Novel lateral insulated gate bipolar transistor on SOI substrate for optimizing hot-carrier degradation

A novel lateral insulated gate bipolar transistor on a silicon-on-insulator substrate SOI-LIGBT with a special low-doped P-well structure is proposed.The P-well structure is added to attach the P-body under the channel so as to reduce the linear anode current degradation without additional process.The influence of the length and depth of the P-well on the hot-carrier HC reliability of the SOI-LIGBT is studied.With the increase in the length of the P-well the perpendicular electric field peak and the impact ionization peak diminish resulting in the reduction of the hot-carrier degradation. In addition the impact ionization will be weakened with the increase in the depth of the P-well which also makes the hot-carrier degradation decrease.Considering the effect of the low-doped P-well and the process windows the length and depth of the P-well are both chosen as 2 μm.

Development of 8-inch Key Processes for Insulated-Gate Bipolar Transistor

Based on the construction of the 8-inch fabricat ion line, advanced process technology of 8-inch wafer, as well as the fourth-generation high-voltage double-diffused metal-oxide semiconductor(DMOS+) insulated-gate bipolar transistor(IGBT) technology and the fifth-generation trench gate IGBT technology, have been developed, realizing a great-leap forward technological development for the manufacturing of high-voltage IGBT from 6-inch to 8-inch. The 1600 A/1.7 kV and 1500 A/3.3 kV IGBT modules have been successfully fabricated, qualified, and applied in rail transportation traction system.

A dual-gate and dielectric-inserted lateral trench insulated gate bipolar transistor on a silicon-on-insulator substrate

In this paper, a novel dual-gate and dielectric-inserted lateral trench insulated gate bipolar transistor （DGDI LTIGBT） structure, which features a double extended trench gate and a dielectric inserted in the drift region, is proposed and discussed. The device can not only decrease the specific on-resistance Ron,sp , but also simultaneously improve the temperature performance. Simulation results show that the proposed LTIGBT achieves an ultra-low on-state voltage drop of 1.31 V at 700 A·cm-2 with a small half-cell pitch of 10.5 μm, a specific on-resistance R on,sp of 187 mΩ·mm2, and a high breakdown voltage of 250 V. The on-state voltage drop of the DGDI LTIGBT is 18% less than that of the DI LTIGBT and 30.3% less than that of the conventional LTIGBT. The proposed LTIGBT exhibits a good positive temperature coefficient for safety paralleling to handling larger currents and enhances the short-circuit capability while maintaining a low self-heating effect. Furthermore, it also shows a better tradeoff between the specific on-resistance and the turnoff loss, although it has a longer turnoff delay time.

A high voltage silicon-on-insulator lateral insulated gate bipolar transistor with a reduced cell-pitch

A high voltage（〉 600 V） integrable silicon-on-insulator（SOI） trench-type lateral insulated gate bipolar transistor（LIGBT） with a reduced cell-pitch is proposed.The LIGBT features multiple trenches（MTs）：two oxide trenches in the drift region and a trench gate extended to the buried oxide（BOX）.Firstly,the oxide trenches enhance electric field strength because of the lower permittivity of oxide than that of Si.Secondly,oxide trenches bring in multi-directional depletion,leading to a reshaped electric field distribution and an enhanced reduced-surface electric-field（RESURF） effect.Both increase the breakdown voltage（BV）.Thirdly,oxide trenches fold the drift region around the oxide trenches,leading to a reduced cell-pitch.Finally,the oxide trenches enhance the conductivity modulation,resulting in a high electron/hole concentration in the drift region as well as a low forward voltage drop（Von）.The oxide trenches cause a low anode-cathode capacitance,which increases the switching speed and reduces the turn-off energy loss（Eoff）.The MT SOI LIGBT exhibits a BV of 603 V at a small cell-pitch of 24 μm,a Von of 1.03 V at 100 A/cm-2,a turn-off time of 250 ns and Eoff of 4.1×10？3 mJ.The trench gate extended to BOX synchronously acts as dielectric isolation between high voltage LIGBT and low voltage circuits,simplifying the fabrication processes.

SiC gate-controlled bipolar field effect composite transistor with polysilicon region for improving on-state current

A novel silicon carbide gate-controlled bipolar field effect composite transistor with poly silicon region(SiC GCBTP)is proposed.Different from the traditional electrode connection mode of SiC vertical diffused MOS(VDMOS),the P+region of P-well is connected with the gate in SiC GCBTP,and the polysilicon region is added between the P+region and the gate.By this method,additional minority carriers can be injected into the drift region at on-state,and the distribution of minority carriers in the drift region will be optimized,so the on-state current is increased.In terms of static characteristics,it has the same high breakdown voltage(811 V)as SiC VDMOS whose length of drift is 5.5μm.The on-state current of SiC GCBTP is 2.47×10^(-3)A/μm(V_(G)=10 V,V_(D)=10 V)which is 5.7 times of that of SiC IGBT and 36.4 times of that of SiC VDMOS.In terms of dynamic characteristics,the turn-on time of SiC GCBTP is only 0.425 ns.And the turn-off time of SiC GCBTP is similar to that of SIC insulated gate bipolar transistor(IGBT),which is 114.72 ns.

基于注意力机制的CNN-BiLSTM的IGBT剩余使用寿命预测

针对绝缘栅双极型晶体管(IGBT)可靠性问题,提出了一种融合卷积神经网络(CNN)、双向长短期记忆(BiLSTM)网络和注意力机制的剩余使用寿命(RUL)预测模型,可用于IGBT的寿命预测。模型中使用CNN提取特征参数,BiLSTM提取时序信息,注意力机制加权处理特征参数。使用IGBT加速老化数据集对提出的模型进行验证。结果表明,对比自回归差分移动平均(ARIMA)、长短期记忆(LSTM)、多层LSTM(Multi-LSTM)、 BiLSTM预测模型,在均方根误差和决定系数等评价指标方面该模型的性能最优。验证了提出的寿命预测模型对IGBT失效预测是有效的。

基于Bo-BiLSTM网络的IGBT老化失效预测方法

针对绝缘栅双极型晶体管(IGBT)受热应力冲击后对其进行老化失效预测精度不高的情况,提出一种基于贝叶斯优化(Bo)-双向长短期记忆(BiLSTM)网络的IGBT老化失效预测方法。首先分析IGBT模块老化失效原理,然后基于NASA老化实验数据集建立失效特征数据库,最后利用Matlab软件构造Bo-BiLSTM网络预测失效特征参数数据。选取常用回归预测性能评估指标将长短期记忆(LSTM)网络模型、BiLSTM网络模型与Bo-BiLSTM网络模型的预测结果进行对比分析。结果表明,Bo-BiLSTM网络的模型拟合精度更高,基于Bo-BiLSTM网络的IGBT老化失效预测方法具有较好的预测效果,能够应用于IGBT的失效预测。

Insulated gate bipolar transistor inverter for arc welding

This paper introduces the Insulated gate bipolar transistor(IGBT)in- verter for arc welding.The principle of the inverter,the structure and charac- teristics of IGBT and the current feedback system using LEM current transduc- er are discussed.By the measurement of its efficiency and power factor and the tests of welding processes,the developed 150A IGBT inverter proves to be a kind of energy-saving portable power supply for arc welding with broad prospects.

基于VMD-LSTM-SVR的IGBT寿命特征时间序列预测

绝缘栅双极型晶体管(IGBT)失效是变频器等电力电子设备故障的主要原因,精确预测其寿命是解决该问题的方法之一,这对寿命预测模型的准确性和可靠性提出了更高要求。关断瞬态尖峰电压(Vce,peak)可以反映IGBT的老化状态,首先通过变分模态分解(VMD)技术将Vce,peak构成的时间序列分解为趋势序列和波动序列,再利用长短期记忆(LSTM)网络的时间序列特征提取优势和支持向量机回归(SVR)的非线性求解能力,建立VMD-LSTM-SVR组合模型,提升模型的预测性能。模型预测对比实验结果表明,VMD-LSTM-SVR模型提升了IGBT寿命特征时间序列预测能力,与其他模型相比,该模型的预测精度指标均方根误差下降至0.0411 V,决定系数提升至0.75111。

基于EMD-BPNN的逆变器IGBT开路故障诊断方法

绝缘栅双极性晶体管(Insulated gate bipolar transistor,IGBT)作为逆变器的主要组成部分,其工作的稳定性与可靠性对逆变器的正常工作有着重要的影响。针对三相电机牵引逆变器IGBT常见的单管和双管开路故障,提出一种基于经验模态分解(Empirical mode decomposition,EMD)和误差反向传播神经网络(Back propagation neural network,BPNN)相结合的故障诊断方法。首先分析逆变器IGBT单管和双管开路故障的波形特征,采用EMD方法对逆变器输出的三相电流进行分解;在此基础上构造故障特征向量,采用BPNN对特征向量进行训练并实现故障诊断;其次针对EMD方法存在的“模态混叠”问题,采用互补集合经验模态分解(Complementary ensemble empirical mode decomposition,CEEMD)对诊断方法进行了优化;最后在小型试验平台上进行了试验,试验结果表明,基于CEEMD-BPNN的故障诊断方法能够有效诊断出故障功率管。

VSC-HVDC系统中IGBT阀保护方案研究

针对电压源换流器的高压直流输电(VSC-HVDC)系统,首先分析正常运行情况下电压源换流器两侧交、直流电流之间满足的平衡关系。然后将换流器的5种开关模式按照桥臂导通状态分为两类工作状态,分析不同工作状态下全控型电力电子器件绝缘栅双极晶体管(IGBT)阀短路和阀开路的电流流通路径,研究故障后交流侧电流幅值和直流侧电流的变化及其相互关系。在此基础上,提出一种能够反应IGBT阀短路和阀开路的保护方案,将交流侧三相电流采样值分别与各自导通状态函数相乘并求和,并与直流侧电流采样值构成差动电流,利用该差动电流反应阀短路和阀开路故障,并给出保护的整定原则。最后,基于仿真平台搭建双端VSC-HVDC系统模型,验证了该保护方案的有效性。

基于失效演化模拟的电力机车用IGBT模块解析剩余寿命建模研究

牵引变流器作为电力机车系统中最关键且故障率最高的设备,影响系统的安全运行,其中绝缘栅双极晶体管(insulated gate bipolar transistor,IGBT)模块是导致牵引变流器失效的主要部件。开展IGBT模块剩余寿命准确评估,对降低运维成本和系统故障率具有重要的战略价值和经济意义。目前采用“里程修”的运维方式,未考虑机车运行线路、工况、负载差异等因素对寿命的影响,导致一些线路过早更换的高昂运维成本和一些线路过晚替换的系统停运风险。因此,在牵引系统IGBT模块故障率高、运行线路间可靠性差异大且采用不合理的“里程修”方式背景下,目前业界普遍关心的问题是各线路基于固定里程修更换的IGBT模块剩余寿命是多少。该文针对电力机车用IGBT模块剩余寿命准确评估的问题,以IGBT模块焊料层不同服役里程空洞尺寸分布规律为基础,建立考虑焊料层空洞空间分布规律的精细化多物理场模型,开展多芯片并联IGBT模块失效演化物理过程模拟,提出以焊料层空洞分布统计规律为老化状态的电力机车用IGBT模块解析剩余寿命预测模拟,并通过功率循环试验验证改进模型准确性。研究成果丰富功率器件的寿命预测和可靠性评估理论,为系统从“里程修”向“状态修”转变提供科学依据。

基于焊层裂纹扩展的IGBT性能退化建模与分析

在疲劳载荷作用下,绝缘栅双极型晶体管(insulated gate bipolar transistor,IGBT)会发生结构损伤与性能退化,影响电力电子系统可靠性。对此,首先基于传热学理论推导焊层疲劳裂纹长度与热阻的关系,并以Darveaux模型表征IGBT焊层裂纹演化规律,提出一种IGBT性能退化模型及其待定系数的估计方法。其次,考虑实际工况的非平稳特征,利用响应面法建立IGBT变幅疲劳载荷模型,并基于雨流计数法与线性累积损伤准则实现IGBT性能退化量的评估。最后,以一款IGBT产品为例,实施功率循环试验,基于试验数据开展性能退化建模与分析,验证了模型与算法的有效性。

基于时域特征与LSTM-Attention的IGBT退化预测方法

绝缘栅双极晶体管(IGBT)在可靠性分析任务中时间信息难以充分利用,导致预测精度不高。文中提出一种基于多维时域特征和注意力机制的深度学习方法,该方法结合主成分分析(PCA)技术、长短时记忆网络(LSTM)和注意力(Attention)机制。首先,采用时域分析来手动提取原始数据中的多维时间特征,并利用PCA技术对其进行特征融合处理;然后,利用LSTM网络从样本数据中自动学习序列特征,引入的Attention机制能够对更重要的特征和时间步长赋予更大的权值。最后,使用NASA Ames实验室加速老化数据库进行实验,结果表明所提方法优于最新方法。手动提取的时间特征在经过特征融合后,可以作为序列数据预测任务中的有效退化特征,并结合Attention机制大大提高预测精度。

IGBT并联应用均流控制技术综述

绝缘栅双极型晶体管IGBT(insulated-gate bipolar transistor)在现代电力电子技术中应用广泛,在某些单个器件性能达不到设计要求的工作场合,IGBT的并联使用成为一种经济可行的方法。多模块IGBT并联应用可以简化电路结构,增大变流器输出功率,提高装置功率密度。IGBT并联应用过程中,器件本体的动、静态特性及结温的差异,驱动电路结构及功率回路不对称性,伴随IGBT长期使用出现的老化或失效等问题,都会引起并联IGBT支路电流的不均衡,影响系统的可靠性和稳定性。对国内外IGBT并联应用所关注的研究热点进行了调研分析,总结了IGBT并联动、静态电流不均衡产生的原理及影响,分析了电流均衡控制原理的差异。从功率回路均流控制和驱动回路均流控制两个方面,对IGBT并联应用均流控制的工作特性进行了分析总结和技术对比,并对IGBT并联均流技术的发展方向进行了展望。

基于SSA-LSTM模型的IGBT时间序列预测研究

针对绝缘栅双极型晶体管(IGBT)长工作周期导致的老化失效问题,提出一种基于麻雀搜索算法(SSA)优化长短期记忆(LSTM)网络的IGBT时间序列预测方法。首先分析IGBT疲劳失效的原因,选取某IGBT老化数据集中的集射极峰值电压为失效特征量,进行二次指数滤波以增大数据下降趋势。然后利用Matlab搭建LSTM模型,并采用SSA对网络模型中学习率、隐藏层节点数和训练次数进行寻优以得到最优网络。最后选取常用回归预测性能评估指标对LSTM模型与SSA-LSTM模型预测结果进行对比分析。结果表明,SSA-LSTM模型的预测结果平均绝对误差、均方根误差及平均绝对百分比误差分别降低了0.016%、0.022%和0.202%,证明所提方法预测精度高,可在一定程度上评估IGBT的寿命。

基于导通压降的大容量IGBT模块结温观测与误差分析研究

压接式绝缘栅双极性晶体管PP-IGBT(press-pack insulated gate bipolar transistor)模块因其优越的电气性能和可靠性,广泛应用于柔性直流换流阀等大功率应用场景。IGBT芯片结温的准确观测对于其运行状态的监测与剩余寿命的评估都非常重要。已有结温观测方法多是针对键合引线式IGBT,未考虑到压接式模块的特性,无法直接应用。首先,针对大容量换流阀中的压接式IGBT,提出了一种实用的模块导通压降与结温标定方法,并对结温在线估计的误差进行了全面分析。然后,基于ABB公司5SNA 3000K452300压接式IGBT模块(4500 V,3000 A)设计了结温标定方案,包括实验电路、温度标定范围选择、结温控制方式、测量电路及标定实验步骤。最后,基于脉冲测试平台,对所提方法进行了验证。实验结果表明,所提结温标定与观测方案有效,结温观测误差在±5℃以内,且能适用压接式IGBT模块存在差异的情况。

A 4H-SiC trench IGBT with controllable hole-extracting path for low loss

A novel 4H-Si C trench insulated gate bipolar transistor(IGBT)with a controllable hole-extracting(CHE)path is proposed and investigated in this paper.The CHE path is controlled by metal semiconductor gate(MES gate)and metal oxide semiconductor gate(MOS gate)in the p-shield region.The grounded p-shield region can significantly suppress the high electric field around gate oxide in Si C devices,but it weakens the conductivity modulation in the Si C trench IGBT by rapidly sweeping out holes.This effect can be eliminated by introducing the CHE path.The CHE path is pinched off by the high gate bias voltage at on-state to maintain high conductivity modulation and obtain a comparatively low on-state voltage(VON).During the turn-off transient,the CHE path is formed,which contributes to a decreased turn-off loss(EOFF).Based on numerical simulation,the EOFFof the proposed IGBT is reduced by 89%compared with the conventional IGBT at the same VONand the VONof the proposed IGBT is reduced by 50%compared to the grounded p-shield IGBT at the same EOFF.In addition,the average power reduction for the proposed device can be 51.0%to 81.7%and 58.2%to 72.1%with its counterparts at a wide frequency range of 500 Hz to 10 k Hz,revealing a great improvement of frequency characteristics.

回跳现象对RC-IGBT器件功率循环测试的影响

逆导型绝缘栅双极型晶体管(reverse conducting insulated gate bipolar transistor,RC-IGBT)是一种新型IGBT器件,其在IGBT芯片结构中集成了一个快恢复二极管,具有成本低、封装工艺简单、功率密度高、抗浪涌电流能力高等特点,因而备受工业界关注,对其可靠性的要求也越来越高。但是,由于RC-IGBT器件特殊的芯片结构,使得其输出特性曲线上具有回跳现象。而回跳现象是否会对RC-IGBT可靠性的考察产生影响还有待研究。因此文中首先深入分析回跳现象产生的机理,并结合考察器件可靠性最重要的实验——功率循环实验的原理阐述,分析得到回跳现象可能会对功率循环中结温测量、并联分流和功率循环寿命及失效形式3个方面产生影响,并通过设计实验进行论证。实验结果表明,回跳现象会对VCE(T)法进行结温测量产生影响,而对VF(T)法进行结温测量没有影响;通过并联分流实验发现,具有较小回跳电压的器件会在电流流过器件瞬间分得更多的电流,但是其影响时间较短;通过不同导通模式下的功率循环实验对比分析可知,回跳现象对分立器件的功率循环寿命及失效方式没有影响。

计及电热参数更新的高速列车牵引整流器IGBT模块寿命评估

绝缘栅双极晶体管(IGBT)作为列车变流器的关键部件,其寿命受老化过程中参数变化的影响,为此提出了一种计及电热参数更新的IGBT模块寿命预测方法。首先,利用实车采集到的外部电压、电流数据结合变流器调制策略推导IGBT的驱动信号,进而获得单个IGBT的电压电流;其次,基于数据手册建立Foster热网络模型获取IGBT的结温;之后考虑到实际中IGBT的老化过程,提出一种IGBT结温计算过程中热阻和导通压降的更新策略;最后通过寿命模型对IGBT进行损伤度估算,并通过蒙特卡洛(Monte-Carlo)模拟评估器件寿命计算过程中的不确定性,取得可靠性变化曲线。