The rapid development of micro-electronics raises the demand of their power sources to be simplified,miniaturized and highly integratable with other electronics on a chip.In-plane Micro-sized energy storage devices(ME...The rapid development of micro-electronics raises the demand of their power sources to be simplified,miniaturized and highly integratable with other electronics on a chip.In-plane Micro-sized energy storage devices(MESDs),which are composed of interdigitated electrodes on a single chip,have aroused particular attentions since they could be easily integrated with other miniaturized electronics,reducing the complexity of overall chip design via removing complex interconnections with bulky power sources.This review highlights the achievements in the device fabrication of in-plane MESDs,as well as their integration and intelligent designs.We also discussed the current challenges and future perspectives for the development of in-plane MESDs.展开更多
For the non-stop demands for a better and smarter society, the number of electronic devices keeps increasing exponentially;and the computation power, communication data rate, smart sensing capability and intelligence ...For the non-stop demands for a better and smarter society, the number of electronic devices keeps increasing exponentially;and the computation power, communication data rate, smart sensing capability and intelligence are always not enough. Hardware supports software, while the integrated circuit(IC) is the core of hardware. In this long review paper, we summarize and discuss recent trending IC design directions and challenges, and try to give the readers big/cool pictures on each selected small/hot topics. We divide the trends into the following six categories, namely, 1) machine learning and artificial intelligence(AI) chips, 2) communication ICs, 3) data converters, 4) power converters, 5) imagers and range sensors, 6) emerging directions. Hope you find this paper useful for your future research and works.展开更多
基金supported by the Ministry of Science and Technology of China(Grant No.2019YFA0705600)the National Natural Science Foundation of China(Grant Nos.51822205,21875121)+2 种基金the Natural Science Foundation of Tianjin(Grant Nos.18JCJQJC46300,19JCZDJC31900)the Ministry of Education of China(Grant No.B12015)the “Frontiers Science Center for New Organic Matter”,Nankai University(Grant No.63181206)。
文摘The rapid development of micro-electronics raises the demand of their power sources to be simplified,miniaturized and highly integratable with other electronics on a chip.In-plane Micro-sized energy storage devices(MESDs),which are composed of interdigitated electrodes on a single chip,have aroused particular attentions since they could be easily integrated with other miniaturized electronics,reducing the complexity of overall chip design via removing complex interconnections with bulky power sources.This review highlights the achievements in the device fabrication of in-plane MESDs,as well as their integration and intelligent designs.We also discussed the current challenges and future perspectives for the development of in-plane MESDs.
文摘For the non-stop demands for a better and smarter society, the number of electronic devices keeps increasing exponentially;and the computation power, communication data rate, smart sensing capability and intelligence are always not enough. Hardware supports software, while the integrated circuit(IC) is the core of hardware. In this long review paper, we summarize and discuss recent trending IC design directions and challenges, and try to give the readers big/cool pictures on each selected small/hot topics. We divide the trends into the following six categories, namely, 1) machine learning and artificial intelligence(AI) chips, 2) communication ICs, 3) data converters, 4) power converters, 5) imagers and range sensors, 6) emerging directions. Hope you find this paper useful for your future research and works.
