The physical processes associated with the clear-sky greenhouse effect in the presence of water vapor are examined by including surface emissivity in the greenhouse effect formulation, and by introducing a new way to ...The physical processes associated with the clear-sky greenhouse effect in the presence of water vapor are examined by including surface emissivity in the greenhouse effect formulation, and by introducing a new way to partition physical processes of the greenhouse effect. In this new framework, it is found that the clear-sky greenhouse effect is governed by three physical processes associated with (1) the temperature contrast between the surface and the atmosphere, (2) the interaction between the surface emissivity and the temperature contrast, and (3) the surface emissivity. The importance of the three physical processes is assessed by computing their vertical and spectral variations far the subarctic winter and summer standard atmosphere using the radiation model MODTRAN3 (Moderate Resolution Transmittance code Version 3). The results show that the process associated with the temperature contrast between the surface and the atmosphere dominates over the other two processes in magnitude. The magnitude of this process has substantial variations in the spectral region of 1250 to 1880 cm-1 and in the far infrared region. Due to the low-level temperature inversion over the subarctic winter, there exists a negative contribution to the greenhouse trapping. The seasonal variations are, however, dominated by the processes associated with the interaction between the surface emissivity and the temperature contrast as well as the surface emissivity itself. The magnitudes of these two physical processes contributing to the greenhouse trapping over the subarctic winter are about 7 to 10 times of those over the subarctic summer, whereas the magnitude of the processes associated with the temperature contrast in the subarctic summer is only about 2 times of that in the subarctic winter.展开更多
A method for predicting effective thermal conductivities(ETCs) of three-dimensional five-directional(3D5D) braided composites is presented. The effective thermal conductivity prediction method contains a digital image...A method for predicting effective thermal conductivities(ETCs) of three-dimensional five-directional(3D5D) braided composites is presented. The effective thermal conductivity prediction method contains a digital image processing technology. Multiple scanning electron microscopy(SEM)images of composites are analyzed to obtain actual microstructural features. These actual microstructural features of 3D5D braided composites are introduced into representative volume element(RVE) modeling. Apart from applying actual microstructural features,compression effects between yarns are considered in the modeling of RVE,making the RVE more realistic. Therefore,the ETC prediction method establishes a representative unit cell model that better reflects the true microstructural characteristics of the 3D5D braided composites. The ETCs are predicted with the finite element method. Then thermal conductivity measurements are carried out for a 3D5D braided composite sample.By comparing the predicted ETC with the measured thermal conductivity, the whole process of the ETC prediction method is proved to be effective and accurate,where a relative error of only 2.9 % is obtained.Furthermore,the effects of microstructural features are investigated,indicating that increasing interior braiding angles and fiber fill factor can lead to higher transverse ETCs. Longitudinal ETCs decrease with increasing interior braiding angles,but increase with increasing fiber fill factor. Finally,the influence of variations of microstructure parameters observed in digital image processing are investigated. To explore the influence of variations in microstructural features on variations in predicted ETCs,the actual probability distributions of microstructural features obtained from the 3D5D braided composite sample are introduced into the ETC investigation. The results show that,compared with the interior braiding angle,variations in the fiber fill factor exhibit more significant effects on variations in ETCs.展开更多
针对北京城市热岛的空间变化特征及其发展趋势,重点探讨了北京城市热岛总体演变趋势及其多尺度非均匀分布特征与城市建筑群面积、中高层建筑群空间布局的相关关系。采用晴空过程北京城郊地面自动气象站AWS(Automatic weather station)...针对北京城市热岛的空间变化特征及其发展趋势,重点探讨了北京城市热岛总体演变趋势及其多尺度非均匀分布特征与城市建筑群面积、中高层建筑群空间布局的相关关系。采用晴空过程北京城郊地面自动气象站AWS(Automatic weather station)气温观测真值对卫星遥感云顶黑体温度TBB(Temperature of black body on the top of cloud)高分辨率场实施变分订正,解决城市热岛研究中高分辨率卫星遥感的客观性订正问题。研究结果揭示了北京城市建筑群面积及中高层建筑群布局对城市热岛群总体演变趋势、多尺度热岛群非均匀分布特征的显著影响效应。结果表明,北京晴空过程城区及近郊区多尺度热岛效应可由强、弱程度不同的热岛群"合成",北京地区热岛分布呈多尺度非均匀特征,即城区东西两侧为强热岛区,城西北园林区与古城中轴线区域为相对弱热岛区;在北京城市高速发展背景下,城郊街区热岛群的非均匀分布特征与城市建筑群布局之间存在着相关关系;城市建筑群面积及中高层建筑密集程度的差异可产生区域性强弱不同的热岛效应,这间接反映出北京城郊中高层建筑群暖气或空调排放热源的局地影响效应。上述研究结果可为城市发展有关建筑群布局与园林绿地规划设计提供科学依据。展开更多
Routing resources are the major bottlenecks in improving the performance and power consumption of the current FPGAs. Recently reported researches have shown that carbon nanotube field effect transistors(CNFETs) have c...Routing resources are the major bottlenecks in improving the performance and power consumption of the current FPGAs. Recently reported researches have shown that carbon nanotube field effect transistors(CNFETs) have considerable potentials for improving the delay and power consumption of the modern FPGAs. In this paper, hybrid CNFET-CMOS architecture is presented for FPGAs and then this architecture is evaluated to be used in modern FPGAs. In addition, we have designed and parameterized the CNFET-based FPGA switches and calibrated them for being utilized in FPGAs at 45 nm, 22 nm and 16 nm technology nodes.Simulation results show that the CNFET-based FPGA switches improve the current FPGAs in terms of performance, power consumption and immunity to process and temperature variations. Simulation results and analyses also demonstrate that the performance of the FPGAs is improved about 30%, on average and the average and leakage power consumptions are reduced more than 6% and 98% respectively when the CNFET switches are used instead of MOSFET FPGA switches. Moreover, this technique leads to more than 20.31%smaller area. It is worth mentioning that the advantages of CNFET-based FPGAs are more considerable when the size of FPGAs grows and also when the technology node becomes smaller.展开更多
文摘The physical processes associated with the clear-sky greenhouse effect in the presence of water vapor are examined by including surface emissivity in the greenhouse effect formulation, and by introducing a new way to partition physical processes of the greenhouse effect. In this new framework, it is found that the clear-sky greenhouse effect is governed by three physical processes associated with (1) the temperature contrast between the surface and the atmosphere, (2) the interaction between the surface emissivity and the temperature contrast, and (3) the surface emissivity. The importance of the three physical processes is assessed by computing their vertical and spectral variations far the subarctic winter and summer standard atmosphere using the radiation model MODTRAN3 (Moderate Resolution Transmittance code Version 3). The results show that the process associated with the temperature contrast between the surface and the atmosphere dominates over the other two processes in magnitude. The magnitude of this process has substantial variations in the spectral region of 1250 to 1880 cm-1 and in the far infrared region. Due to the low-level temperature inversion over the subarctic winter, there exists a negative contribution to the greenhouse trapping. The seasonal variations are, however, dominated by the processes associated with the interaction between the surface emissivity and the temperature contrast as well as the surface emissivity itself. The magnitudes of these two physical processes contributing to the greenhouse trapping over the subarctic winter are about 7 to 10 times of those over the subarctic summer, whereas the magnitude of the processes associated with the temperature contrast in the subarctic summer is only about 2 times of that in the subarctic winter.
文摘A method for predicting effective thermal conductivities(ETCs) of three-dimensional five-directional(3D5D) braided composites is presented. The effective thermal conductivity prediction method contains a digital image processing technology. Multiple scanning electron microscopy(SEM)images of composites are analyzed to obtain actual microstructural features. These actual microstructural features of 3D5D braided composites are introduced into representative volume element(RVE) modeling. Apart from applying actual microstructural features,compression effects between yarns are considered in the modeling of RVE,making the RVE more realistic. Therefore,the ETC prediction method establishes a representative unit cell model that better reflects the true microstructural characteristics of the 3D5D braided composites. The ETCs are predicted with the finite element method. Then thermal conductivity measurements are carried out for a 3D5D braided composite sample.By comparing the predicted ETC with the measured thermal conductivity, the whole process of the ETC prediction method is proved to be effective and accurate,where a relative error of only 2.9 % is obtained.Furthermore,the effects of microstructural features are investigated,indicating that increasing interior braiding angles and fiber fill factor can lead to higher transverse ETCs. Longitudinal ETCs decrease with increasing interior braiding angles,but increase with increasing fiber fill factor. Finally,the influence of variations of microstructure parameters observed in digital image processing are investigated. To explore the influence of variations in microstructural features on variations in predicted ETCs,the actual probability distributions of microstructural features obtained from the 3D5D braided composite sample are introduced into the ETC investigation. The results show that,compared with the interior braiding angle,variations in the fiber fill factor exhibit more significant effects on variations in ETCs.
文摘针对北京城市热岛的空间变化特征及其发展趋势,重点探讨了北京城市热岛总体演变趋势及其多尺度非均匀分布特征与城市建筑群面积、中高层建筑群空间布局的相关关系。采用晴空过程北京城郊地面自动气象站AWS(Automatic weather station)气温观测真值对卫星遥感云顶黑体温度TBB(Temperature of black body on the top of cloud)高分辨率场实施变分订正,解决城市热岛研究中高分辨率卫星遥感的客观性订正问题。研究结果揭示了北京城市建筑群面积及中高层建筑群布局对城市热岛群总体演变趋势、多尺度热岛群非均匀分布特征的显著影响效应。结果表明,北京晴空过程城区及近郊区多尺度热岛效应可由强、弱程度不同的热岛群"合成",北京地区热岛分布呈多尺度非均匀特征,即城区东西两侧为强热岛区,城西北园林区与古城中轴线区域为相对弱热岛区;在北京城市高速发展背景下,城郊街区热岛群的非均匀分布特征与城市建筑群布局之间存在着相关关系;城市建筑群面积及中高层建筑密集程度的差异可产生区域性强弱不同的热岛效应,这间接反映出北京城郊中高层建筑群暖气或空调排放热源的局地影响效应。上述研究结果可为城市发展有关建筑群布局与园林绿地规划设计提供科学依据。
文摘Routing resources are the major bottlenecks in improving the performance and power consumption of the current FPGAs. Recently reported researches have shown that carbon nanotube field effect transistors(CNFETs) have considerable potentials for improving the delay and power consumption of the modern FPGAs. In this paper, hybrid CNFET-CMOS architecture is presented for FPGAs and then this architecture is evaluated to be used in modern FPGAs. In addition, we have designed and parameterized the CNFET-based FPGA switches and calibrated them for being utilized in FPGAs at 45 nm, 22 nm and 16 nm technology nodes.Simulation results show that the CNFET-based FPGA switches improve the current FPGAs in terms of performance, power consumption and immunity to process and temperature variations. Simulation results and analyses also demonstrate that the performance of the FPGAs is improved about 30%, on average and the average and leakage power consumptions are reduced more than 6% and 98% respectively when the CNFET switches are used instead of MOSFET FPGA switches. Moreover, this technique leads to more than 20.31%smaller area. It is worth mentioning that the advantages of CNFET-based FPGAs are more considerable when the size of FPGAs grows and also when the technology node becomes smaller.
文摘为了实现模拟集成电路版图设计的自动化,提出一种称为金属-氧化物-半导体场效应晶体管阵列的版图布局方法。90 nm/1. 2 V互补式MOS的测试元件组(TEG)芯片被开发用以实验采样,芯片搭载多种导电沟道分割形式的多指栅晶体管,晶体管在电路的版图设计中以不同的布局形态呈现。这些晶体管的电气参数被测试并抽取,用以分析和评价其直流性能。以二级模拟运算放大器为实验电路,分别采用晶体管阵列和全定制方式进行版图设计,从工艺波动性和版图面积两方面进行对比。成品实测结果表明:以晶体管阵列方式实现共源共栅运放电路时,10枚TEG芯片的平均失调电压为4. 48 m V,对比手工版图的5. 59 m V,抗波动性能约提升了20%,显示了晶体管阵列版图设计方法的有效性。
