Proposed and demonstrated is a novel computer modeling method for high power light emitting diodes(LEDs). It contains geometrical structure and optical property of high power LED as well as LED dies definition with it...Proposed and demonstrated is a novel computer modeling method for high power light emitting diodes(LEDs). It contains geometrical structure and optical property of high power LED as well as LED dies definition with its spatial and angular distribution. Merits and non-merits of traditional modeling methods when applied to high power LEDs based on secondary optical design are discussed. Two commercial high power LEDs are simulated using the proposed computer modeling method. Correlation coefficient is proposed to compare and analyze the simulation results and manufacturing specifications. The source model is precisely demonstrated by obtaining above 99% in correlation coefficient with different surface incident angle intervals.展开更多
In this paper,high-power LED with many integrated chips is used as thermal resistance analysis research object, and we do thermal resistance testing technology research on it. We put forward the thermocouple point con...In this paper,high-power LED with many integrated chips is used as thermal resistance analysis research object, and we do thermal resistance testing technology research on it. We put forward the thermocouple point contact test method. According to the principle that LED forward voltage changes with temperature,LED heat sink to surface temperature distribution is studied directly in the test,and then we analyze the thermal resistance of high-power LED with many integrated chips when its secondary packaging is introduced. This method makes the measurement of thermal resistance of LED more rapid and convenient. It provides an effective assessment method for the analysis of high power LED device design and engineering application.展开更多
In order to study the role of printed circuit board(PCB)in high-power LED heat dissipation,a simple model of high-power LED lamp was designed.According to this lamp model,some thermal performances such as thermal resi...In order to study the role of printed circuit board(PCB)in high-power LED heat dissipation,a simple model of high-power LED lamp was designed.According to this lamp model,some thermal performances such as thermal resistances of four types of PCB and the changes of LED junction temperature were tested under three different working currents.The obtained results indicate that LED junction temperature can not be lowered significantly with the decreasing thermal resistance of PCB.However,PCB with low thermal resistance can be matched with smaller volume heat sink,so it is hopeful to reduce the size,weight and cost of LED lamp.展开更多
To improve the heat dissipation of high-power light-emitting diodes (LEDs), a cooling system with a fan is proposed. In the experiment, the LEDs array of 18 W composed of 6 LEDs of 3 W is used and the room temperature...To improve the heat dissipation of high-power light-emitting diodes (LEDs), a cooling system with a fan is proposed. In the experiment, the LEDs array of 18 W composed of 6 LEDs of 3 W is used and the room temperature is 26oC. Results show that the temperature of the substrate of LEDs reaches 62oC without the fan, however, it reaches only 32oC when the best cooling condition appears. The temperature of the LEDs decreases by 30oC since the heat produced by LEDs is transferred rapidly by the fan. The experiment demonstrates that the cooling system with the fan has good performance.展开更多
A theoretical model of phase change heat sink was established in terms of thermal resistance network. The influence of different parameters on the thermal resistance was analyzed and the crucial impact factors were de...A theoretical model of phase change heat sink was established in terms of thermal resistance network. The influence of different parameters on the thermal resistance was analyzed and the crucial impact factors were determined. Subsequently, the forming methods including ploughing-extrusion and stamping method of boiling enhancement structure at evaporation surface were investigated, upon which three-dimensional microgroove structure was fabricated to improve the efficiency of evaporation. Moreover, the crucial parameters related to the fabrication of miniaturized phase change heat sink were optimized. The heat transfer performance of the heat sink was tested. Results show that the developed phase change heat sink has excellent heat transfer performance and is suitable for high power LED applications.展开更多
A new type of high power LED drivers is proposed by adopting an improved two-stages non-isolated configuration. In order to improve power factor and achieve accurate average current control under universal input volta...A new type of high power LED drivers is proposed by adopting an improved two-stages non-isolated configuration. In order to improve power factor and achieve accurate average current control under universal input voltages ranging from 100 Vrms to 240 Vrms, the power factor correction and average current mode control methods operating in continuous current conduction mode are designed and implemented. With the LUMILEDS emitter type LEDs, a laboratory prototype is built and measured. And from the measured results, it could be concluded that the proposed driver has many better performances such as high power factor, low current harmonic, accurate average current control and switch protection.展开更多
基金The"863"Project of National Ministry of Science and Technology(2006AA03A175)
文摘Proposed and demonstrated is a novel computer modeling method for high power light emitting diodes(LEDs). It contains geometrical structure and optical property of high power LED as well as LED dies definition with its spatial and angular distribution. Merits and non-merits of traditional modeling methods when applied to high power LEDs based on secondary optical design are discussed. Two commercial high power LEDs are simulated using the proposed computer modeling method. Correlation coefficient is proposed to compare and analyze the simulation results and manufacturing specifications. The source model is precisely demonstrated by obtaining above 99% in correlation coefficient with different surface incident angle intervals.
基金Sponsored by the Heilongjiang Provincial Project(Grant No.12511121)the Harbin City Innovation Talent Project(Grant No.2011RFXXG019)the National Science and Technology Support Project(Grant No.2012BAH28F02)
文摘In this paper,high-power LED with many integrated chips is used as thermal resistance analysis research object, and we do thermal resistance testing technology research on it. We put forward the thermocouple point contact test method. According to the principle that LED forward voltage changes with temperature,LED heat sink to surface temperature distribution is studied directly in the test,and then we analyze the thermal resistance of high-power LED with many integrated chips when its secondary packaging is introduced. This method makes the measurement of thermal resistance of LED more rapid and convenient. It provides an effective assessment method for the analysis of high power LED device design and engineering application.
基金Special Fund Project of Science and Technology Innovation of Dongli District(21090302)Research Projectof Applied Basic and Front Technologies of Tianjin(10JCZDJC15400)
文摘In order to study the role of printed circuit board(PCB)in high-power LED heat dissipation,a simple model of high-power LED lamp was designed.According to this lamp model,some thermal performances such as thermal resistances of four types of PCB and the changes of LED junction temperature were tested under three different working currents.The obtained results indicate that LED junction temperature can not be lowered significantly with the decreasing thermal resistance of PCB.However,PCB with low thermal resistance can be matched with smaller volume heat sink,so it is hopeful to reduce the size,weight and cost of LED lamp.
文摘To improve the heat dissipation of high-power light-emitting diodes (LEDs), a cooling system with a fan is proposed. In the experiment, the LEDs array of 18 W composed of 6 LEDs of 3 W is used and the room temperature is 26oC. Results show that the temperature of the substrate of LEDs reaches 62oC without the fan, however, it reaches only 32oC when the best cooling condition appears. The temperature of the LEDs decreases by 30oC since the heat produced by LEDs is transferred rapidly by the fan. The experiment demonstrates that the cooling system with the fan has good performance.
基金Projects(51575115,51775122) supported by the National Natural Science Foundation of China
文摘A theoretical model of phase change heat sink was established in terms of thermal resistance network. The influence of different parameters on the thermal resistance was analyzed and the crucial impact factors were determined. Subsequently, the forming methods including ploughing-extrusion and stamping method of boiling enhancement structure at evaporation surface were investigated, upon which three-dimensional microgroove structure was fabricated to improve the efficiency of evaporation. Moreover, the crucial parameters related to the fabrication of miniaturized phase change heat sink were optimized. The heat transfer performance of the heat sink was tested. Results show that the developed phase change heat sink has excellent heat transfer performance and is suitable for high power LED applications.
文摘A new type of high power LED drivers is proposed by adopting an improved two-stages non-isolated configuration. In order to improve power factor and achieve accurate average current control under universal input voltages ranging from 100 Vrms to 240 Vrms, the power factor correction and average current mode control methods operating in continuous current conduction mode are designed and implemented. With the LUMILEDS emitter type LEDs, a laboratory prototype is built and measured. And from the measured results, it could be concluded that the proposed driver has many better performances such as high power factor, low current harmonic, accurate average current control and switch protection.
