The interface adhesion strength(or interface toughness)of a thin film/substrate system is often assessed by the micro-scratch test.For a brittle film material,the interface adhesion strength is easily obtained through...The interface adhesion strength(or interface toughness)of a thin film/substrate system is often assessed by the micro-scratch test.For a brittle film material,the interface adhesion strength is easily obtained through measuring the scratch driving forces.However,to measure the interface adhesion strength(or in- terface toughness)for a metal thin film material(the ductile material)by the micro- scratch test is very difficult,because intense plastic deformation is involved and the problem is a three-dimensional elastic-plastic one.In the present research,using a double-cohesive zone model,the failure characteristics of the thin film/substrate system can be described and further simulated.For a steady-state scratching pro- cess,a three-dimensional elastic-plastic finite element method based on the double cohesive zone model is developed and adopted,and the steady-state fracture work of the total system is calculated.The parameter relations between the horizontal driving forces(or energy release rate of the scratching process)and the separation strength of thin film/substrate interface,and the material shear strength,as well as the material parameters are developed.Furthermore,a scratch experiment for the Al/Si film/substrate system is carried out and the failure mechanisms are explored. Finally,the prediction results are applied to a scratch experiment for the Pt/NiO material system given in the literature.展开更多
基金The project supported by the National Natural Science Foundation of China (19891180 and 19925211)Bai Ren Plan of CAS
文摘The interface adhesion strength(or interface toughness)of a thin film/substrate system is often assessed by the micro-scratch test.For a brittle film material,the interface adhesion strength is easily obtained through measuring the scratch driving forces.However,to measure the interface adhesion strength(or in- terface toughness)for a metal thin film material(the ductile material)by the micro- scratch test is very difficult,because intense plastic deformation is involved and the problem is a three-dimensional elastic-plastic one.In the present research,using a double-cohesive zone model,the failure characteristics of the thin film/substrate system can be described and further simulated.For a steady-state scratching pro- cess,a three-dimensional elastic-plastic finite element method based on the double cohesive zone model is developed and adopted,and the steady-state fracture work of the total system is calculated.The parameter relations between the horizontal driving forces(or energy release rate of the scratching process)and the separation strength of thin film/substrate interface,and the material shear strength,as well as the material parameters are developed.Furthermore,a scratch experiment for the Al/Si film/substrate system is carried out and the failure mechanisms are explored. Finally,the prediction results are applied to a scratch experiment for the Pt/NiO material system given in the literature.
