Analytical design of effective thermal conductivity for fluid-saturated prismatic cellular metal honeycombs

A comparative optimal design of fluid-saturated prismatic cellular metal honeycombs （PCMHs） having different cell shapes is presented for thermal management applications. Based on the periodic topology of each PCMH, a unit cell （UC） for thermal transport analysis was selected to calculate its effective thermal conductivity. Without introducing any empirical coefficient, we modified and extended the analytical model of parallel-series thermal-electric network to a wider porosity range （0.7 ~ 0.98） by considering the effects of two-dimensional local heat conduction in solid ligaments inside each UC. Good agreement was achieved between analytical predictions and numerical simulations based on the method of finite volume. The concept of ligament heat conduction efficiency （LTCE） was proposed to physically explain the mechanisms underlying the effects of ligament configuration on effective thermal conductivity （ETC）. Based upon the proposed theory, a construct strategy was developed for designing the ETC by altering the equivalent interaction angle with the direction of heat flow： relatively small average interaction angle for thermal conduction and relatively large one for thermal insulation.

Heat transfer enhancement in MOSFET mounted on different FR4 substrates by thermal transient measurement

Miniaturization of electronic package leads to high heat density and heat accumulation in electronics device, resulting in short life time and premature failure of the device. Junction temperature and thermal resistance are the critical parameters that determine the thermal management and reliability in electronics cooling. Metal oxide field effect transistor（MOSFET）is an important semiconductor device for light emitting diode-integrated circuit（LED IC） driver application, and thermal management in MOSFET is a major challenge. In this study, investigations on thermal performance of MOSFET are performed for evaluating the junction temperature and thermal resistance. Suitable modifications in FR4 substrates are proposed by introducing thermal vias and copper layer coating to improve the thermal performance of MOSFET. Experiments are conducted using thermal transient tester（T3ster） at 2.0 A input current and ambient temperature varying from25℃ to 75℃. The thermal parameters are measured for three proposed designs： FR4 with circular thermal vias, FR4 with single strip of copper layer and embedded vias, and FR4 with I-shaped copper layer, and compared with that of plain FR4 substrate. From the experimental results, FR4I-shaped shows promising results by 33.71% reduction in junction temperature and 54.19% reduction in thermal resistance. For elevated temperature, the relative increases in junction temperature and thermal resistance are lower for FR4I-shaped than those for other substrates considered. The introduction of thermal vias and copper layer plays a significant role in thermal performance.

Solutions of the modification heating conduction equations of a kind of laser thermal effect

This paper has solved the Chester modified heat conduction equation of the different relaxation time r value under different temperature conditions, different boundary conditions and the different initial conditions by different means of methods. These solutions can help to obtain temperature field of laser thermal effects.