This work aims to investigate the mechanical properties and interfacial characteristics of 6061 Al alloy plates fabricated by hotroll bonding(HRB)based on friction stir welding.The results showed that ultimate tensile...This work aims to investigate the mechanical properties and interfacial characteristics of 6061 Al alloy plates fabricated by hotroll bonding(HRB)based on friction stir welding.The results showed that ultimate tensile strength and total elongation of the hot-rolled and aged joints increased with the packaging vacuum,and the tensile specimens fractured at the matrix after exceeding 1 Pa.Non-equilibrium grain boundaries were formed at the hot-rolled interface,and a large amount of Mg_(2)Si particles were linearly precipitated along the interfacial grain boundaries(IGBs).During subsequent heat treatment,Mg_(2)Si particles dissolved back into the matrix,and Al_(2)O_(3) film remaining at the interface eventually evolved into MgO.In addition,the local IGBs underwent staged elimination during HRB,which facilitated the interface healing due to the fusion of grains at the interface.This process was achieved by the dissociation,emission,and annihilation of dislocations on the IGBs.展开更多
Wear-resistant cladding plates consisting of a substrate(Q345 R) and a clad layer(BTW1) were bonded through hot rolling at the temperature of 1 200 ℃ and a rolling speed of 0.5 m/s. The microhardness of the cladd...Wear-resistant cladding plates consisting of a substrate(Q345 R) and a clad layer(BTW1) were bonded through hot rolling at the temperature of 1 200 ℃ and a rolling speed of 0.5 m/s. The microhardness of the cladding plate was also tested after being heat treated. The microstructure evolution on the interface of BTW1/Q345 R sheets under various reduction rates was investigated with a scanning electron microscope(SEM) and EBSD. It is found that the micro-cracks and oxide films on the interface disappear when the reduction is 80%, whereas the maximum uniform diffusion distance reaches 10 μm. As a result, a wide range of metallurgical bonding layers forms, which indicates an improved combination between the BTW1 and the Q345 R. Additionally, it is discovered that the unbroken oxide films on the interface are composed of Mn, Si or Cr at the reductions of 50% and 65%. The SEM fractography of tensile specimen demonstrates that the BTW1 has significant dimple characteristics and possesses lower-sized dimples with the increment in reduction, suggesting that the toughness and bonding strength of the cladding plates would be improved by the increase of reduction. The results reveal that a high rolling reduction causes the interfacial oxide film broken and further forms a higher-sized composite metallurgical bonding interface. The peak microhardness is achieved near the interface.展开更多
Nickel based single crystal superalloy is currently widely used as the material for turbine blades in aerospace engines.However,metallurgical defects during the manufacturing process and damage during harsh environmen...Nickel based single crystal superalloy is currently widely used as the material for turbine blades in aerospace engines.However,metallurgical defects during the manufacturing process and damage during harsh environmental service are inevitable challenges for turbine blades.Therefore,bonding techniques play a very important role in the manufacturing and repair of turbine blades.The transient liquid phase(TLP)bonding of DD5 Ni-based single crystal superalloy was performed using the designed H1 interlayer.A new third-generation Ni-based superalloy T1 powder was mixed with H1 powder as another interlayer to improve the mechanical properties of the bonded joints.The res-ults show that,such a designed H1 interlayer is beneficial to the improvement of shear strength of DD5 alloy bonded joints by adjusting the bonding temperature and the prolongation of holding time.The maximum shear strength at room temperature of the joint with H1 interlayer reached 681 MPa when bonded at 1260℃for 3 h.The addition of T1 powder can effectively reduce holding time or relatively lower bond-ing temperature,while maintaining relatively high shear strength.When 1 wt.%T1 powder was mixed into H1 interlayer,the maximum room temperature shear strength of the joint bonded at 1260℃reached 641 MPa,which could be obtained for only 1 h.Considering the bonding temperature and the efficiency,the acceptable process parameter of H1+5 wt.%T1 interlayer was 1240℃/2 h,and the room tem-perature shear strength reached 613 MPa.展开更多
High-quality bonding of 4-inch GaAs and Si is achieved using plasma-activated bonding technology.The influence of Ar plasma activation on surface morphology is discussed.When the annealing temperature is 300℃,the bon...High-quality bonding of 4-inch GaAs and Si is achieved using plasma-activated bonding technology.The influence of Ar plasma activation on surface morphology is discussed.When the annealing temperature is 300℃,the bonding strength reaches a maximum of 6.2 MPa.In addition,a thermal stress model for GaAs/Si wafers is established based on finite element analysis to obtain the distribution of equivalent stress and deformation variables at different temperatures.The shape varia-tion of the wafer is directly proportional to the annealing temperature.At an annealing temperature of 400℃,the maximum protrusion of 4 inches GaAs/Si wafers is 3.6 mm.The interface of GaAs/Si wafers is observed to be dense and defect-free using a transmission electron microscope.The characterization of interface elements by X-ray energy dispersion spectroscopy indi-cates that the elements at the interface undergo mutual diffusion,which is beneficial for improving the bonding strength of the interface.There is an amorphous transition layer with a thickness of about 5 nm at the bonding interface.The preparation of Si-based GaAs heterojunctions can enrich the types of materials required for the development of integrated circuits,improve the performance of materials and devices,and promote the development of microelectronics technology.展开更多
Zero-dimensional(0D)hybrid metal halides,which consist of organic cations and isolated inorganic metal halide anions,have emerged as phosphors with efficient broadband emissions.However,these materials generally have ...Zero-dimensional(0D)hybrid metal halides,which consist of organic cations and isolated inorganic metal halide anions,have emerged as phosphors with efficient broadband emissions.However,these materials generally have too wide bandgaps and thus cannot be excited by blue light,which hinders their applications for efficient white light-emitting diodes(WLEDs).The key to achieving a blue-light-excitable 0D hybrid metal halide phosphor is to reduce the fundamental bandgap by rational chemical design.In this work,we report two designed hybrid copper(I)iodides,(Ph_(3)MeP)_(2)Cu_(4)I_(6)and(Cy_(3)MeP)_(2)Cu_(4)I_(6),as blue-light-excitable yellow phosphors with ultrabroadband emission.In these compounds,the[Cu_(4)I_(6)]^(2-)anion forms an I6 octahedron centered on a cationic Cu_(4)tetrahedron.The strong cation-cation bonding within the unique cationic Cu_(4)tetrahedra enables significantly lowered conduction band minimums and thus narrowed bandgaps,as compared to other reported hybrid copper(I)iodides.The ultrabroadband emission is attributed to the coexistence of free and self-trapped excitons.The WLED using the[Cu_(4)I_(6)]^(2-)anion-based single phosphor shows warm white light emission,with a high luminous efficiency of 65 Im W^(-1)and a high color rendering index of 88.This work provides strategies to design narrow-bandgap 0D hybrid metal halides and presents two first examples of blue-light-excitable 0D hybrid metal halide phosphors for efficient WLEDs.展开更多
Non-destructive detection of wire bonding defects in integrated circuits(IC)is critical for ensuring product quality after packaging.Image-processing-based methods do not provide a detailed evaluation of the three-dim...Non-destructive detection of wire bonding defects in integrated circuits(IC)is critical for ensuring product quality after packaging.Image-processing-based methods do not provide a detailed evaluation of the three-dimensional defects of the bonding wire.Therefore,a method of 3D reconstruction and pattern recognition of wire defects based on stereo vision,which can achieve non-destructive detection of bonding wire defects is proposed.The contour features of bonding wires and other electronic components in the depth image is analysed to complete the 3D reconstruction of the bonding wires.Especially to filter the noisy point cloud and obtain an accurate point cloud of the bonding wire surface,a point cloud segmentation method based on spatial surface feature detection(SFD)was proposed.SFD can extract more distinct features from the bonding wire surface during the point cloud segmentation process.Furthermore,in the defect detection process,a directional discretisation descriptor with multiple local normal vectors is designed for defect pattern recognition of bonding wires.The descriptor combines local and global features of wire and can describe the spatial variation trends and structural features of wires.The experimental results show that the method can complete the 3D reconstruction and defect pattern recognition of bonding wires,and the average accuracy of defect recognition is 96.47%,which meets the production requirements of bonding wire defect detection.展开更多
Introducing Neutral Polymeric bonding agents(NPBA) into the Nitrate Ester Plasticized Polyether(NEPE)propellant could improve the adhesion between filler/matrix interface, thereby contributing to the development of ne...Introducing Neutral Polymeric bonding agents(NPBA) into the Nitrate Ester Plasticized Polyether(NEPE)propellant could improve the adhesion between filler/matrix interface, thereby contributing to the development of new generations of the NEPE propellant with better mechanical properties. Therefore,understanding the effects of NPBA on the deformation and damage evolution of the NEPE propellant is fundamental to material design and applications. This paper studies the uniaxial tensile and stress relaxation responses of the NEPE propellant with different amounts of NPBA. The damage evolution in terms of interface debonding is further investigated using a cohesive-zone model(CZM). Experimental results show that the initial modulus and strength of the NEPE propellant increase with the increasing amount of NPBA while the elongation decreases. Meanwhile, the relaxation rate slows down and a higher long-term equilibrium modulus is reached. Experimental and numerical analyses indicate that interface debonding and crack propagation along filler-matrix interface are the dominant damage mechanism for the samples with a low amount of NPBA, while damage localization and crack advancement through the matrix are predominant for the ones with a high amount of NPBA. Finally, crosslinking density tests and simulation results also show that the effect of the bonding agent is interfacial rather than due to the overall crosslinking density change of the binder.展开更多
The interfacial chemistry of solid electrolyte interphases(SEI)on lithium(Li)electrode is directly determined by the structural chemistry of the electric double layer(EDL)at the interface.Herein,a strategy for regulat...The interfacial chemistry of solid electrolyte interphases(SEI)on lithium(Li)electrode is directly determined by the structural chemistry of the electric double layer(EDL)at the interface.Herein,a strategy for regulating the structural chemistry of EDL via the introduction of intermolecular hydrogen bonds has been proposed(p-hydroxybenzoic acid(pHA)is selected as proof-of-concept).According to the molecular dynamics(MD)simulation and density functional theory(DFT)calculation results,the existence of hydrogen bonds realizes the anion structural rearrangement in the EDL,reduces the lowest unoccupied molecular orbital(LUMO)energy level of anions in the EDL,and the number of free solvent molecules,which promotes the formation of inorganic species-enriched SEI and eventually achieves the dendrite-free Li deposition.Based on this strategy,Li‖Cu cells can stably run over 185 cycles with an accumulated active Li loss of only 2.27 mAh cm^(-2),and the long-term cycle stability of Li‖Li cells is increased to 1200 h.In addition,the full cell pairing with the commercial LiFePO_(4)(LFP)cathodes exhibits stable cycling performance at 1C,with a capacity retention close to 90%after 200 cycles.展开更多
We put forward a method of fabricating Aluminum(Al)/carbon fibers(CFs) composite sheets by the accumulative roll bonding(ARB) method. The finished Al/CFs composite sheet has CFs and pure Al sheets as sandwich and surf...We put forward a method of fabricating Aluminum(Al)/carbon fibers(CFs) composite sheets by the accumulative roll bonding(ARB) method. The finished Al/CFs composite sheet has CFs and pure Al sheets as sandwich and surface layers. After cross-section observation of the Al/CFs composite sheet, we found that the CFs discretely distributed within the sandwich layer. Besides, the tensile test showed that the contribution of the sandwich CFs layer to tensile strength was less than 11% compared with annealed pure Al sheet. With ex-situ observation of the CFs breakage evolution with-16%,-32%, and-45% rolling reduction during the ARB process, the plastic instability of the Al layer was found to bring shear damages to the CFs. At last, the bridging strengthening mechanism introduced by CFs was sacrificed. We provide new insight into and instruction on Al/CFs composite sheet preparation method and processing parameters.展开更多
One of the challenges for bimetal manufacturing is the joining process.Hence,transient liquid phase(TLP)bonding was performed between 304L stainless steel and Cp-Ti using an Ag-Cu interlayer with a thickness of 75μm ...One of the challenges for bimetal manufacturing is the joining process.Hence,transient liquid phase(TLP)bonding was performed between 304L stainless steel and Cp-Ti using an Ag-Cu interlayer with a thickness of 75μm for bonding time of 20,40,60,and 90 min.The bonding temperature of 860℃ was considered,which is under the β transus temperature of Cp-Ti.During TLP bonding,various intermetallic compounds(IMCs),including Ti_(5)Cr_(7)Fe_(17),(Cr,Fe)_(2)Ti,Ti(Cu,Fe),Ti_(2)(Cu,Ag),and Ti_(2)Cu from 304L toward Cp-Ti formed in the joint.Also,on the one side,with the increase in time,further diffusion of elements decreases the blocky IMCs such as Ti_(5)Cr_(7)Fe_(17),(Cr,Fe)_(2)Ti,Ti(Cu,Fe)in the 304L diffusion-affected zone(DAZ)and reaction zone,and on the other side,Ti_(2)(Cu,Ag)IMC transformed into fine morphology toward Cp-Ti DAZ.The microhardness test also demonstrated that the(Cr,Fe)_(2)Ti+Ti_(5)Cr_(7)Fe_(17) IMCs in the DAZ on the side of 304L have a hardness value of HV 564,making it the hardest phase.The maximum and minimum shear strength values are equal to 78.84 and 29.0 MPa,respectively.The cleavage pattern dominated fracture surfaces due to the formation of brittle phases in dissimilar joints.展开更多
TA1 P-Ti/AA6061 composite plate was produced by oxidizing the surface of the titanium plate and adopting a cold roll bonding process.The results revealed that the oxide film(Ti6O)prepared on the surface of TA1 pure ti...TA1 P-Ti/AA6061 composite plate was produced by oxidizing the surface of the titanium plate and adopting a cold roll bonding process.The results revealed that the oxide film(Ti6O)prepared on the surface of TA1 pure titanium was easy to crack during the cold roll bonding,thereby promoting the formation of an effective mechanical interlock at the interface,which can effectively reduce the minimum reduction rate of the composite plates produced by cold rolling of titanium and aluminium plates.Moreover,the composite plate subjected to oxidation treatment exhibited high shear strength,particularly at a 43%reduction rate,achieving a commendable value of 117 MPa.Based on oxidation treatment and different reduction rates,the annealed composite plates at temperatures of 400,450,and 500°C displayed favorable resistance to interface delamination,highlighting their remarkable strength-plasticity compatibility as evidenced by a maximum elongation of 31.845%.展开更多
This year,Toray Industries,Inc.,announced that it has developed an insulating resin material for hybrid bonding(micro bonding).The material is based on Semicofine™and Photoneece™.These are high-heat-resistant polyimid...This year,Toray Industries,Inc.,announced that it has developed an insulating resin material for hybrid bonding(micro bonding).The material is based on Semicofine™and Photoneece™.These are high-heat-resistant polyimide coatings for semiconductor and display devices.The new material combines a conventional polyimide coating agent with the company’s processing and bonding technologies.It can enhance the yields and reliability of semiconductor devices in the hybrid bonding process,which entails bonding semiconductor chips with metal electrodes.Toray will push ahead with prototyping and providing samples to customers.It aims to obtain materials certification in 2025 and start mass production by 2028.展开更多
In order to investigate the degradation of bonding properties between corroded steel bars and concrete,this study employs the half-beam method to conduct bond-slip tests between corroded steel bars and concrete after ...In order to investigate the degradation of bonding properties between corroded steel bars and concrete,this study employs the half-beam method to conduct bond-slip tests between corroded steel bars and concrete after impressed-current accelerated corrosion of the steel bars in concrete.The effects of steel corrosion rate,steel bar diameter,steel bar strength grade,and concrete strength grade on the bonding properties between concrete and corroded steel bars were analyzed.The influence of different corrosion rates on specimens’bonding strength and bond-slip curves was determined,and a constitutive relationship for bond-slip between corroded steel bars and concrete was proposed.The results indicate that the ultimate bonding strength of corroded reinforced concrete specimens decreases with increasing corrosion rate.Additionally,an increase in corrosive crack width leads to a linear decrease in bonding strength.Evaluating the decline in adhesive properties through rust expansion crack width in engineering applications is feasible.Furthermore,a bond-slip constitutive relationship between corroded steel bars and concrete was established using relative bond stress and relative slip values,which aligned well with the experimental findings.展开更多
The bonding interface of 7B52 Al alloy laminated composite (ALC) fabricated by hot rolling was investigated using optical microscopy (OM), transmission electron microscopy (TEM), scanning electron microscopy (...The bonding interface of 7B52 Al alloy laminated composite (ALC) fabricated by hot rolling was investigated using optical microscopy (OM), transmission electron microscopy (TEM), scanning electron microscopy (SEM), ultrasonic flaw detection (UFD), and bonding strength tests. The results show that metallurgical bonding is achieved at the interface after composite rolling. The TEM analysis and tensile tests indicate that the 7B52 ALC plate combines high strength of the hard individual layer and good toughness of the soft individual layer. However, UFD technology and SEM analysis prove that the defects (thick oxide films, acid washed residues, air, oil and coarse particles) existing in the bonding interface are harmful to the bonding strength. To sum up, the composite roiling process is suitable for 7B52 ALC plate, and the content and size of the defects should be controlled strictly. Advanced surface treatment of each individual layer would be beneficial to further improve the bonding quality.展开更多
In this work,the ultrasonic assisted active metal soldering of SiO_(2) glass and Al was successfully achieved using Sn-2Ti solder filler at a low soldering temperature of 250℃in ambient atmosphere.A nano-crystalline...In this work,the ultrasonic assisted active metal soldering of SiO_(2) glass and Al was successfully achieved using Sn-2Ti solder filler at a low soldering temperature of 250℃in ambient atmosphere.A nano-crystallineα-Al2O3 layer with the average thickness of 13.9 nm and a nano-crystalline R-TiO_(2) layer with the average thickness of 16.2 nm are formed at the interface of Al/Sn and SiO_(2)/Sn respectively because Al elements did not diffuse from Al alloy side to SiO_(2) side,which verified that a sono-oxidation reaction had occurred during the ultrasonic assisted active metal soldering process.The soldered butt joints exhibited an average tensile strength of 25.31 MPa.展开更多
To evaluate various interlaminar bonding reinforcement techniques used for steel bridge decks,the UHPC surface was roughened with shot blasting(SB),transverse grooving(TG)and surface embedded stone(S),epoxy resin(E),e...To evaluate various interlaminar bonding reinforcement techniques used for steel bridge decks,the UHPC surface was roughened with shot blasting(SB),transverse grooving(TG)and surface embedded stone(S),epoxy resin(E),epoxy asphalt(EA)and high viscosity high elasticity asphalt(HV)as interlayer bonding materials.In addition,a diagonal shear test was conducted using a self-designed diagonal shear jig.The effects of adhesive layer materials type,surface texture type,and different loading rates on the interlaminar bonding performance of UHPC/SMA combination specimens were investigated.The experimental study showed that the peak shear strength and shear modulus of the combined specimen decreased gradually with the decrease of thermosetting of the adhesive layer materials.The peak shear fracture energy of E was greater than that of HV and EA.The synergistic effect of the contact force generated by the roughing of the UHPC surface,the friction force,and the bonding force provided by the adhesive layer material can significantly improve the interlaminar shear performance of the assemblies.The power-law function of shear strength and shear modulus was proposed.The power-law model of peak shear strength and loading rate was verified.The shear strength and predicted shear strength satisfy the positive proportional functions with scale factors of 0.985,1.015,0.961,and 1.028,respectively.展开更多
Higher requirements for the accuracy of relevant models are put throughout the transformation and upgrade of the iron and steel sector to intelligent production.It has been difficult to meet the needs of the field wit...Higher requirements for the accuracy of relevant models are put throughout the transformation and upgrade of the iron and steel sector to intelligent production.It has been difficult to meet the needs of the field with the usual prediction model of mechanical properties of hotrolled strip.Insufficient data and difficult parameter adjustment limit deep learning models based on multi-layer networks in practical applications;besides,the limited discrete process parameters used make it impossible to effectively depict the actual strip processing process.In order to solve these problems,this research proposed a new sampling approach for mechanical characteristics input data of hot-rolled strip based on the multi-grained cascade forest(gcForest)framework.According to the characteristics of complex process flow and abnormal sensitivity of process path and parameters to product quality in the hot-rolled strip production,a three-dimensional continuous time series process data sampling method based on time-temperature-deformation was designed.The basic information of strip steel(chemical composition and typical process parameters)is fused with the local process information collected by multi-grained scanning,so that the next link’s input has both local and global features.Furthermore,in the multi-grained scanning structure,a sub sampling scheme with a variable window was designed,so that input data with different dimensions can get output characteristics of the same dimension after passing through the multi-grained scanning structure,allowing the cascade forest structure to be trained normally.Finally,actual production data of three steel grades was used to conduct the experimental evaluation.The results revealed that the gcForest-based mechanical property prediction model outperforms the competition in terms of comprehensive performance,ease of parameter adjustment,and ability to sustain high prediction accuracy with fewer samples.展开更多
Metal-organic frameworks(MOFs)have been developed as an ideal platform for exploration of the relationship between intrinsic structure and catalytic activity,but the limited catalytic activity and stability has hamper...Metal-organic frameworks(MOFs)have been developed as an ideal platform for exploration of the relationship between intrinsic structure and catalytic activity,but the limited catalytic activity and stability has hampered their practical use in water splitting.Herein,we develop a bond length adjustment strategy for optimizing naphthalene-based MOFs that synthesized by acid etching Co-naphthalenedicarboxylic acid-based MOFs(donated as AE-CoNDA)to serve as efficient catalyst for water splitting.AE-CoNDA exhibits a low overpotential of 260 mV to reach 10 mA cm^(−2)and a small Tafel slope of 62 mV dec^(−1)with excellent stability over 100 h.After integrated AE-CoNDA onto BiVO_(4),photocurrent density of 4.3 mA cm^(−2)is achieved at 1.23 V.Experimental investigations demonstrate that the stretched Co-O bond length was found to optimize the orbitals hybridization of Co 3d and O 2p,which accounts for the fast kinetics and high activity.Theoretical calculations reveal that the stretched Co-O bond length strengthens the adsorption of oxygen-contained intermediates at the Co active sites for highly efficient water splitting.展开更多
基金This work was financially supported by the National Key Research and Development Program of China(No.2018YFA0707300)the Key Research and Development Program projects of Shandong(No.2020CXGC010304).
文摘This work aims to investigate the mechanical properties and interfacial characteristics of 6061 Al alloy plates fabricated by hotroll bonding(HRB)based on friction stir welding.The results showed that ultimate tensile strength and total elongation of the hot-rolled and aged joints increased with the packaging vacuum,and the tensile specimens fractured at the matrix after exceeding 1 Pa.Non-equilibrium grain boundaries were formed at the hot-rolled interface,and a large amount of Mg_(2)Si particles were linearly precipitated along the interfacial grain boundaries(IGBs).During subsequent heat treatment,Mg_(2)Si particles dissolved back into the matrix,and Al_(2)O_(3) film remaining at the interface eventually evolved into MgO.In addition,the local IGBs underwent staged elimination during HRB,which facilitated the interface healing due to the fusion of grains at the interface.This process was achieved by the dissociation,emission,and annihilation of dislocations on the IGBs.
基金the National Natural Science Foundation of China(No.U151013)the Key Research and Development Program of Shanxi Province(Nos.201603D111004 and 201603D121010)+1 种基金the Natural Science Foundation of Shanxi Province of Chinathe Provincial Special Fund for Coordinative Innovation Center of Taiyuan Heavy Machinery Equipmen(No.20171003)
文摘Wear-resistant cladding plates consisting of a substrate(Q345 R) and a clad layer(BTW1) were bonded through hot rolling at the temperature of 1 200 ℃ and a rolling speed of 0.5 m/s. The microhardness of the cladding plate was also tested after being heat treated. The microstructure evolution on the interface of BTW1/Q345 R sheets under various reduction rates was investigated with a scanning electron microscope(SEM) and EBSD. It is found that the micro-cracks and oxide films on the interface disappear when the reduction is 80%, whereas the maximum uniform diffusion distance reaches 10 μm. As a result, a wide range of metallurgical bonding layers forms, which indicates an improved combination between the BTW1 and the Q345 R. Additionally, it is discovered that the unbroken oxide films on the interface are composed of Mn, Si or Cr at the reductions of 50% and 65%. The SEM fractography of tensile specimen demonstrates that the BTW1 has significant dimple characteristics and possesses lower-sized dimples with the increment in reduction, suggesting that the toughness and bonding strength of the cladding plates would be improved by the increase of reduction. The results reveal that a high rolling reduction causes the interfacial oxide film broken and further forms a higher-sized composite metallurgical bonding interface. The peak microhardness is achieved near the interface.
基金supported by the National Science and Technology Major Project(2017-VI-0009-0080)the Key-Area Research and Development Program of Guangdong Province(2019B010935001)+1 种基金Shenzhen Science and Technology Plan(Project No.JSGG20210802093205015)Industry and Information Technology Bureau of Shenzhen Municipality(Project No.201806071354163490).
文摘Nickel based single crystal superalloy is currently widely used as the material for turbine blades in aerospace engines.However,metallurgical defects during the manufacturing process and damage during harsh environmental service are inevitable challenges for turbine blades.Therefore,bonding techniques play a very important role in the manufacturing and repair of turbine blades.The transient liquid phase(TLP)bonding of DD5 Ni-based single crystal superalloy was performed using the designed H1 interlayer.A new third-generation Ni-based superalloy T1 powder was mixed with H1 powder as another interlayer to improve the mechanical properties of the bonded joints.The res-ults show that,such a designed H1 interlayer is beneficial to the improvement of shear strength of DD5 alloy bonded joints by adjusting the bonding temperature and the prolongation of holding time.The maximum shear strength at room temperature of the joint with H1 interlayer reached 681 MPa when bonded at 1260℃for 3 h.The addition of T1 powder can effectively reduce holding time or relatively lower bond-ing temperature,while maintaining relatively high shear strength.When 1 wt.%T1 powder was mixed into H1 interlayer,the maximum room temperature shear strength of the joint bonded at 1260℃reached 641 MPa,which could be obtained for only 1 h.Considering the bonding temperature and the efficiency,the acceptable process parameter of H1+5 wt.%T1 interlayer was 1240℃/2 h,and the room tem-perature shear strength reached 613 MPa.
基金This work was financially supported by the National Nature Science Foundation of China(Grant No.61673222)the Natural Science Foundation of the Jiangsu Higher Education Institutions of China(Grant No.23KJB430036)Wuxi University Research Start-up Fund for Introduced Talents(Grant No.2022r036).
文摘High-quality bonding of 4-inch GaAs and Si is achieved using plasma-activated bonding technology.The influence of Ar plasma activation on surface morphology is discussed.When the annealing temperature is 300℃,the bonding strength reaches a maximum of 6.2 MPa.In addition,a thermal stress model for GaAs/Si wafers is established based on finite element analysis to obtain the distribution of equivalent stress and deformation variables at different temperatures.The shape varia-tion of the wafer is directly proportional to the annealing temperature.At an annealing temperature of 400℃,the maximum protrusion of 4 inches GaAs/Si wafers is 3.6 mm.The interface of GaAs/Si wafers is observed to be dense and defect-free using a transmission electron microscope.The characterization of interface elements by X-ray energy dispersion spectroscopy indi-cates that the elements at the interface undergo mutual diffusion,which is beneficial for improving the bonding strength of the interface.There is an amorphous transition layer with a thickness of about 5 nm at the bonding interface.The preparation of Si-based GaAs heterojunctions can enrich the types of materials required for the development of integrated circuits,improve the performance of materials and devices,and promote the development of microelectronics technology.
基金financially supported by the National Natural Science Foundation of China(Grant No.51972130)the Startup Fund of Huazhong University of Science and Technologythe Director Fund of Wuhan National Laboratory for Optoelectronics
文摘Zero-dimensional(0D)hybrid metal halides,which consist of organic cations and isolated inorganic metal halide anions,have emerged as phosphors with efficient broadband emissions.However,these materials generally have too wide bandgaps and thus cannot be excited by blue light,which hinders their applications for efficient white light-emitting diodes(WLEDs).The key to achieving a blue-light-excitable 0D hybrid metal halide phosphor is to reduce the fundamental bandgap by rational chemical design.In this work,we report two designed hybrid copper(I)iodides,(Ph_(3)MeP)_(2)Cu_(4)I_(6)and(Cy_(3)MeP)_(2)Cu_(4)I_(6),as blue-light-excitable yellow phosphors with ultrabroadband emission.In these compounds,the[Cu_(4)I_(6)]^(2-)anion forms an I6 octahedron centered on a cationic Cu_(4)tetrahedron.The strong cation-cation bonding within the unique cationic Cu_(4)tetrahedra enables significantly lowered conduction band minimums and thus narrowed bandgaps,as compared to other reported hybrid copper(I)iodides.The ultrabroadband emission is attributed to the coexistence of free and self-trapped excitons.The WLED using the[Cu_(4)I_(6)]^(2-)anion-based single phosphor shows warm white light emission,with a high luminous efficiency of 65 Im W^(-1)and a high color rendering index of 88.This work provides strategies to design narrow-bandgap 0D hybrid metal halides and presents two first examples of blue-light-excitable 0D hybrid metal halide phosphors for efficient WLEDs.
基金Intelligent Manufacturing and Robot Technology Innovation Project of Beijing Municipal Commission of Science and Technology and Zhongguancun Science and Technology Park Management Committee,Grant/Award Number:Z221100000222016National Natural Science Foundation of China,Grant/Award Number:62076014Beijing Municipal Education Commission and Beijing Natural Science Foundation,Grant/Award Number:KZ202010005004。
文摘Non-destructive detection of wire bonding defects in integrated circuits(IC)is critical for ensuring product quality after packaging.Image-processing-based methods do not provide a detailed evaluation of the three-dimensional defects of the bonding wire.Therefore,a method of 3D reconstruction and pattern recognition of wire defects based on stereo vision,which can achieve non-destructive detection of bonding wire defects is proposed.The contour features of bonding wires and other electronic components in the depth image is analysed to complete the 3D reconstruction of the bonding wires.Especially to filter the noisy point cloud and obtain an accurate point cloud of the bonding wire surface,a point cloud segmentation method based on spatial surface feature detection(SFD)was proposed.SFD can extract more distinct features from the bonding wire surface during the point cloud segmentation process.Furthermore,in the defect detection process,a directional discretisation descriptor with multiple local normal vectors is designed for defect pattern recognition of bonding wires.The descriptor combines local and global features of wire and can describe the spatial variation trends and structural features of wires.The experimental results show that the method can complete the 3D reconstruction and defect pattern recognition of bonding wires,and the average accuracy of defect recognition is 96.47%,which meets the production requirements of bonding wire defect detection.
基金National Natural Science Foundation of China(U22B20131)for supporting this project.
文摘Introducing Neutral Polymeric bonding agents(NPBA) into the Nitrate Ester Plasticized Polyether(NEPE)propellant could improve the adhesion between filler/matrix interface, thereby contributing to the development of new generations of the NEPE propellant with better mechanical properties. Therefore,understanding the effects of NPBA on the deformation and damage evolution of the NEPE propellant is fundamental to material design and applications. This paper studies the uniaxial tensile and stress relaxation responses of the NEPE propellant with different amounts of NPBA. The damage evolution in terms of interface debonding is further investigated using a cohesive-zone model(CZM). Experimental results show that the initial modulus and strength of the NEPE propellant increase with the increasing amount of NPBA while the elongation decreases. Meanwhile, the relaxation rate slows down and a higher long-term equilibrium modulus is reached. Experimental and numerical analyses indicate that interface debonding and crack propagation along filler-matrix interface are the dominant damage mechanism for the samples with a low amount of NPBA, while damage localization and crack advancement through the matrix are predominant for the ones with a high amount of NPBA. Finally, crosslinking density tests and simulation results also show that the effect of the bonding agent is interfacial rather than due to the overall crosslinking density change of the binder.
基金financially supported by the National Natural Science Foundation of China(Grant No.21905033,52271201)the Key Research and DevelopmentProgram of Sichuan Province(Grant No.2022YFG0100)+1 种基金the Central Government Funds of Guiding Local Scientific and Technological Development for Sichuan Province(Grant No.2022ZYD0045)the State Key Laboratory of Vanadium and Titanium Resources Comprehensive Utilization(Grant No.2020P4FZG02A)
文摘The interfacial chemistry of solid electrolyte interphases(SEI)on lithium(Li)electrode is directly determined by the structural chemistry of the electric double layer(EDL)at the interface.Herein,a strategy for regulating the structural chemistry of EDL via the introduction of intermolecular hydrogen bonds has been proposed(p-hydroxybenzoic acid(pHA)is selected as proof-of-concept).According to the molecular dynamics(MD)simulation and density functional theory(DFT)calculation results,the existence of hydrogen bonds realizes the anion structural rearrangement in the EDL,reduces the lowest unoccupied molecular orbital(LUMO)energy level of anions in the EDL,and the number of free solvent molecules,which promotes the formation of inorganic species-enriched SEI and eventually achieves the dendrite-free Li deposition.Based on this strategy,Li‖Cu cells can stably run over 185 cycles with an accumulated active Li loss of only 2.27 mAh cm^(-2),and the long-term cycle stability of Li‖Li cells is increased to 1200 h.In addition,the full cell pairing with the commercial LiFePO_(4)(LFP)cathodes exhibits stable cycling performance at 1C,with a capacity retention close to 90%after 200 cycles.
基金Supported by Innovation and Technology Fund (No.ITP/045/19AP)Commercial Research&Development (CRD) Funding Supported by Hong Kong Productivity Council (No.10008787)。
文摘We put forward a method of fabricating Aluminum(Al)/carbon fibers(CFs) composite sheets by the accumulative roll bonding(ARB) method. The finished Al/CFs composite sheet has CFs and pure Al sheets as sandwich and surface layers. After cross-section observation of the Al/CFs composite sheet, we found that the CFs discretely distributed within the sandwich layer. Besides, the tensile test showed that the contribution of the sandwich CFs layer to tensile strength was less than 11% compared with annealed pure Al sheet. With ex-situ observation of the CFs breakage evolution with-16%,-32%, and-45% rolling reduction during the ARB process, the plastic instability of the Al layer was found to bring shear damages to the CFs. At last, the bridging strengthening mechanism introduced by CFs was sacrificed. We provide new insight into and instruction on Al/CFs composite sheet preparation method and processing parameters.
文摘One of the challenges for bimetal manufacturing is the joining process.Hence,transient liquid phase(TLP)bonding was performed between 304L stainless steel and Cp-Ti using an Ag-Cu interlayer with a thickness of 75μm for bonding time of 20,40,60,and 90 min.The bonding temperature of 860℃ was considered,which is under the β transus temperature of Cp-Ti.During TLP bonding,various intermetallic compounds(IMCs),including Ti_(5)Cr_(7)Fe_(17),(Cr,Fe)_(2)Ti,Ti(Cu,Fe),Ti_(2)(Cu,Ag),and Ti_(2)Cu from 304L toward Cp-Ti formed in the joint.Also,on the one side,with the increase in time,further diffusion of elements decreases the blocky IMCs such as Ti_(5)Cr_(7)Fe_(17),(Cr,Fe)_(2)Ti,Ti(Cu,Fe)in the 304L diffusion-affected zone(DAZ)and reaction zone,and on the other side,Ti_(2)(Cu,Ag)IMC transformed into fine morphology toward Cp-Ti DAZ.The microhardness test also demonstrated that the(Cr,Fe)_(2)Ti+Ti_(5)Cr_(7)Fe_(17) IMCs in the DAZ on the side of 304L have a hardness value of HV 564,making it the hardest phase.The maximum and minimum shear strength values are equal to 78.84 and 29.0 MPa,respectively.The cleavage pattern dominated fracture surfaces due to the formation of brittle phases in dissimilar joints.
基金supports from the National Natural Science Foundation of China(Nos.52075472,52004242)the National Key Research and Development Program of China(No.2018YFA0707300)the Natural Science Foundation of Hebei Province,China(No.E2020203001)。
文摘TA1 P-Ti/AA6061 composite plate was produced by oxidizing the surface of the titanium plate and adopting a cold roll bonding process.The results revealed that the oxide film(Ti6O)prepared on the surface of TA1 pure titanium was easy to crack during the cold roll bonding,thereby promoting the formation of an effective mechanical interlock at the interface,which can effectively reduce the minimum reduction rate of the composite plates produced by cold rolling of titanium and aluminium plates.Moreover,the composite plate subjected to oxidation treatment exhibited high shear strength,particularly at a 43%reduction rate,achieving a commendable value of 117 MPa.Based on oxidation treatment and different reduction rates,the annealed composite plates at temperatures of 400,450,and 500°C displayed favorable resistance to interface delamination,highlighting their remarkable strength-plasticity compatibility as evidenced by a maximum elongation of 31.845%.
文摘This year,Toray Industries,Inc.,announced that it has developed an insulating resin material for hybrid bonding(micro bonding).The material is based on Semicofine™and Photoneece™.These are high-heat-resistant polyimide coatings for semiconductor and display devices.The new material combines a conventional polyimide coating agent with the company’s processing and bonding technologies.It can enhance the yields and reliability of semiconductor devices in the hybrid bonding process,which entails bonding semiconductor chips with metal electrodes.Toray will push ahead with prototyping and providing samples to customers.It aims to obtain materials certification in 2025 and start mass production by 2028.
基金Scientific Research Fund of Hunan Provincial Education Department(21A0123)。
文摘In order to investigate the degradation of bonding properties between corroded steel bars and concrete,this study employs the half-beam method to conduct bond-slip tests between corroded steel bars and concrete after impressed-current accelerated corrosion of the steel bars in concrete.The effects of steel corrosion rate,steel bar diameter,steel bar strength grade,and concrete strength grade on the bonding properties between concrete and corroded steel bars were analyzed.The influence of different corrosion rates on specimens’bonding strength and bond-slip curves was determined,and a constitutive relationship for bond-slip between corroded steel bars and concrete was proposed.The results indicate that the ultimate bonding strength of corroded reinforced concrete specimens decreases with increasing corrosion rate.Additionally,an increase in corrosive crack width leads to a linear decrease in bonding strength.Evaluating the decline in adhesive properties through rust expansion crack width in engineering applications is feasible.Furthermore,a bond-slip constitutive relationship between corroded steel bars and concrete was established using relative bond stress and relative slip values,which aligned well with the experimental findings.
基金Project(51312JQ08)supported by the Pre-Research Foundation of China General Equipment DepartmentProject(NBPJ2013-4)supported by the Postdoctoral Science Foundation of Ningbo Branch of China Academy of Ordnance Science+1 种基金Project(bsh1402073)supported by the Postdoctoral Science Foundation of Zhejiang Province,ChinaProject(2014A610051)supported by the Ningbo Natural Science Foundation of China
文摘The bonding interface of 7B52 Al alloy laminated composite (ALC) fabricated by hot rolling was investigated using optical microscopy (OM), transmission electron microscopy (TEM), scanning electron microscopy (SEM), ultrasonic flaw detection (UFD), and bonding strength tests. The results show that metallurgical bonding is achieved at the interface after composite rolling. The TEM analysis and tensile tests indicate that the 7B52 ALC plate combines high strength of the hard individual layer and good toughness of the soft individual layer. However, UFD technology and SEM analysis prove that the defects (thick oxide films, acid washed residues, air, oil and coarse particles) existing in the bonding interface are harmful to the bonding strength. To sum up, the composite roiling process is suitable for 7B52 ALC plate, and the content and size of the defects should be controlled strictly. Advanced surface treatment of each individual layer would be beneficial to further improve the bonding quality.
文摘In this work,the ultrasonic assisted active metal soldering of SiO_(2) glass and Al was successfully achieved using Sn-2Ti solder filler at a low soldering temperature of 250℃in ambient atmosphere.A nano-crystallineα-Al2O3 layer with the average thickness of 13.9 nm and a nano-crystalline R-TiO_(2) layer with the average thickness of 16.2 nm are formed at the interface of Al/Sn and SiO_(2)/Sn respectively because Al elements did not diffuse from Al alloy side to SiO_(2) side,which verified that a sono-oxidation reaction had occurred during the ultrasonic assisted active metal soldering process.The soldered butt joints exhibited an average tensile strength of 25.31 MPa.
基金Funded by National Natural Science Foundation of China(Nos.U21A20149 and 51878003)。
文摘To evaluate various interlaminar bonding reinforcement techniques used for steel bridge decks,the UHPC surface was roughened with shot blasting(SB),transverse grooving(TG)and surface embedded stone(S),epoxy resin(E),epoxy asphalt(EA)and high viscosity high elasticity asphalt(HV)as interlayer bonding materials.In addition,a diagonal shear test was conducted using a self-designed diagonal shear jig.The effects of adhesive layer materials type,surface texture type,and different loading rates on the interlaminar bonding performance of UHPC/SMA combination specimens were investigated.The experimental study showed that the peak shear strength and shear modulus of the combined specimen decreased gradually with the decrease of thermosetting of the adhesive layer materials.The peak shear fracture energy of E was greater than that of HV and EA.The synergistic effect of the contact force generated by the roughing of the UHPC surface,the friction force,and the bonding force provided by the adhesive layer material can significantly improve the interlaminar shear performance of the assemblies.The power-law function of shear strength and shear modulus was proposed.The power-law model of peak shear strength and loading rate was verified.The shear strength and predicted shear strength satisfy the positive proportional functions with scale factors of 0.985,1.015,0.961,and 1.028,respectively.
基金financially supported by the National Natural Science Foundation of China(No.52004029)the Fundamental Research Funds for the Central Universities,China(No.FRF-TT-20-06).
文摘Higher requirements for the accuracy of relevant models are put throughout the transformation and upgrade of the iron and steel sector to intelligent production.It has been difficult to meet the needs of the field with the usual prediction model of mechanical properties of hotrolled strip.Insufficient data and difficult parameter adjustment limit deep learning models based on multi-layer networks in practical applications;besides,the limited discrete process parameters used make it impossible to effectively depict the actual strip processing process.In order to solve these problems,this research proposed a new sampling approach for mechanical characteristics input data of hot-rolled strip based on the multi-grained cascade forest(gcForest)framework.According to the characteristics of complex process flow and abnormal sensitivity of process path and parameters to product quality in the hot-rolled strip production,a three-dimensional continuous time series process data sampling method based on time-temperature-deformation was designed.The basic information of strip steel(chemical composition and typical process parameters)is fused with the local process information collected by multi-grained scanning,so that the next link’s input has both local and global features.Furthermore,in the multi-grained scanning structure,a sub sampling scheme with a variable window was designed,so that input data with different dimensions can get output characteristics of the same dimension after passing through the multi-grained scanning structure,allowing the cascade forest structure to be trained normally.Finally,actual production data of three steel grades was used to conduct the experimental evaluation.The results revealed that the gcForest-based mechanical property prediction model outperforms the competition in terms of comprehensive performance,ease of parameter adjustment,and ability to sustain high prediction accuracy with fewer samples.
基金supported by the National Key Research and Development Program of China (2022YFB4002100)the development project of Zhejiang Province's "Jianbing" and "Lingyan" (2023C01226)+4 种基金the National Natural Science Foundation of China (22278364, U22A20432, 22238008, 22211530045, and 22178308)the Fundamental Research Funds for the Central Universities (226-2022-00044 and 226-2022-00055)the Science Foundation of Donghai Laboratory (DH-2022ZY0009)the Startup Foundation for Hundred-Talent Program of Zhejiang UniversityScientific Research Fund of Zhejiang Provincial Education Department.
文摘Metal-organic frameworks(MOFs)have been developed as an ideal platform for exploration of the relationship between intrinsic structure and catalytic activity,but the limited catalytic activity and stability has hampered their practical use in water splitting.Herein,we develop a bond length adjustment strategy for optimizing naphthalene-based MOFs that synthesized by acid etching Co-naphthalenedicarboxylic acid-based MOFs(donated as AE-CoNDA)to serve as efficient catalyst for water splitting.AE-CoNDA exhibits a low overpotential of 260 mV to reach 10 mA cm^(−2)and a small Tafel slope of 62 mV dec^(−1)with excellent stability over 100 h.After integrated AE-CoNDA onto BiVO_(4),photocurrent density of 4.3 mA cm^(−2)is achieved at 1.23 V.Experimental investigations demonstrate that the stretched Co-O bond length was found to optimize the orbitals hybridization of Co 3d and O 2p,which accounts for the fast kinetics and high activity.Theoretical calculations reveal that the stretched Co-O bond length strengthens the adsorption of oxygen-contained intermediates at the Co active sites for highly efficient water splitting.