The development of InGaAs/InP single-photon avalanche photodiodes(SPADs)necessitates the utiliza-tion of a two-element diffusion technique to achieve accurate manipulation of the multiplication width and the dis-tribu...The development of InGaAs/InP single-photon avalanche photodiodes(SPADs)necessitates the utiliza-tion of a two-element diffusion technique to achieve accurate manipulation of the multiplication width and the dis-tribution of its electric field.Regarding the issue of accurately predicting the depth of diffusion in InGaAs/InP SPAD,simulation analysis and device development were carried out,focusing on the dual diffusion behavior of zinc atoms.A formula of X_(j)=k√t-t_(0)+c to quantitatively predict the diffusion depth is obtained by fitting the simulated twice-diffusion depths based on a two-dimensional(2D)model.The 2D impurity morphologies and the one-dimensional impurity profiles for the dual-diffused region are characterized by using scanning electron micros-copy and secondary ion mass spectrometry as a function of the diffusion depth,respectively.InGaAs/InP SPAD devices with different dual-diffusion conditions are also fabricated,which show breakdown behaviors well consis-tent with the simulated results under the same junction geometries.The dark count rate(DCR)of the device de-creased as the multiplication width increased,as indicated by the results.DCRs of 2×10^(6),1×10^(5),4×10^(4),and 2×10^(4) were achieved at temperatures of 300 K,273 K,263 K,and 253 K,respectively,with a bias voltage of 3 V,when the multiplication width was 1.5µm.These results demonstrate an effective prediction route for accu-rately controlling the dual-diffused zinc junction geometry in InP-based planar device processing.展开更多
Miniaturized light sources at telecommunication wavelengths are essential components for on-chip optical communication systems.Here,we report the growth and fabrication of highly uniform p-i-n core-shell InGaAs/InP si...Miniaturized light sources at telecommunication wavelengths are essential components for on-chip optical communication systems.Here,we report the growth and fabrication of highly uniform p-i-n core-shell InGaAs/InP single quantum well(QW)nanowire array light emitting diodes(LEDs)with multi-wavelength and high-speed operations.Two-dimensional cathodoluminescence mapping reveals that axial and radial QWs in the nanowire structure contribute to strong emission at the wavelength of~1.35 and~1.55μm,respectively,ideal for low-loss optical communications.As a result of simultaneous contributions from both axial and radial QWs,broadband electroluminescence emission with a linewidth of 286 nm is achieved with a peak power of~17μW.A large spectral blueshift is observed with the increase of applied bias,which is ascribed to the band-filling effect based on device simulation,and enables voltage tunable multi-wavelength operation at the telecommunication wavelength range.Multi-wavelength operation is also achieved by fabricating nanowire array LEDs with different pitch sizes on the same substrate,leading to QW formation with different emission wavelengths.Furthermore,high-speed GHz-level modulation and small pixel size LED are demonstrated,showing the promise for ultrafast operation and ultracompact integration.The voltage and pitch size controlled multi-wavelength highspeed nanowire array LED presents a compact and efficient scheme for developing high-performance nanoscale light sources for future optical communication applications.展开更多
In P/In0.53Ga0.47As短波红外探测器是一种高性能的近室温工作器件,从200 K到室温下都能获得较好的器件性能,从而大大降低了对制冷的要求。为了充分利用目标在可见光和短波波段的光谱信息,通过特殊的材料结构设计和器件背减工艺,成功实...In P/In0.53Ga0.47As短波红外探测器是一种高性能的近室温工作器件,从200 K到室温下都能获得较好的器件性能,从而大大降低了对制冷的要求。为了充分利用目标在可见光和短波波段的光谱信息,通过特殊的材料结构设计和器件背减工艺,成功实现了320×256In P/In Ga As宽光谱红外探测器,能够同时对可见光和短波红外响应,并从77 K到263 K工作温度下实现了对人脸、计算机及室外2.3 km处的景物成像。测试样管平均峰值探测率为2×1012 cm Hz1/2/W,光谱响应为0.6~1.7μm,光谱响应测试和成像结果同时验证了In P/In Ga As宽光谱探测器对可见光信号的探测。相比标准的In P/In0.53Ga0.47As短波探测器,In P/In Ga As宽光谱探测器显示了可见/短波双波段探测的效果,大大丰富了探测目标的信息量,可显著提升对目标的识别率。展开更多
采用分层吸收渐变电荷倍增(SAGCM)结构,通过两次扩散、多层介质淀积、AuZn p 型欧姆接触、AuGeNi n 型欧姆接触等工艺,设计制造了正面入射平面 InP/InGaAs 雪崩光电二极管,器件利用 InGaAs做吸收层,InP 做增益层,光敏面直径50μm;测试...采用分层吸收渐变电荷倍增(SAGCM)结构,通过两次扩散、多层介质淀积、AuZn p 型欧姆接触、AuGeNi n 型欧姆接触等工艺,设计制造了正面入射平面 InP/InGaAs 雪崩光电二极管,器件利用 InGaAs做吸收层,InP 做增益层,光敏面直径50μm;测试结果表明器件有正常的光响应特性,击穿电压32～42 V,在低于击穿电压2 V 左右可以得到大约10 A/W 的光响应度,在0到小于击穿电压1 V 的偏压范围内,暗电流只有1 nA 左右;器件在2.7 GHz 以下有平坦的增益。展开更多
基金Supported by the National Natural Science Foundation of China(12027805,62171136,62174166,U2241219)the Science and Technology Commission of Shanghai Municipality(2019SHZDZX01,22JC1402902)the Strategic Priority Research Program of the Chinese Academy of Sciences(XDB43010200)。
基金Supported by Shanghai Natural Science Foundation(22ZR1472600).
文摘The development of InGaAs/InP single-photon avalanche photodiodes(SPADs)necessitates the utiliza-tion of a two-element diffusion technique to achieve accurate manipulation of the multiplication width and the dis-tribution of its electric field.Regarding the issue of accurately predicting the depth of diffusion in InGaAs/InP SPAD,simulation analysis and device development were carried out,focusing on the dual diffusion behavior of zinc atoms.A formula of X_(j)=k√t-t_(0)+c to quantitatively predict the diffusion depth is obtained by fitting the simulated twice-diffusion depths based on a two-dimensional(2D)model.The 2D impurity morphologies and the one-dimensional impurity profiles for the dual-diffused region are characterized by using scanning electron micros-copy and secondary ion mass spectrometry as a function of the diffusion depth,respectively.InGaAs/InP SPAD devices with different dual-diffusion conditions are also fabricated,which show breakdown behaviors well consis-tent with the simulated results under the same junction geometries.The dark count rate(DCR)of the device de-creased as the multiplication width increased,as indicated by the results.DCRs of 2×10^(6),1×10^(5),4×10^(4),and 2×10^(4) were achieved at temperatures of 300 K,273 K,263 K,and 253 K,respectively,with a bias voltage of 3 V,when the multiplication width was 1.5µm.These results demonstrate an effective prediction route for accu-rately controlling the dual-diffused zinc junction geometry in InP-based planar device processing.
文摘Miniaturized light sources at telecommunication wavelengths are essential components for on-chip optical communication systems.Here,we report the growth and fabrication of highly uniform p-i-n core-shell InGaAs/InP single quantum well(QW)nanowire array light emitting diodes(LEDs)with multi-wavelength and high-speed operations.Two-dimensional cathodoluminescence mapping reveals that axial and radial QWs in the nanowire structure contribute to strong emission at the wavelength of~1.35 and~1.55μm,respectively,ideal for low-loss optical communications.As a result of simultaneous contributions from both axial and radial QWs,broadband electroluminescence emission with a linewidth of 286 nm is achieved with a peak power of~17μW.A large spectral blueshift is observed with the increase of applied bias,which is ascribed to the band-filling effect based on device simulation,and enables voltage tunable multi-wavelength operation at the telecommunication wavelength range.Multi-wavelength operation is also achieved by fabricating nanowire array LEDs with different pitch sizes on the same substrate,leading to QW formation with different emission wavelengths.Furthermore,high-speed GHz-level modulation and small pixel size LED are demonstrated,showing the promise for ultrafast operation and ultracompact integration.The voltage and pitch size controlled multi-wavelength highspeed nanowire array LED presents a compact and efficient scheme for developing high-performance nanoscale light sources for future optical communication applications.
文摘In P/In0.53Ga0.47As短波红外探测器是一种高性能的近室温工作器件,从200 K到室温下都能获得较好的器件性能,从而大大降低了对制冷的要求。为了充分利用目标在可见光和短波波段的光谱信息,通过特殊的材料结构设计和器件背减工艺,成功实现了320×256In P/In Ga As宽光谱红外探测器,能够同时对可见光和短波红外响应,并从77 K到263 K工作温度下实现了对人脸、计算机及室外2.3 km处的景物成像。测试样管平均峰值探测率为2×1012 cm Hz1/2/W,光谱响应为0.6~1.7μm,光谱响应测试和成像结果同时验证了In P/In Ga As宽光谱探测器对可见光信号的探测。相比标准的In P/In0.53Ga0.47As短波探测器,In P/In Ga As宽光谱探测器显示了可见/短波双波段探测的效果,大大丰富了探测目标的信息量,可显著提升对目标的识别率。
文摘采用分层吸收渐变电荷倍增(SAGCM)结构,通过两次扩散、多层介质淀积、AuZn p 型欧姆接触、AuGeNi n 型欧姆接触等工艺,设计制造了正面入射平面 InP/InGaAs 雪崩光电二极管,器件利用 InGaAs做吸收层,InP 做增益层,光敏面直径50μm;测试结果表明器件有正常的光响应特性,击穿电压32～42 V,在低于击穿电压2 V 左右可以得到大约10 A/W 的光响应度,在0到小于击穿电压1 V 的偏压范围内,暗电流只有1 nA 左右;器件在2.7 GHz 以下有平坦的增益。
