高密度互连(High Density Interconnect Board,HDI)印制电路板的盲孔电镀铜技术是其孔金属化实现电气互连的难点和关注重点,为此,在目前传统盲孔电镀铜技术和盲孔脉冲电镀铜技术的基础上,提出一种新型的电镀铜填孔技术,通过填孔工艺特...高密度互连(High Density Interconnect Board,HDI)印制电路板的盲孔电镀铜技术是其孔金属化实现电气互连的难点和关注重点,为此,在目前传统盲孔电镀铜技术和盲孔脉冲电镀铜技术的基础上,提出一种新型的电镀铜填孔技术,通过填孔工艺特定的镀铜添加剂,在传统盲孔电镀铜的技术上改变表面和盲孔的电流效率满足填孔要求,灵活应用于不同盲孔填充;通过试验和分析,该方法在效果、质量和成品率上均优于脉冲电镀,并可实现不同深宽比盲孔电镀铜要求,大大降低了成本。展开更多
The high-density server is featured as low power, low volume, and high computational density. With the rising use of high-density servers in data-intensive and large-scale web applications, it requires a high-performa...The high-density server is featured as low power, low volume, and high computational density. With the rising use of high-density servers in data-intensive and large-scale web applications, it requires a high-performance and cost-efficient intra-server interconnection network. Most of state-of-the-art high-density servers adopt the fully-connected intra-server network to attain high network performance. Unfortunately, this solution costs too much due to the high degree of nodes. In this paper, we exploit the theoretically optimized Moore graph to interconnect the chips within a server. Accounting for the suitable size of applications, a 50-size Moore graph, called Hoffman-Singleton graph, is adopted. In practice, multiple chips should be integrated onto one processor board, which means that the original graph should be partitioned into homogeneous connected subgraphs. However, the existing partition scheme does not consider above problem and thus generates heterogeneous subgraphs. To address this problem, we propose two equivalent-partition schemes for the Hoffman-Singleton graph. In addition, a logic-based and minimal routing mechanism, which is both time and area efficient, is proposed. Finally, we compare the proposed network architecture with its counterparts, namely the fully-connected, Kautz and Torus networks. The results show that our proposed network can achieve competitive performance as fully-connected network and cost close to Torus.展开更多
文摘高密度互连(High Density Interconnect Board,HDI)印制电路板的盲孔电镀铜技术是其孔金属化实现电气互连的难点和关注重点,为此,在目前传统盲孔电镀铜技术和盲孔脉冲电镀铜技术的基础上,提出一种新型的电镀铜填孔技术,通过填孔工艺特定的镀铜添加剂,在传统盲孔电镀铜的技术上改变表面和盲孔的电流效率满足填孔要求,灵活应用于不同盲孔填充;通过试验和分析,该方法在效果、质量和成品率上均优于脉冲电镀,并可实现不同深宽比盲孔电镀铜要求,大大降低了成本。
基金supported by the Strategic Priority Research Program of the Chinese Academy of Sciences under Grant No.XDA06010401the National Natural Science Foundation of China under Grant Nos.61202056,61331008,61221062the HuaweiResearch Program of China under Grant No.YBCB2011030
文摘The high-density server is featured as low power, low volume, and high computational density. With the rising use of high-density servers in data-intensive and large-scale web applications, it requires a high-performance and cost-efficient intra-server interconnection network. Most of state-of-the-art high-density servers adopt the fully-connected intra-server network to attain high network performance. Unfortunately, this solution costs too much due to the high degree of nodes. In this paper, we exploit the theoretically optimized Moore graph to interconnect the chips within a server. Accounting for the suitable size of applications, a 50-size Moore graph, called Hoffman-Singleton graph, is adopted. In practice, multiple chips should be integrated onto one processor board, which means that the original graph should be partitioned into homogeneous connected subgraphs. However, the existing partition scheme does not consider above problem and thus generates heterogeneous subgraphs. To address this problem, we propose two equivalent-partition schemes for the Hoffman-Singleton graph. In addition, a logic-based and minimal routing mechanism, which is both time and area efficient, is proposed. Finally, we compare the proposed network architecture with its counterparts, namely the fully-connected, Kautz and Torus networks. The results show that our proposed network can achieve competitive performance as fully-connected network and cost close to Torus.
