In recent years,the rapid development of the new energy industry has driven continuous upgrading of high-density and high-power devices.In the packaging and assembly process,the problem of differentiation of the therm...In recent years,the rapid development of the new energy industry has driven continuous upgrading of high-density and high-power devices.In the packaging and assembly process,the problem of differentiation of the thermal needs of different modules has become increasingly prominent,especially for small-size solder joints with high heat dissipation in high-power devices.Localized soldering is con-sidered a suitable choice to selectively heat the desired target while not affecting other heat-sensitive chips.This paper reviews several local-ized soldering processes,focusing on the size of solder joints,soldering materials,and current state of the technique.Each localized solder-ing process was discovered to have unique characteristics.The requirements for small-size solder joints are met by laser soldering,microres-istance soldering,and self-propagating soldering;however,laser soldering has difficulty meeting the requirements for large heat dissipation,microresistance soldering requires the application of pressure to joints,and self-propagating soldering requires ignition materials.However,for small-size solder junctions,selective wave soldering,microwave soldering,and ultrasonic soldering are not appropriate.Because the magnetic field can be focused on a tiny area and the output energy of induction heating is large,induction soldering can be employed as a significant trend in future research.展开更多
The Solar Close Observations and Proximity Experiments(SCOPE)mission,which has been proposed by the Yunnan Observatories,Chinese Academy of Sciences,aiming to operate at a distance of 5 to 10 solar radii from the Sun,...The Solar Close Observations and Proximity Experiments(SCOPE)mission,which has been proposed by the Yunnan Observatories,Chinese Academy of Sciences,aiming to operate at a distance of 5 to 10 solar radii from the Sun,plans to complete the in situ detection of the solar eruption process and observation of the magnetic field structure response.The solar flux received by the satellite ranges from 10^(3) to 10^(6) Wm^(-2),which poses challenges for thermal management of the solar arrays.In this work,the solar array cooling system of the Parker Solar Probe is discussed,the developments of the fluid loop technique are reviewed,and a research plan for a next-generation solar array cooling system is proposed.This paper provides a valuable reference for novel thermal control systems in spacecraft for solar observation.展开更多
基金The research was supported by the National Natural Science Foundation of China(Grant No.52105331)the Shenzhen Science and Technology Innovation Committee(Grant No.JSGG20201102154600003,GXWD20220818163456002,JCYJ20210324124203009).
文摘In recent years,the rapid development of the new energy industry has driven continuous upgrading of high-density and high-power devices.In the packaging and assembly process,the problem of differentiation of the thermal needs of different modules has become increasingly prominent,especially for small-size solder joints with high heat dissipation in high-power devices.Localized soldering is con-sidered a suitable choice to selectively heat the desired target while not affecting other heat-sensitive chips.This paper reviews several local-ized soldering processes,focusing on the size of solder joints,soldering materials,and current state of the technique.Each localized solder-ing process was discovered to have unique characteristics.The requirements for small-size solder joints are met by laser soldering,microres-istance soldering,and self-propagating soldering;however,laser soldering has difficulty meeting the requirements for large heat dissipation,microresistance soldering requires the application of pressure to joints,and self-propagating soldering requires ignition materials.However,for small-size solder junctions,selective wave soldering,microwave soldering,and ultrasonic soldering are not appropriate.Because the magnetic field can be focused on a tiny area and the output energy of induction heating is large,induction soldering can be employed as a significant trend in future research.
基金This work has been supported by National Key R&D Program of China No.2022YFF0503804.
文摘The Solar Close Observations and Proximity Experiments(SCOPE)mission,which has been proposed by the Yunnan Observatories,Chinese Academy of Sciences,aiming to operate at a distance of 5 to 10 solar radii from the Sun,plans to complete the in situ detection of the solar eruption process and observation of the magnetic field structure response.The solar flux received by the satellite ranges from 10^(3) to 10^(6) Wm^(-2),which poses challenges for thermal management of the solar arrays.In this work,the solar array cooling system of the Parker Solar Probe is discussed,the developments of the fluid loop technique are reviewed,and a research plan for a next-generation solar array cooling system is proposed.This paper provides a valuable reference for novel thermal control systems in spacecraft for solar observation.
