目的探讨智能药车(intelligent medicine cabinet,IMC)的使用是否可以促进手术室精麻药品的规范化管理。方法以复旦大学附属中山医院使用传统药箱(traditional medicine box,TMB)的手术室和使用“中山模式”IMC的手术室各12间为研究对象...目的探讨智能药车(intelligent medicine cabinet,IMC)的使用是否可以促进手术室精麻药品的规范化管理。方法以复旦大学附属中山医院使用传统药箱(traditional medicine box,TMB)的手术室和使用“中山模式”IMC的手术室各12间为研究对象,分为TMB组和IMC组。比较两组在2021年4月的22个工作日中精麻药品的差错情况和麻醉医师的工作效率及满意度。结果TMB组共发生精麻药品差错18次,IMC组因硬件故障导致了1次差错,TMB组发生差错的中位数为1(1,2)次,显著高于IMC组的0(0,0)次(W=140.5,P<0.001)。TMB组精麻药品差错总量为50支,差错率为0.52%;IMC组精麻药品差错总量为1支,精麻药品差错率为0.01%,显著低于TMB组(χ^(2)=40.378,P<0.001)。TMB组和IMC组平均每台手术的计费时长分别为(255.26±14.62)s和(76.45±3.87)s,差异有统计学意义(t=40.947,P<0.001)。TMB组和IMC组平均用户费力度为(4.17±0.17)分和(6.40±0.26)分,差异有统计学意义(t=24.48,P<0.001)。TMB组总体用户满意度指数为66.67%,净推荐值为-16.67%;IMC组这两项均为100%。结论在“中山模式”IMC辅助的精麻药品闭环管理下,药品差错次数和差错率、麻醉医师工作效率和满意度均明显优于TMB。使用IMC可以促进手术室精麻药品的管理。展开更多
A micromechanical model is presented to study the initiation and propagation of microcracks of intermetallic compounds(IMCs)in solder joints.The effects of the grain aggregate morphology,the grain boundary defects and...A micromechanical model is presented to study the initiation and propagation of microcracks of intermetallic compounds(IMCs)in solder joints.The effects of the grain aggregate morphology,the grain boundary defects and the sensitivity of the various cohesive zone parameters in predicting the overall mechanical response are investigated.The overall strength is predominantly determined by the weak grain interfaces;both the grain aggregate morphology and the weak grain interfaces control the crack configuration;the different normal and tangential strengths of grain interfaces result in different intergranular cracking behaviors and play a critical role in determining the macroscopic mechanical response of the system.展开更多
The traditional nano-sintering or TLP techniques are generally expensive,time-consuming,and hence unsuitable for realizing practical mass production.Herein,we have developed an improved TLP process to rapidly produce ...The traditional nano-sintering or TLP techniques are generally expensive,time-consuming,and hence unsuitable for realizing practical mass production.Herein,we have developed an improved TLP process to rapidly produce IMC-skeleton structures across the bonding region by initiating a localized liquid-solid interaction among micron particles at traditional soldering temperatures.The developed IMC skeletons can reinforce solder alloys and provide remarkable mechanical stability and electrical capabilities at high temperatures.As a result,the IMC-skeleton strengthened interconnections exhibited higher thermal/electrical conductivity,lower hardness and almost doubled strength than traditional full-IMC joints,attaining 87.4 MPa and 30.2 MPa at room condition and 350℃.Meanwhile,the necessary heating time to form metallurgical bonds was shortened,one-fifth of nano-sintering and one-tenth of TLP bonding,and the material cost was significantly reduced.This proposed technique enabled the fast,low-cost manufacturing of electronics that can serve at temperatures as high as 200−350℃.Besides,the interfacial reactions among particles and the correlated phase evolution process were studied in this research.The formation mechanism of IMC skeletons was analyzed.The correlated influencing factors and their effect on the mechanical,thermal and electrical properties of joints were revealed,which may help the design and extensive uses of such techniques in various high-temperature/power applications.展开更多
文摘目的探讨智能药车(intelligent medicine cabinet,IMC)的使用是否可以促进手术室精麻药品的规范化管理。方法以复旦大学附属中山医院使用传统药箱(traditional medicine box,TMB)的手术室和使用“中山模式”IMC的手术室各12间为研究对象,分为TMB组和IMC组。比较两组在2021年4月的22个工作日中精麻药品的差错情况和麻醉医师的工作效率及满意度。结果TMB组共发生精麻药品差错18次,IMC组因硬件故障导致了1次差错,TMB组发生差错的中位数为1(1,2)次,显著高于IMC组的0(0,0)次(W=140.5,P<0.001)。TMB组精麻药品差错总量为50支,差错率为0.52%;IMC组精麻药品差错总量为1支,精麻药品差错率为0.01%,显著低于TMB组(χ^(2)=40.378,P<0.001)。TMB组和IMC组平均每台手术的计费时长分别为(255.26±14.62)s和(76.45±3.87)s,差异有统计学意义(t=40.947,P<0.001)。TMB组和IMC组平均用户费力度为(4.17±0.17)分和(6.40±0.26)分,差异有统计学意义(t=24.48,P<0.001)。TMB组总体用户满意度指数为66.67%,净推荐值为-16.67%;IMC组这两项均为100%。结论在“中山模式”IMC辅助的精麻药品闭环管理下,药品差错次数和差错率、麻醉医师工作效率和满意度均明显优于TMB。使用IMC可以促进手术室精麻药品的管理。
基金supported by the NationalNatural Science Foundation of China (NSFC) under Grant 11872078,and Beijing Natural Science Foundation No.3222005.
文摘A micromechanical model is presented to study the initiation and propagation of microcracks of intermetallic compounds(IMCs)in solder joints.The effects of the grain aggregate morphology,the grain boundary defects and the sensitivity of the various cohesive zone parameters in predicting the overall mechanical response are investigated.The overall strength is predominantly determined by the weak grain interfaces;both the grain aggregate morphology and the weak grain interfaces control the crack configuration;the different normal and tangential strengths of grain interfaces result in different intergranular cracking behaviors and play a critical role in determining the macroscopic mechanical response of the system.
基金the research grant of the National Natural Science Foundation of China(Grant No.52075125,No.52105331)The research was also partially supported by Shenzhen Science and Technology Innovation Committee(Grant No.JCYJ20210324124203009,No.JSGG20201102154600003,No.GXWD20220818163456002).
文摘The traditional nano-sintering or TLP techniques are generally expensive,time-consuming,and hence unsuitable for realizing practical mass production.Herein,we have developed an improved TLP process to rapidly produce IMC-skeleton structures across the bonding region by initiating a localized liquid-solid interaction among micron particles at traditional soldering temperatures.The developed IMC skeletons can reinforce solder alloys and provide remarkable mechanical stability and electrical capabilities at high temperatures.As a result,the IMC-skeleton strengthened interconnections exhibited higher thermal/electrical conductivity,lower hardness and almost doubled strength than traditional full-IMC joints,attaining 87.4 MPa and 30.2 MPa at room condition and 350℃.Meanwhile,the necessary heating time to form metallurgical bonds was shortened,one-fifth of nano-sintering and one-tenth of TLP bonding,and the material cost was significantly reduced.This proposed technique enabled the fast,low-cost manufacturing of electronics that can serve at temperatures as high as 200−350℃.Besides,the interfacial reactions among particles and the correlated phase evolution process were studied in this research.The formation mechanism of IMC skeletons was analyzed.The correlated influencing factors and their effect on the mechanical,thermal and electrical properties of joints were revealed,which may help the design and extensive uses of such techniques in various high-temperature/power applications.
