thickness and thermal resistance ...A single concentrator solar cell model with a heat sink is established to simulate the thermal performance of the system by varying the number, height, and thickness of fins, the base thickness and thermal resistance of the thermal conductive adhesive. Influence disciplines of those parameters on temperatures of the solar cell and heat sink are obtained. With optimized number, height and thickness of fins, and the thickness values of base of 8, 1.4 cm, 1.5 mm, and 2 mm, the lowest temperatures of the solar cell and heat sink are 41.7 ~C and 36.3 ~C respectively. A concentrator solar cell prototype with a heat sink fabricated based on the simulation optimized structure is built. Outdoor temperatures of the prototype are tested. Temperatures of the solar cell and heat sink are stabilized with time continuing at about 37 ℃-38 ℃ and 35 ℃-36 ℃respectively, slightly lower than the simulation results because of effects of the wind and cloud. Thus the simulation model enables to predict the thermal performance of the system, and the simulation results can be a reference for designing heat sinks in the field of single concentrator solar cells.展开更多
In this article,the thermal–hydraulic efficacy of a boehmite nanofluid with various particle shapes is evaluated inside a microchannel heat sink.The study is done for particle shapes of platelet,cylinder,blade,brick,...In this article,the thermal–hydraulic efficacy of a boehmite nanofluid with various particle shapes is evaluated inside a microchannel heat sink.The study is done for particle shapes of platelet,cylinder,blade,brick,and oblate spheroid at Reynolds numbers(Re)of 300,800,1300,and 1800.The particle volume fraction is assumed invariant for all of the nanoparticle shapes.The heat transfer coefficient(h),flow irregularities,pressure loss,and pumping power heighten by the elevation of the Re for all of the nanoparticle shapes.Also,the nanofluid having the platelet-shaped nanoparticles leads to the greatest h,and the nanofluid having the oblate spheroid particles has the lowest h and smallest pressure loss.In contrast,the nanofluid having the platelet-shaped nanoparticles leads to the highest pressure loss.The mean temperature of the bottom surface,thermal resistance,and temperature distribution uniformity decrease by the rise in the Reynolds number for all of the particle shapes.Also,the best distribution of the temperature and the lowest thermal resistance are observed for the suspension containing the platelet particles.Thereby,the thermal resistance of the nanofluid with the platelet particles shows a 9.5%decrement compared to that with the oblate spheroid particles at Re=300.For all the nanoparticle shapes,the figure of merit(FoM)uplifts by elevating the Re,while the nanofluids containing the brickand oblate spheroid-shaped nanoparticles demonstrate the highest FoM values.展开更多
With the advent of the 5G era,the design of electronic equipment is developing towards thinness,intelligence and multi-function,which requires higher cooling performance of the equipment.Micro-channel heat sink is pro...With the advent of the 5G era,the design of electronic equipment is developing towards thinness,intelligence and multi-function,which requires higher cooling performance of the equipment.Micro-channel heat sink is promising for the heat dissipation of super-thin electronic equipment.In this study,thermal resistance theoretical model of the micro-channel heat sink was first established.Then,fabrication process of the micro-channel heat sink was introduced.Subsequently,heat transfer performance of the fabricated micro-channel heat sink was tested through the developed testing platform.Results show that the developed micro-channel heat sink has more superior heat dissipation performance over conventional metal solid heat sink and it is well suited for high power LEDs application.Moreover,the micro-channel structures in the heat sink were optimized by orthogonal test.Based on the orthogonal optimization,heat dissipation performance of the micro-channel radiator was further improved.展开更多
With the progressive increase in the number of transistors that can be accommodated on a single integrated circuit,new strategies are needed to extract heat from these devices in an efficient way.In this regard method...With the progressive increase in the number of transistors that can be accommodated on a single integrated circuit,new strategies are needed to extract heat from these devices in an efficient way.In this regard methods based on the combination of the so-called“jet impingement”and“micro-channel”approaches seem extremely promising for possible improvement and future applications in electronics as well as the aerospace and biomedical fields.In this paper,a hybrid heat sink based on these two technologies is analysed in the frame of an integrated model.Dedicated CFD simulation of the coupled flow/temperature fields and orthogonal tests are performed in order to optimize the overall design.The influence of different sets of structural parameters on the cooling performance is examined.It is shown that an optimal scheme exists for which favourable performance can be obtained in terms of hot spot temperature decrease and thermal uniformity improvement.展开更多
One of the most significant considerations in the design of a heat sink is thermal management due to increasing thermal flux and miniature in size.These heat sinks utilize plate or pin fins depending upon the required...One of the most significant considerations in the design of a heat sink is thermal management due to increasing thermal flux and miniature in size.These heat sinks utilize plate or pin fins depending upon the required heat dissipation rate.They are designed to optimize overall performance.Elliptical pin fin heat sinks enhance heat transfer rates and reduce the pumping power.In this study,the Firefly Algorithm is implemented to optimize heat sinks with elliptical pin-fins.The pin-fins are arranged in an inline fashion.The nature-inspired metaheuristic algorithm performs powerfully and efficiently in solving numerical global optimization problems.Based on mass,energy,and entropy balance,three models are developed for thermal resistance,hydraulic resistance,and entropy generation rate in the heat sink.The major axis is used as the characteristic length,and the maximum velocity is used as the reference velocity.The entropy generation rate comprises the combined effect of thermal resistance and pressure drop.The total EGR is minimized by utilizing the firefly algorithm.The optimization model utilizes analytical/empirical correlations for the heat transfer coefficients and friction factors.It is shown that both thermal resistance and pressure drop can be simultaneously optimized using this algorithm.It is demonstrated that the performance of FFA is much better than PPA.展开更多
The aim of this numerical investigation is to evaluate the laminar forced convection of biologically synthesized water-silver nanofluid through a heat sink(HS)filled with porous foam(PHS)using first and second laws of...The aim of this numerical investigation is to evaluate the laminar forced convection of biologically synthesized water-silver nanofluid through a heat sink(HS)filled with porous foam(PHS)using first and second laws of thermodynamics.The impacts of inlet velocity(V=0.5–3 m·s^-1)and volume fraction of nanofluid(φ=0–1%)on the performance metrics of HS are assessed and the outcomes are compared with those of the non-porous HS(NHS).The outcomes revealed that for both the PHS and NHS,the increase of V causes an intensification in convection coefficient,pumping power,and entropy generation due to fluid friction,while the maximum CPU temperature,thermal resistance,and entropy generation due to the heat transfer reduces by boosting V.Also,it was found that the augmentation of V results in intensification in convection coefficient,pumping power,overall hydrothermal performance,and frictional entropy generation,while the opposite is true for maximum CPU temperature,thermal resistance,and thermal entropy generation.Furthermore,it was reported that,except forφ=0.5%,the overall hydrothermal performance of NHS is better than that of PHS,while PHS has better second-law performance than NHS in all the studied cases.Also,it can be concluded that the best hydrothermal performance for PHS belongs toφ=1%and V=0.5 m·s^-1,while for NHS,these values are 1%and 2 m·s^-1.展开更多
We present a micro-Pirani vacuum gauge using the low-resistivity monocrystal silicon as the heaters and heat sinks fabricated by the post complementary metal oxide semiconductor (CMOS) microelectromechanical system ...We present a micro-Pirani vacuum gauge using the low-resistivity monocrystal silicon as the heaters and heat sinks fabricated by the post complementary metal oxide semiconductor (CMOS) microelectromechanical system (MEMS) process. The metal interconnection of the device is fabricated by a 0.5 μm standard CMOS process on 8-inch silicon wafer. Then, a SiO2-Si low-temperature fusion bonding is developed to bond the CMOS wafer and the MEMS wafer, with the electrical connection realized by the tungsten through silicon via process. Wafer- level A1Ge euteetic bonding is adopted to package the Pirani gauge in a non-hermetic cavity to protect the gauge from being damaged or contaminated in the dicing and assembling process, and to make it suitable for actual applications. To increase the accuracy of the test and restrain negative influence of temperature drift, the Wheatstone bridge structure is introduced. The test results show that before capping, the gauge has an average sensitivity of 1.04 × 104 K.W-1Torr-1 in dynamic range of 0.01 20 Torr. After capping, the sensitivity of the gauge does not decrease but increases to 1.12 × 104 K.W-1 Torr-1.展开更多
Copper as well as copper base composites reinforced with coated and uncoated 1 wt% diamond, graphite particles or short carbon fibers are prepared by powder metallurgy process. The reinforcement particles were encapsu...Copper as well as copper base composites reinforced with coated and uncoated 1 wt% diamond, graphite particles or short carbon fibers are prepared by powder metallurgy process. The reinforcement particles were encapsulated with silver as well as copper layer by using the electroless deposition technique to investigate the influence of the reinforcement surface coating on the microstructure, density, electrical and thermal properties of the sintered samples. The coated and the uncoated powders were cold compacted at 600 MPa, and then sintered at 1173 K (900°C) for 2 h under hydrogen atmosphere. The phase composition, morphology and microstructure of the prepared powders as well as the copper base sintered composites were investigated using X-ray diffraction analysis (XRD) and Scanning Electron Microscope (SEM) equipped with an Energy Dispersive Spectrometer (EDS) respectively. The density of the sintered composites was measured by Archimedes method. The copper base consolidated composites had a density up to 96% and the reinforcement coated particles were distributed uniformly within the copper matrix better than the uncoated one. The electrical resistivity at room temperature and the heat transfer conduction of the produced samples were measured in a temperature range between 323 K (50°C) and 393 K (120°C). The results observed that the sintered materials prepared from the coated powder have lower electrical resistivity than the sintered materials prepared from the mixed powders. On the other hand the thermal conductivity values were calculated using the heat transfer conduction values by means of the Fourier formula. The results observed that the thermal conductivity of copper is (391 W/m·K), 1 wt% diamond/Cu is (408 W/m·K), 1 wt% graphite coated silver/Cu is (393 W/m·K), 1 wt% Cu coated short carbon fiber/Cu is (393 W/m·K), graphite/Cu is (383 W/m·K) and short carbon fiber/Cu is (382 W/m·K). The obtained composites are expected to be suitable for heat sink applications. The heat transfer testing experiments were done. The forced convection of the present work was done and compared with the previous work in the literature, and satisfactory agreement was achieved.展开更多
Cu-coated powder was fabricated by electroless plating process, and the composition and morphology of coated powder were studied. Moreover, Cu-30, 40, 50 vol.%SiCp heat sink materials were fabricated by hot pressing u...Cu-coated powder was fabricated by electroless plating process, and the composition and morphology of coated powder were studied. Moreover, Cu-30, 40, 50 vol.%SiCp heat sink materials were fabricated by hot pressing using coated and uncoated powder. And the microstructure and thermophysical properties of the heat sink materials were also studied. The results show that SiCp particles distribute uniformly in heat sink materials and the interface between SiCp particles and Cu matrix is clear and well bonded. On the condition of same volume fraction of SiCp, the thermal conductivity of the material using coated powder is larger than that of the material using uncoated powder. Under experiment conditions, the thermal conductivity and coefficient of thermal expansion of Cu-30 vol.%SiCp heat sink material is 236.2 W·m-1·K-1 and 9.9×10-6/K (30-200 ℃) respectively. It provides important reference data for future experiments.展开更多
This work aims to improve the thermal performance of a light emitting diode(LED) module by employing a novelly assembled heat pipe heat sink. The heat pipe was embedded into the heat sink by a phase change expansion a...This work aims to improve the thermal performance of a light emitting diode(LED) module by employing a novelly assembled heat pipe heat sink. The heat pipe was embedded into the heat sink by a phase change expansion assembly(PCEA) process, which was developed by both finite element(FE) analysis and experiments. Heat transfer performance and optical performance of the LED modules were experimentally investigated and discussed. Compared to the LED module with a traditionally assembled heat pipe heat sink, the LED module employing the PCEA process exhibits about 20% decrease in the thermal resistance from the MCPCB to the heat pipe. The junction temperature is 4% lower and the luminous flux is 2% higher. The improvement in the thermal and optical performance is important to the high power LED applications.展开更多
Endothermic hydrocarbon fuels are advanced coolants for high-temperature structures of spacecraft. No data of tested-cooling-ability of endothermic fuels have been broadly discussed in literature. In this work a high-...Endothermic hydrocarbon fuels are advanced coolants for high-temperature structures of spacecraft. No data of tested-cooling-ability of endothermic fuels have been broadly discussed in literature. In this work a high-temperature flow calorimeter was designed, and the cooling capacity of six different hydrocarbon fuels were measured. Experimental results showed that these hydrocarbon fuels have capacity for cooling high-temperature structures, and that the cooling capacity of fuel N-1 can reach 3.15 M J/kg, which can nearly satisfy the requirement of thermal management for a Mach 3 cruise aircraft, whose heat sink requirement is about 3.5 M J/kg. The endothermic velocity of hydrocarbon fuels was also measured by the calorimeter.展开更多
Thermal management of LED junction temperature is one of the fundamental technologies for LED lamp to ensure basic specifications in many aspects. Analysed is the high power LED's distribution on heat sink. Using ...Thermal management of LED junction temperature is one of the fundamental technologies for LED lamp to ensure basic specifications in many aspects. Analysed is the high power LED's distribution on heat sink. Using mathematical statistical methods, a formula is conlcuded to calculate the size of heat sink under LED safe working temperature, which provides a method to researchers and LED lamp manufacturers.展开更多
Boiling structures on evaporation surface of red copper sheet with a diameter (D) of 10 mm and a wall thickness (h) of 1 mm were processed by the ploughing-extrusion (P-E) processing method, which is one part of the p...Boiling structures on evaporation surface of red copper sheet with a diameter (D) of 10 mm and a wall thickness (h) of 1 mm were processed by the ploughing-extrusion (P-E) processing method, which is one part of the phase-change heat sink for high power (HP) light emitting diode (LED). The experimental results show that two different structures of rectangular- and triangular-shaped micro-grooves are formed in P-E process. When P-E depth (ap), interval of helical grooves (dp) and rotation speed (n) are 0.12 mm, 0.2 mm and 100 r/min, respectively, the boiling structures of triangular-shaped grooves with the fin height of 0.15 mm that has good evaporation performance are obtained. The shapes of the boiling structures are restricted by dp and ap, and dp is determined by n and amount of feed (f). The ploughing speed has an important influence on the formation of groove structure in P-E process.展开更多
基金Supported by the National Key Research and Development Plan Program(No.2022YFB4701101)National Natural Science Foundation of Chi-na(No.U1913211)Natural Science Foundation of Hebei Province of China(No.F2021202062)。
文摘With the widespread use of high-power and highly integrated insulated gate bipolar transistor(IGBT),their cooling methods have become challenging.This paper proposes a liquid cooling scheme for heavy-duty automated guided vehicle(AGV)motor driver in port environment,and improves heat dissipation by analyzing and optimizing the core component of finned heat sink.Firstly,the temperature distribution of the initial scheme is studied by using Fluent software,and the heat transfer characteristics of the finned heat sink are obtained through numerical analysis.Secondly,an orthogonal test is designed and combined with the response surface methodology to optimize the structural parameters of the finned heat sink,resulting in a 14.57%increase in the heat dissipation effect.Finally,the effectiveness of heat dissipation enhancement is verified.This work provides valuable insights into improving the heat dissipation of IGBT modules and heat sinks,and provides guidance for their future applications.
文摘Extensive improvements in small-scale thermal systems in electronic circuits,automotive industries,and microcomputers conduct the study of microsystems as essential.Flow and thermic field characteristics of the coherent nanofluid-guided microchannel heat sink are described in this perusal.The porous media approximate was used to search the heat distribution in the expanded sheet and Cu:γ-AlOOH/water.A hybrid blend of Boehme copper and aluminum nanoparticles is evaluated to have a cooling effect on the microchannel heat sink.By using Akbari Ganji and finite element methods,linear and non-linear differential equations as well as simple dimensionless equations have been analyzed.The purpose of this study is to investigate the fluid and thermal parameters of copper hybrid solution added to water,such as Nusselt number and Darcy number so that we can reach the best cooling of the fluid.Also,by installing a piece of fin on the wall of the heat sink,the coefficient of conductive heat transfer and displacement heat transfer with the surrounding air fluid increases,and the efficiency of the system increases.The overall results show that expanding values on the NP(series heat transfer fluid system maximizes performance with temperatures)volume division of copper,as well as boehmite alumina particles,lead to a decrease within the stream velocity of the Cu:AlOOH/water.Increasing the volume fraction of nanoparticles in the hybrid mixture decreases the temperature of the solid surface and the hybrid nanofluid.The Brownian movement improves as the volume percentage of nanoparticles in the hybrid mixture grows,spreading the heat across the environment.As a result,heat transmission rates rise.As the Darcy number increases,the thermal field for solid sections and Cu:AlOOH/water improves.
基金The Fundamental Research Funds for the Central Universities,China
文摘Considering the limitation in current manufacturing technology of commercial pin fin heat sinks,a new fabric heat sink has been designed. However,it is lack of an understanding of the heat transferring performance of this new kind of heat sink. In this study,the finite element method (FEM) was used to predict the heat transferring performance of fabric heat sink under the condition of natural convection and forced convection, and its heat transferring performance was compared with that of pin fin heat sink. The results showed that in the condition of natural convection the heat transferring performance of pin fin heat sink was better than that of fabric heat sink, and vice versa under the forced convection condition.
基金supported by the Special Program for Key Basic Research in China(Grant No.0040202204)
文摘Reaxgen program for the pyrolysis mechanism of cycloalkanes was adopted to simulate the heat sink of substituted cyclohexanes. Thermal cracking of cyclohexanes was performed to examine the cracking performance, wherein the substituent effects were detailedly discussed under supercritical condition. It was found that Reaxgen program played a good part in the screening and optimization of cyclohexanes. A good agreement with the experimental data for the mono-substituted and bi-substituted cyclohexanes was demonstrated, however, some deviation for the tri-substituted cyclohexanes were observed. The experiment results indicated that the gaseous product yield increased sharply for mono- substituted cyclohexanes with short substituents containing no more than two carbons. Nevertheless, continuous increase in the alkyl chain depressed the gaseous product yield smoothly. The cyclic substituent dramatically inhibited the pyrolysis of cyclohexanes. All the substituents but cyclohexyl had no obvious effect on the yield of hydrogen and olefins (≤C4). For bi-substituted cyclohexanes, the more close the distance between the two substituents, the higher the gaseous product yield was obtained. However, opposite result on the selectivity to hydrogen and olefins (≤C4) was generally obtained except 1,3-dimethylcyclohexane. The position of tri-substituents acted little significance on the gaseous product yield, as well as the selectivity to hydrogen and olefins (≤C4).
基金The project partially supported by National Natural Science Foundation of China (No. 10275069)
文摘An actively water-cooled limiter has been designed for the long pulse operation of an HT-7 device, by adopting an integrated structure-doped graphite and a copper alloy heat sink with a super carbon sheet serving as a compliant layer between them. The behaviors of the integrated structure were evaluated in an electron beam facility under different heat loads and cooling conditions. The surface temperature and bulk temperature distribution were carefully measured by optical pyrometers and thermocouples under a steady state heat flux of 1 to 5 MW/m^2 and a water flow rate of 3 m^3/h, 4.5 m^3/h and 6 m^3/h, respectively. It was found that the surface temperature increased rapidly with the heat flux rising, but decreased only slightly with the water flow rate rising. The surface temperature reached approximately 1200℃ at 5 MW/m^2 of heat flux and 6 m^3/h of water flow. The primary experimental results indicate that the integrated design meets the requirements for the heat expelling capacity of the HT-7 device. A set of numerical simulations was also completed, whose outcome was in good accord with the experimental results.
基金supported by The Murata Science Foundation[grant numbers 015ME0-031]。
文摘Microchannel heat sinks(MCHSs)are promising thermal solutions in miniaturized or compact devices.Lightweight aspect has been given huge emphasis in recent years.Metal-based materials are commonly used to fabricate MCHSs due to their high thermal conductivity.Consequently,MCHSs are heavy due to the high density of these materials albeit the small footprint of MCHSs.Polymer-based materials are interesting alternatives.Despite their poor thermal conductivity,lightweight feature attracts the interest of researchers.Heat transfer is a conjugate process of heat conduction and heat convection.Poor heat conductions aspect may be compensated through enhancement of heat convection aspects.Although polymer-based materials have been used in microscale heat transfer studies,their focus was not on their feasibility.The present study aims to evaluate the feasibility of polymer-based MCHSs as thermal solutions.The effect of thermal conductivity of fabrication materials,including polymer-based PDMS,PTFE,PDMS/MWCNT,and metal-based aluminum,on the thermal performance of MCHSs was investigated and compared at various inlet flow rate,fluid thermal conductivity,and microchannel ratio at different constant heat fluxes using three-dimensional CFD approach.Results showed that the thermal performance of MCHSs was greatly affected by the heat conduction aspect in which poor heat conduction limited the thermal performance improvement due to enhanced heat convection aspects.This suggests polymer-based materials have the potential for heat transfer applications through thermal conductivity enhancement.This was confirmed in the further analysis using a recently proposed high thermal conductivity polymer-based graphite/epoxy MCHS and a hybrid-based PDMS/aluminum MCHS.
基金supported by the Doctoral Initial Fund of Beijing University of Technology,China(Grant No.X0006015201101)the National Natural Science Foundation of China(Grant Nos.60876006 and 51202007)
文摘A single concentrator solar cell model with a heat sink is established to simulate the thermal performance of the system by varying the number, height, and thickness of fins, the base thickness and thermal resistance of the thermal conductive adhesive. Influence disciplines of those parameters on temperatures of the solar cell and heat sink are obtained. With optimized number, height and thickness of fins, and the thickness values of base of 8, 1.4 cm, 1.5 mm, and 2 mm, the lowest temperatures of the solar cell and heat sink are 41.7 ~C and 36.3 ~C respectively. A concentrator solar cell prototype with a heat sink fabricated based on the simulation optimized structure is built. Outdoor temperatures of the prototype are tested. Temperatures of the solar cell and heat sink are stabilized with time continuing at about 37 ℃-38 ℃ and 35 ℃-36 ℃respectively, slightly lower than the simulation results because of effects of the wind and cloud. Thus the simulation model enables to predict the thermal performance of the system, and the simulation results can be a reference for designing heat sinks in the field of single concentrator solar cells.
文摘In this article,the thermal–hydraulic efficacy of a boehmite nanofluid with various particle shapes is evaluated inside a microchannel heat sink.The study is done for particle shapes of platelet,cylinder,blade,brick,and oblate spheroid at Reynolds numbers(Re)of 300,800,1300,and 1800.The particle volume fraction is assumed invariant for all of the nanoparticle shapes.The heat transfer coefficient(h),flow irregularities,pressure loss,and pumping power heighten by the elevation of the Re for all of the nanoparticle shapes.Also,the nanofluid having the platelet-shaped nanoparticles leads to the greatest h,and the nanofluid having the oblate spheroid particles has the lowest h and smallest pressure loss.In contrast,the nanofluid having the platelet-shaped nanoparticles leads to the highest pressure loss.The mean temperature of the bottom surface,thermal resistance,and temperature distribution uniformity decrease by the rise in the Reynolds number for all of the particle shapes.Also,the best distribution of the temperature and the lowest thermal resistance are observed for the suspension containing the platelet particles.Thereby,the thermal resistance of the nanofluid with the platelet particles shows a 9.5%decrement compared to that with the oblate spheroid particles at Re=300.For all the nanoparticle shapes,the figure of merit(FoM)uplifts by elevating the Re,while the nanofluids containing the brickand oblate spheroid-shaped nanoparticles demonstrate the highest FoM values.
基金Supported by the National Natural Science Foundation of China(Grant Nos.51975135 and 52005422)Guangzhou Science and Technology Project(Grant No.201707010429)Special Innovation Projects of Universities in Guangdong Province(Grant No.2018GKTSCX085).
文摘With the advent of the 5G era,the design of electronic equipment is developing towards thinness,intelligence and multi-function,which requires higher cooling performance of the equipment.Micro-channel heat sink is promising for the heat dissipation of super-thin electronic equipment.In this study,thermal resistance theoretical model of the micro-channel heat sink was first established.Then,fabrication process of the micro-channel heat sink was introduced.Subsequently,heat transfer performance of the fabricated micro-channel heat sink was tested through the developed testing platform.Results show that the developed micro-channel heat sink has more superior heat dissipation performance over conventional metal solid heat sink and it is well suited for high power LEDs application.Moreover,the micro-channel structures in the heat sink were optimized by orthogonal test.Based on the orthogonal optimization,heat dissipation performance of the micro-channel radiator was further improved.
基金National Natural Science Foundation of China(No.51676030,Zhou,X.M.,http://www.nsfc.gov.cn/)Sichuan Science and Technology Program(No.2019JDRC0026,Zhou,X.M.,http://scst.tccxfw.com/)。
文摘With the progressive increase in the number of transistors that can be accommodated on a single integrated circuit,new strategies are needed to extract heat from these devices in an efficient way.In this regard methods based on the combination of the so-called“jet impingement”and“micro-channel”approaches seem extremely promising for possible improvement and future applications in electronics as well as the aerospace and biomedical fields.In this paper,a hybrid heat sink based on these two technologies is analysed in the frame of an integrated model.Dedicated CFD simulation of the coupled flow/temperature fields and orthogonal tests are performed in order to optimize the overall design.The influence of different sets of structural parameters on the cooling performance is examined.It is shown that an optimal scheme exists for which favourable performance can be obtained in terms of hot spot temperature decrease and thermal uniformity improvement.
基金This research is supported by the Deanship of Scientific Research/Saudi Electronic University[Research Number:7638-HS-2019-1-1-S].Initials of authors who received the grant:N.N.HamadnehW.A.Khan.
文摘One of the most significant considerations in the design of a heat sink is thermal management due to increasing thermal flux and miniature in size.These heat sinks utilize plate or pin fins depending upon the required heat dissipation rate.They are designed to optimize overall performance.Elliptical pin fin heat sinks enhance heat transfer rates and reduce the pumping power.In this study,the Firefly Algorithm is implemented to optimize heat sinks with elliptical pin-fins.The pin-fins are arranged in an inline fashion.The nature-inspired metaheuristic algorithm performs powerfully and efficiently in solving numerical global optimization problems.Based on mass,energy,and entropy balance,three models are developed for thermal resistance,hydraulic resistance,and entropy generation rate in the heat sink.The major axis is used as the characteristic length,and the maximum velocity is used as the reference velocity.The entropy generation rate comprises the combined effect of thermal resistance and pressure drop.The total EGR is minimized by utilizing the firefly algorithm.The optimization model utilizes analytical/empirical correlations for the heat transfer coefficients and friction factors.It is shown that both thermal resistance and pressure drop can be simultaneously optimized using this algorithm.It is demonstrated that the performance of FFA is much better than PPA.
文摘The aim of this numerical investigation is to evaluate the laminar forced convection of biologically synthesized water-silver nanofluid through a heat sink(HS)filled with porous foam(PHS)using first and second laws of thermodynamics.The impacts of inlet velocity(V=0.5–3 m·s^-1)and volume fraction of nanofluid(φ=0–1%)on the performance metrics of HS are assessed and the outcomes are compared with those of the non-porous HS(NHS).The outcomes revealed that for both the PHS and NHS,the increase of V causes an intensification in convection coefficient,pumping power,and entropy generation due to fluid friction,while the maximum CPU temperature,thermal resistance,and entropy generation due to the heat transfer reduces by boosting V.Also,it was found that the augmentation of V results in intensification in convection coefficient,pumping power,overall hydrothermal performance,and frictional entropy generation,while the opposite is true for maximum CPU temperature,thermal resistance,and thermal entropy generation.Furthermore,it was reported that,except forφ=0.5%,the overall hydrothermal performance of NHS is better than that of PHS,while PHS has better second-law performance than NHS in all the studied cases.Also,it can be concluded that the best hydrothermal performance for PHS belongs toφ=1%and V=0.5 m·s^-1,while for NHS,these values are 1%and 2 m·s^-1.
基金Supported by the National High Technology Research and Development Program of China under Grant No 2015AA042602
文摘We present a micro-Pirani vacuum gauge using the low-resistivity monocrystal silicon as the heaters and heat sinks fabricated by the post complementary metal oxide semiconductor (CMOS) microelectromechanical system (MEMS) process. The metal interconnection of the device is fabricated by a 0.5 μm standard CMOS process on 8-inch silicon wafer. Then, a SiO2-Si low-temperature fusion bonding is developed to bond the CMOS wafer and the MEMS wafer, with the electrical connection realized by the tungsten through silicon via process. Wafer- level A1Ge euteetic bonding is adopted to package the Pirani gauge in a non-hermetic cavity to protect the gauge from being damaged or contaminated in the dicing and assembling process, and to make it suitable for actual applications. To increase the accuracy of the test and restrain negative influence of temperature drift, the Wheatstone bridge structure is introduced. The test results show that before capping, the gauge has an average sensitivity of 1.04 × 104 K.W-1Torr-1 in dynamic range of 0.01 20 Torr. After capping, the sensitivity of the gauge does not decrease but increases to 1.12 × 104 K.W-1 Torr-1.
文摘Copper as well as copper base composites reinforced with coated and uncoated 1 wt% diamond, graphite particles or short carbon fibers are prepared by powder metallurgy process. The reinforcement particles were encapsulated with silver as well as copper layer by using the electroless deposition technique to investigate the influence of the reinforcement surface coating on the microstructure, density, electrical and thermal properties of the sintered samples. The coated and the uncoated powders were cold compacted at 600 MPa, and then sintered at 1173 K (900°C) for 2 h under hydrogen atmosphere. The phase composition, morphology and microstructure of the prepared powders as well as the copper base sintered composites were investigated using X-ray diffraction analysis (XRD) and Scanning Electron Microscope (SEM) equipped with an Energy Dispersive Spectrometer (EDS) respectively. The density of the sintered composites was measured by Archimedes method. The copper base consolidated composites had a density up to 96% and the reinforcement coated particles were distributed uniformly within the copper matrix better than the uncoated one. The electrical resistivity at room temperature and the heat transfer conduction of the produced samples were measured in a temperature range between 323 K (50°C) and 393 K (120°C). The results observed that the sintered materials prepared from the coated powder have lower electrical resistivity than the sintered materials prepared from the mixed powders. On the other hand the thermal conductivity values were calculated using the heat transfer conduction values by means of the Fourier formula. The results observed that the thermal conductivity of copper is (391 W/m·K), 1 wt% diamond/Cu is (408 W/m·K), 1 wt% graphite coated silver/Cu is (393 W/m·K), 1 wt% Cu coated short carbon fiber/Cu is (393 W/m·K), graphite/Cu is (383 W/m·K) and short carbon fiber/Cu is (382 W/m·K). The obtained composites are expected to be suitable for heat sink applications. The heat transfer testing experiments were done. The forced convection of the present work was done and compared with the previous work in the literature, and satisfactory agreement was achieved.
文摘Cu-coated powder was fabricated by electroless plating process, and the composition and morphology of coated powder were studied. Moreover, Cu-30, 40, 50 vol.%SiCp heat sink materials were fabricated by hot pressing using coated and uncoated powder. And the microstructure and thermophysical properties of the heat sink materials were also studied. The results show that SiCp particles distribute uniformly in heat sink materials and the interface between SiCp particles and Cu matrix is clear and well bonded. On the condition of same volume fraction of SiCp, the thermal conductivity of the material using coated powder is larger than that of the material using uncoated powder. Under experiment conditions, the thermal conductivity and coefficient of thermal expansion of Cu-30 vol.%SiCp heat sink material is 236.2 W·m-1·K-1 and 9.9×10-6/K (30-200 ℃) respectively. It provides important reference data for future experiments.
基金Projects(51375177,U1401249,51405161)supported by the National Natural Science Foundation of ChinaProject(2014M560659)supported by the Postdoctoral Science Foundation of ChinaProject(2014B090901065)supported by the Science and Technology Planning Project for Industry-University-Research Cooperation in Guangdong Province,China
文摘This work aims to improve the thermal performance of a light emitting diode(LED) module by employing a novelly assembled heat pipe heat sink. The heat pipe was embedded into the heat sink by a phase change expansion assembly(PCEA) process, which was developed by both finite element(FE) analysis and experiments. Heat transfer performance and optical performance of the LED modules were experimentally investigated and discussed. Compared to the LED module with a traditionally assembled heat pipe heat sink, the LED module employing the PCEA process exhibits about 20% decrease in the thermal resistance from the MCPCB to the heat pipe. The junction temperature is 4% lower and the luminous flux is 2% higher. The improvement in the thermal and optical performance is important to the high power LED applications.
基金Project (No. 863-2-1-1-7) supported by the Hi-Tech Research and Development Program (863) of China
文摘Endothermic hydrocarbon fuels are advanced coolants for high-temperature structures of spacecraft. No data of tested-cooling-ability of endothermic fuels have been broadly discussed in literature. In this work a high-temperature flow calorimeter was designed, and the cooling capacity of six different hydrocarbon fuels were measured. Experimental results showed that these hydrocarbon fuels have capacity for cooling high-temperature structures, and that the cooling capacity of fuel N-1 can reach 3.15 M J/kg, which can nearly satisfy the requirement of thermal management for a Mach 3 cruise aircraft, whose heat sink requirement is about 3.5 M J/kg. The endothermic velocity of hydrocarbon fuels was also measured by the calorimeter.
文摘Thermal management of LED junction temperature is one of the fundamental technologies for LED lamp to ensure basic specifications in many aspects. Analysed is the high power LED's distribution on heat sink. Using mathematical statistical methods, a formula is conlcuded to calculate the size of heat sink under LED safe working temperature, which provides a method to researchers and LED lamp manufacturers.
基金Projects(50436010, 50675070) supported by the National Natural Science Foundation of China Project(07118064) supported by the Natural Science Foundation of Guangdong Province, China+1 种基金 Project(U0834002) supported by the Joint Fund of NSFC-Guangdong of ChinaProjects(SY200806300289A, JSA200903190981A) supported by Shenzhen Scientific Program, China
文摘Boiling structures on evaporation surface of red copper sheet with a diameter (D) of 10 mm and a wall thickness (h) of 1 mm were processed by the ploughing-extrusion (P-E) processing method, which is one part of the phase-change heat sink for high power (HP) light emitting diode (LED). The experimental results show that two different structures of rectangular- and triangular-shaped micro-grooves are formed in P-E process. When P-E depth (ap), interval of helical grooves (dp) and rotation speed (n) are 0.12 mm, 0.2 mm and 100 r/min, respectively, the boiling structures of triangular-shaped grooves with the fin height of 0.15 mm that has good evaporation performance are obtained. The shapes of the boiling structures are restricted by dp and ap, and dp is determined by n and amount of feed (f). The ploughing speed has an important influence on the formation of groove structure in P-E process.