Creating Distinctive Connections between Multifunctional Microwave Circuits and Mobile-Terminal Radio-Frequency Integrated Chips Using Integrated Passive Device Technology

In this review,the advanced microwave devices based on the integrated passive device(IPD)technology are expounded and discussed in detail,involving the performance breakthroughs and circuit innovations.Then,the development trend of IPD-based multifunctional microwave circuits is predicted further by analyzing the current research hot spots.This paper discusses a distinctive research area for microwave circuits and mobile-terminal radio-frequency integrated chips.

Integrated power electronics module based on chip scale packaged power devices

High performance can be obtained for the integrated power electronics module（IPEM） by using a three-dimensional packaging structure instead of a planar structure. A three- dimensional packaged half bridge-IPEM （HB-IPEM）, consisting of two chip scale packaged MOSFETs and the corresponding gate driver and protection circuits, is fabricated at the laboratory. The reliability of the IPEM is controlled from the shape design of solder joints and the control of assembly process parameters. The parasitic parameters are extracted using Agilent 4395A impedance analyzer for building the parasitic parameter model of the HB- IPEM. A 12 V/3 A output synchronous rectifier Buck converter using the HB-IPEM is built to test the electrical performance of the HB-IPEM. Low voltage spikes on two MOSFETs illustrate that the three-dimensional package of the HB-IPEM can decrease parasitic inductance. Temperature distribution simulation results of the HB-IPEM using FLOTHERM are given. Heat dissipation of the solder joints makes the peak junction temperature of the chip drop obviously. The package realizes three-dimensional heat dissipation and has better thermal management.

Structured Illumination Chip Based on Integrated Optics

A compact structured illumination chip based on integrated optics is proposed and fabricated on a silicon-on- insulator platform. Based on the simulation of Caussian beam interference, we adopt a chirped diffraction grating to achieve a specific interference pattern. The experimental results match well with the simulations. The portability and flexibility of the structured illumination chip can be increased greatly through horizontal encapsulation. High levels of integration, compared with the conventional structured illumination approach, make this chip very compact, with a footprint of only around 1 mm2. The chip has no optical lenses and can be easily combined with a microfluidic system. These properties would make the chip very suitable for portable 3D scanner and compact super-resolution microscopy applications.

A New Method for Optimizing Layout Parameter ofan Integrated On-Chip Inductor in CMOSRF IC's

Analyzing the influence on Q factor, which was caused by the parasitic effect in a CMOS RF on chip integrated inductor, a concise method to increase the Q factor has been obtained when optimizing the layout parameter. Using this method, the Q factor of 7.9 can be achieved in a 5nH inductor (operating frequency is 2GHz) while the errors in inductance are less than 0.5% compared with the aimed values. It is proved by experiments that this method can guarantee the sufficient accuracy but require less computation time. Therefore, it is of great use for the design of the inductor in CMOS RF IC’s.

Integrated Carbon Nanotubes Electrodes in Microfluidic Chip via MWPCVD

An on-chip electrochemical detector for microfluidic chips was described, based on integrated carbon nanotube （CNT） electrodes directly onto the chip substrate through microwave plasma chemical vapor deposition （MWPCVD）. The attractive performance of the integrated CNT electrodes was demonstrated for the amperometric detection of sucrose, glucose and D-fructose. The integrated CNT electrodes showed stronger electrocatalytic activity than gold electrodes.

Flip Chip技术在集成电路封装中的应用

阐述从集成电路封装发展现状、Flip Chip技术内涵、Flip Chip技术在集成电路封装中的应用剖析、市场发展展望等多个角度,探讨在集成电路封装中,应用Flip Chip技术的必要性和重要性。

Integration and verification case of IP-core based system on chip design

In this paper, the design and verification process of an automobile-engine-fan control system on chip （SoC） are introduced. The SoC system, SHU-MV08, reuses four new intellectual property （IP） cores and the design flow is accomplished with 0.35 btm chartered CMOS technology. Some special functions of IP cores, the detailed integration scheme of four IP cores, and the verification method of the entire SoC are presented. To settle the verification problems brought by analog IP cores, NanoSim based chip-level mixed-signal verification method is introduced. The verification time is greatly reduced and the first tape-out achieves success which proves the validity of our design.

Integrated Control System of Vehicle ABS/ASR/ACC Based onMC9S12DP256

The integrated control system of vehicle ABS/ASR/ACC has been developed using the MC9S12DP256 single chip, which is the new Motorola 16-bit product in HSC12 family. The system including the main control module, the data collection module and the drive and fault diagnosis module is demonstrated and its data collection function is presented in detail. The system designed by the modularization can supervise the data, drive the valves and pump. The program can be debugged on line, which is steady and reliable validated by the large numbers of vehicle road tests.

Optical transmitter module with hybrid integration of DFB laser diode and proton-exchanged LiNbO_(3)modulator chip

In this work,a hybrid integrated optical transmitter module was designed and fabricated.A proton-exchanged Mach–Zehnder lithium niobate(LiNbO_(3))modulator chip was chosen to enhance the output extinction ratio.A fiber was used to adjust the rotation of the polarization direction caused by the optical isolator.The whole optical path structure,including the laser chip,lens,fiber,and modulator chip,was simulated to achieve high optical output efficiency.After a series of process improvements,a module with an output extinction ratio of 34 dB and a bandwidth of 20.5 GHz(from 2 GHz)was obtained.The optical output efficiency of the whole module reached approximately 21%.The link performance of the module was also measured.

Flip Chip结构的IC信号完整性仿真分析

针对Flip Chip封装型芯片设计过程中存在的传输线阻抗不连续与串扰过大等问题,从层叠设置与板材介质厚度两个角度提出了一种基于阻抗、串扰的仿真分析设计方法,主要涉及两个方面:对于由信号参考平面被分割而造成的阻抗突变问题,通过添加参考平面而使信号具有完整的回流路径,使得传输线的阻抗在平面分割处由167.5Ω降至52.5Ω;对于因布线密度过大而造成的走线之间的串扰系数偏高的问题,通过减小板材的介质厚度使传输线间串扰系数的最大值从17.26%降至14.01%。仿真结果表明,此设计方法有效降低了芯片设计中潜在的信号完整性风险,提高了芯片的可靠性和稳定性。

基于AT89S52单片机的稻作区智能灌溉控制系统设计

【目的】克服稻作区田间难以铺设电路等难题,实现田间灌溉无人化,提高安徽省稻作区灌溉智能化和精准化水平,探索利用新一代电子信息技术实现智能灌溉的可行性。【方法】本文设计了一种基于AT89S52单片机的稻作区智能灌溉控制系统,包括一体化提拉式水闸、灌溉硬件子系统和灌溉软件子系统。闸门采用一体化设计,集成了以AT89S52单片机为控制器的中央处理单元模块、传感器感知模块和太阳能供电模块;以Keil C语言开发了闸门终端控制软件,以C++语言开发了系统上位机控制软件。【结果】应用试验表明,本系统运行安全稳定,电机自动控制响应时间<1 s,闸门开度控制误差<1.5 mm,闸前、后水位控制误差<8 mm,数据传输丢包率最大为0.11%,自由出流状态下闸门流量计算误差<1%,淹没出流状态下闸门流量计算误差<1.2%。【结论】本系统运行安全稳定,在室外环境条件下响应速度快,可满足稻作区田间灌溉复杂环境下用水智能化和精准化的要求。

光储备池通感一体通信噪声抑制方案(封面文章·特邀)

通感一体技术可利用已大范围铺设的光纤网实现智能传感,具备智能识别、信息融合优势。在同波长通感共传信道中,通感信号串扰及光纤传输噪声严重影响通信信号质量,需提升发射功率来保证低误码率,但增大了非线性噪声和功耗。提出了基于光储备池计算神经网络的通感共传信道通信失真均衡方法,搭建了信道均衡仿真系统,实现了低发射功率下前向通信信号噪声均衡。周期线性调频光和56 Gb/s四电平脉冲幅度调制信号分别用于分布式瑞利散射传感和数据通信。仿真结果表明,在5~14 dBm入纤功率时,与未均衡信号相比该方法可提供高于3个数量级以上的误码率优化。此方法在短距离模块间15~24 km光纤传输和0.5~2.0 GHz带宽线性调频感测脉冲下均实现了2个数量级以上的误码率下降。依托光储备池计算芯片的低能耗和低延时优势,该方法可为进一步提升通感一体系统中噪声抑制能力提供理论支撑。

光子神经网络研究进展

在数据海量化、信息化的时代,电子计算机处理系统所面临的算力和能耗等性能要求愈发严苛,传统冯·诺依曼架构存在“内存墙”和“功耗墙”瓶颈,加之摩尔定律放缓甚至失效,使得电子芯片在计算速度和功耗方面遇到极大挑战,利用光计算替代传统电子计算将是解决当前算力与功耗问题的极具潜力的途径之一。本文系统地梳理了片上集成和自由空间的光子神经网络架构与算法方面的研究进展,详细介绍了典型的研究工作,然后讨论并对比了这两种光子神经网络的优劣势,以及光子神经网络的训练策略等。最后探讨了光子神经网络面临的挑战,并对其未来发展进行了前瞻性的展望。

基于1+X证书制度的单片机类课程改革探索

1+X证书制度作为我国职业教育改革发展的一项重大举措,是构建中国特色职业教育发展模式的制度创新,强化了职业教育类型特征,推进了职业教育产教融合,深化了职业教育教学改革。在1+X证书制度试点工作已经全面推进的背景下介绍了智能硬件应用开发1+X职业等级证书要求以及当前单片机类课程设计和实施的现状,并且根据1+X证书的不同层次要求对单片机类课程改革阐述了具体方法和实现路径,探究课证融通的策略与路径,通过整合多方资源,构建融合框架,以期为社会输出适应产业转型升级发展需要的复合技能型人才。

超声振动辅助车削SiCp/Al切屑形成机理及表面粗糙度研究

目的研究切屑形成机理对加工过程的影响。方法超声振动辅助车削技术通过刀具振动的拟间歇切削特征控制切屑尺寸和切屑形态,从而提高了加工表面质量。针对SiCp/Al复合材料的切屑形成机理,探究常规车削和超声振动辅助车削的切屑形成过程。研究了颗粒分布对第一变形区变形阶段的影响,以及不同加工方式下切削参数对切屑形态的影响。最后,描述了切屑自由表面和刀-屑接触界面的颗粒损伤形式,以直观地描述常规车削与超声振动辅助车削SiCp/Al复合材料加工中切屑的形成过程。结果通过测试加工后工件表面形貌发现超声振动辅助车削的切屑更加连续、切屑尺寸较小的加工表面粗糙度更小,常规车削的表面粗糙度为0.805μm,超声振动辅助车削的表面粗糙度为0.404μm,超声振动辅助车削比常规车削的表面粗糙度降低了49.8%。结论与常规车削相比,超声振动辅助车削有利于减小切屑厚度。超声振动辅助车削得到的切屑更加连续,避免了切屑碎裂,促进了切屑的顺利排出。通过对切屑形态进行研究,选择最优切削参数可以有效提高工件表面质量。

GaN收发多功能芯片在片集成测试优化

为了解决传统开关集成测试方案中严苛的时序同步要求,根据GaN收发多功能芯片的在片电参数测试需求,采用环行器优化测试方案,减少芯片测试时序变量,提高了芯片测试程序的鲁棒性,并且利用去嵌入技术对系统的校准进行简化。通过典型器件的测试对方案进行了验证,结果表明,环行器优化测试方案与传统的开关集成测试方案输出结果基本一致,优化测试方案是有效的。

基于薄膜铌酸锂的微波光子雷达芯片

微波光子雷达拥有分辨率高、处理速度快、同时多波段、多功能等优势,在航天系统中具有广阔的应用前景。为了满足航天应用对雷达系统体积、质量和功耗的严格要求,集成化已经成为微波光子雷达的重要发展方向。介绍了一款基于薄膜铌酸锂的微波光子雷达芯片,利用该芯片实现了雷达发射信号倍频产生和回波信号去斜接收,并对距离天线不同位置的目标进行了测距实验,得到的测量距离与实际距离基本相同,两者之间的误差小于4 mm。

微型组合导航SIP芯片的PDN电热协同仿真与优化

随着SIP芯片逐步小型化和集成化,导致芯片对PDN的直流压降、电流密度以及系统的温升控制要求越来越高.本文通过改变载流导体的面积来改善直流压降和电流密度过高的问题,同时针对芯片温升研究通过合理优化热过孔阵列的孔径、过孔数量以及镀铜厚度来减小热阻以达到控制芯片温升的目的.仿真结果表明,增加载流导体的面积能有效降低直流压降和电流密度,且还留有很大的裕量;而热过孔阵列的合理布局能有效控制芯片温升,从而提升了芯片的功能和可靠性.

基于金属-绝缘体相变材料的高钝感集成半导体桥芯片设计

为了提高半导体桥(SCB)火工品的安全性与可靠性,通过片上集成方式,在SCB两端并联金属-绝缘体相变材料VO_(2)对其进行分流防护。提出蛇形设计方法来降低VO_(2)薄膜在金属态的电阻值,使其与SCB阻值相匹配,测试了不同长宽比的VO_(2)薄膜及相应的集成芯片在室温(25℃)至100℃范围内的电阻曲线,并对集成芯片及单独SCB在1A1W5min和1.5A2.25W5min安流试验中的传热过程进行了仿真。结果表明:蛇形设计可以有效降低VO_(2)薄膜电阻,其阻值与蛇形长宽比(Ws/L)成反比;VO_(2)薄膜能够对SCB起到一定的分流防护作用;集成芯片尺寸对安流试验热传导过程的平衡温度有一定影响;能够通过1.5 A安流试验的最大VO_(2)阻值为5Ω,这是下一步的设计目标。