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液相色谱-质谱/质谱法测定包装材料中的全氟辛酸及其盐类物质 被引量:22
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作者 王利兵 吕刚 +1 位作者 冯智劼 赵好力宝 《色谱》 CAS CSCD 北大核心 2007年第1期115-115,共1页
关键词 液相色谱-质谱/质谱联用(HPLC—MS/MS) 快速溶剂萃取(accelerated SOLVENT extraction) 全氟辛酸(perfluorooctanoic acid) 包装材料(packaging materials)
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多用途的改性剂——乙烯-丙烯酸酯共聚物
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作者 孙载坚 《现代塑料加工应用》 CAS 2002年第6期64-64,共1页
关键词 改性剂 乙烯-丙烯酸酯共聚物 杜邦packaging公司 INDUSTRIAL Polymer公司 加工稳定性 熔体强度 工程塑料 韧性 抗冲击强度
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芯片堆叠封装耐湿热可靠性 被引量:2
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作者 唐宇 廖小雨 +2 位作者 黄杰豪 吴志中 李国元 《半导体技术》 CAS CSCD 北大核心 2014年第7期539-544,共6页
采用Abaqus软件模拟了CPU和DDR双层芯片堆叠封装组件在85℃/RH85%湿热环境下分别吸湿5,17,55和168 h的相对湿气扩散分布和吸湿168 h后回流焊过程中湿应力、热应力和湿热应力分布,并通过吸湿和回流焊实验分析了该组件在湿热环境下的失效... 采用Abaqus软件模拟了CPU和DDR双层芯片堆叠封装组件在85℃/RH85%湿热环境下分别吸湿5,17,55和168 h的相对湿气扩散分布和吸湿168 h后回流焊过程中湿应力、热应力和湿热应力分布,并通过吸湿和回流焊实验分析了该组件在湿热环境下的失效机理。模拟结果表明,在湿热环境下,分别位于基板和CPU、CPU和DDR之间的粘结层1和2不易吸湿,造成粘结层的相对湿度比塑封材料低得多,但粘结层1的相对湿度比粘结层2要高。吸湿168 h后,在回流焊载荷下湿应力主要集中在芯片DDR远离中心的长边上,而最大湿热应力和热应力一样位于底层芯片CPU的底角处,其数值是单纯热应力的1.3倍。实验结果表明,界面裂纹及分层集中在底层CPU芯片的边角处和芯片、粘结层和塑封材料的交界处,与模拟结果相一致。 展开更多
关键词 芯片堆叠封装 湿气扩散 湿热应力 界面分层 有限元分析(FEA)
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综合改进控制方法消除压力蒸汽灭菌后湿包现象的研究 被引量:2
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作者 牛璐 邹秀珍 《中国民康医学》 2012年第2期148-149,222,共3页
目的:研究消除压力蒸汽灭菌湿包现象的有效方法。方法:2010年1~12月,按照原方法与改进方法分为两组进行压力蒸汽灭菌消毒,统计湿包数。结果:改进控制方法后湿包数量明显减少,差异有统计学意义。结论:根据导致压力蒸汽灭菌后出现湿包的... 目的:研究消除压力蒸汽灭菌湿包现象的有效方法。方法:2010年1~12月,按照原方法与改进方法分为两组进行压力蒸汽灭菌消毒,统计湿包数。结果:改进控制方法后湿包数量明显减少,差异有统计学意义。结论:根据导致压力蒸汽灭菌后出现湿包的常见原因,采取有效改进措施,可以明显减少湿包现象的发生,避免二次污染,保证灭菌质量。 展开更多
关键词 医院供应室 改进控制方法 蒸汽灭菌 湿包
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湿热对PoP封装可靠性影响的研究 被引量:7
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作者 刘海龙 杨少华 李国元 《半导体技术》 CAS CSCD 北大核心 2010年第11期1054-1058,1098,共6页
堆叠封装(package-on-package,PoP)是一种先进的三维封装。首先基于有限元分析方法对PoP封装进行建模,对PoP封装在潮湿环境中进行了吸湿和解吸附分析。研究了吸湿膨胀引入的湿应力和回流焊过程中引入的热应力对PoP封装可靠性的影响,与... 堆叠封装(package-on-package,PoP)是一种先进的三维封装。首先基于有限元分析方法对PoP封装进行建模,对PoP封装在潮湿环境中进行了吸湿和解吸附分析。研究了吸湿膨胀引入的湿应力和回流焊过程中引入的热应力对PoP封装可靠性的影响,与热膨相似,聚合物与非聚合物膨胀系数不同会导致封装中出现吸湿不匹配应力。模拟结果表明,最大湿-机械应力出现在封装边缘焊球的边角处,顶层封装的湿-热-机械应力均比底层封装大。顶层封装是PoP封装的关键因素,湿气与热应力一样对PoP封装的可靠性起着重要的作用。 展开更多
关键词 堆叠封装 湿热应力 有限元 湿气扩散 塑封器件
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Carbon nanotubes for electronics manufacturing and packaging:from growth to integration 被引量:2
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作者 Johan Liu Di Jiang +1 位作者 Yifeng Fu Teng Wang 《Advances in Manufacturing》 SCIE CAS 2013年第1期13-27,共15页
Carbon nanotubes (CNTs) possess excellent electrical, thermal and mechanical properties. They are light in weight yet stronger than most of the other materials. They can be made both highly conductive and semi-condu... Carbon nanotubes (CNTs) possess excellent electrical, thermal and mechanical properties. They are light in weight yet stronger than most of the other materials. They can be made both highly conductive and semi-conductive. They can be made from nano-sized small catalyst particles and extend to tens of millimeters long. Since CNTs emerged as a hot topic in the early 1990s, numerous research efforts have been spent on the study of the various properties of this new material. CNTs have been proposed as alternative materials of potential excellence in a lot of applications such as electronics, chemical sensors, mechanical sensors/actuators and composite materials, etc. This paper reviews the use of CNTs particularly in electronics manufacturing and packaging field. The progresses of three most important applications, including CNT-based thermal interface materials, CNT-based interconnections and CNT-based cooling devices are reviewed. The growth and post-growth processing of CNTs for specific applications are introduced and the tai- loring of CNTs properties, i.e., electrical resistivity, thermal conductivity and strength, etc., is discussed with regard to specific application requirement. As the semiconductor industry is still driven by the need of getting smaller and faster, CNTs and the related composite systems as emerging new materials are likely to provide the solution to the future challenges as we make more and more complex electronics devices and systems. 展开更多
关键词 Carbon nanotubes Electronicsmanufacturing Electronics packaging - Growth INTEGRATION
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Double regularization control based on level set evolution for tablet packaging image segmentation
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作者 Li Liu Ao-Lei Yang +3 位作者 Xiao-Wei Tu Wen-Ju Zhou Min-Rui Fei Jun Yue 《Advances in Manufacturing》 SCIE CAS CSCD 2015年第1期73-83,共11页
This paper proposes a novel double regular- ization control (DRC) method which is used for tablet packaging image segmentation. Since the intensities of tablet packaging images are inhomogenous, it is difficult to m... This paper proposes a novel double regular- ization control (DRC) method which is used for tablet packaging image segmentation. Since the intensities of tablet packaging images are inhomogenous, it is difficult to make image segmentation. Compared to methods based on level set, the proposed DRC method has some advantages for tablet packaging image segmentation. The local re- gional control term and the rectangle initialization contour are first employed in this method to quickly segment un- even grayscale images and accelerate the curve evolution rate. Gaussian filter operator and the convolution calcula- tion are then adopted to remove the effects of texture noises in image segmentation. The developed penalty energy function, as regularization term, increases the constrained conditions based on the gradient flow conditions. Since the potential function is embedded into the level set of evo- lution equations and the image contour evolutions are bi- laterally extended, the proposed method further improves the accuracy of image contours. Experimental studies show that the DRC method greatly improves the computational efficiency and numerical accuracy, and achieves better results for image contour segmentation compared to other level set methods. 展开更多
关键词 Tablet packaging image . Level setevolution - Image segmentation - Curvatures . Doubleregularization control (DRC)
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