A study of Cl2/BCl3-based inductively coupled plasma （ICP） was conducted using thick photoresist mask for anisotropic etching of 50μm diameter holes in a GaAs wafer at a relatively high average etching rate for etc...A study of Cl2/BCl3-based inductively coupled plasma （ICP） was conducted using thick photoresist mask for anisotropic etching of 50μm diameter holes in a GaAs wafer at a relatively high average etching rate for etching depths of more than 150μm. Plasma etch characteristics with ICP process pressure and the percentage of BCI3 were studied in greater detail at a constant ICP coil/bias power. The measured peak-to-peak voltage as a function of pressure was used to estimate the minimum energy of the ions bombarding the substrate. The process pressure was found to have a substantial influence on the energy of heavy ions. Various ion species in plasma showed minimum energy variation from 1.85 eV to 7.5 eV in the pressure range of 20 mTorr to 50 mTorr. The effect of pressure and the percentage of BCl3 on the etching rate and surface smoothness of the bottom surface of the etched hole were studied for a fixed total flow rate. The etching rate was found to decrease with the percentage of BCl3, whereas the addition of BCl3 resulted in anisotropic holes with a smooth veil free bottom surface at a pressure of 30 mTorr and 42% BC13. In addition, variation of the etching yield with pressure and etching depth were also investigated.展开更多
鉴于SiC材料具有很强的稳定性以及湿法刻蚀的种种缺点,目前主要使用干法刻蚀来刻蚀SiC材料。但是干法刻蚀后样品表面的粗糙度对器件的性能有一定的影响。针对这一问题,采用电感耦合等离子体-反应离子刻蚀技术,对SiC材料进行SF_6/O_2混...鉴于SiC材料具有很强的稳定性以及湿法刻蚀的种种缺点,目前主要使用干法刻蚀来刻蚀SiC材料。但是干法刻蚀后样品表面的粗糙度对器件的性能有一定的影响。针对这一问题,采用电感耦合等离子体-反应离子刻蚀技术,对SiC材料进行SF_6/O_2混合气体和SF_6/CF4/O_2混合气体的刻蚀,并且探究了压强、ICP功率和混合气体比例对样品表面粗糙度的影响。实验结果表明使用SF_6/O_2混合气体刻蚀后,样品的表面平整度较好。在一定RIE功率条件下,当ICP功率为700 W、压强为20 m T和SF_6/O_2为50/40 sccm时,样品表面的粗糙度最小。展开更多
文摘A study of Cl2/BCl3-based inductively coupled plasma （ICP） was conducted using thick photoresist mask for anisotropic etching of 50μm diameter holes in a GaAs wafer at a relatively high average etching rate for etching depths of more than 150μm. Plasma etch characteristics with ICP process pressure and the percentage of BCI3 were studied in greater detail at a constant ICP coil/bias power. The measured peak-to-peak voltage as a function of pressure was used to estimate the minimum energy of the ions bombarding the substrate. The process pressure was found to have a substantial influence on the energy of heavy ions. Various ion species in plasma showed minimum energy variation from 1.85 eV to 7.5 eV in the pressure range of 20 mTorr to 50 mTorr. The effect of pressure and the percentage of BCl3 on the etching rate and surface smoothness of the bottom surface of the etched hole were studied for a fixed total flow rate. The etching rate was found to decrease with the percentage of BCl3, whereas the addition of BCl3 resulted in anisotropic holes with a smooth veil free bottom surface at a pressure of 30 mTorr and 42% BC13. In addition, variation of the etching yield with pressure and etching depth were also investigated.
文摘为解决半导体激光器的偏振问题,提出了一种利用泰尔博特位移光刻曝光技术在Ga As衬底上制作周期光栅的方法,并系统研究了工艺参数和抗反射层对制备的周期光栅质量的影响。利用二次光刻工艺和反应离子蚀刻工艺在Ga As衬底上制备圆孔阵列周期光栅;通过电感耦合等离子体蚀刻设备制造均匀光栅。实验结果表明,该工艺流程可制备深度为20~150 nm的动态可调圆孔阵列周期光栅;当曝光剂量为30 m J·cm^(-2),曝光光强度为2 m W·cm^(-2),显影时间为1 min时,所曝光出的周期光栅符合实验要求;重复实验证明了利用泰尔伯特位移光刻技术制备光栅工艺的可行性及稳定性。
文摘鉴于SiC材料具有很强的稳定性以及湿法刻蚀的种种缺点,目前主要使用干法刻蚀来刻蚀SiC材料。但是干法刻蚀后样品表面的粗糙度对器件的性能有一定的影响。针对这一问题,采用电感耦合等离子体-反应离子刻蚀技术,对SiC材料进行SF_6/O_2混合气体和SF_6/CF4/O_2混合气体的刻蚀,并且探究了压强、ICP功率和混合气体比例对样品表面粗糙度的影响。实验结果表明使用SF_6/O_2混合气体刻蚀后,样品的表面平整度较好。在一定RIE功率条件下,当ICP功率为700 W、压强为20 m T和SF_6/O_2为50/40 sccm时,样品表面的粗糙度最小。
