TEM Study on the Ag-BSCCO Interface of Silver-sheathed Bi-2223 Superconducting Tape

The Ag/Bi Sr Ca Cu O (BSCCO) interfaces of silver sheathed Bi 2223 superconducting tapes were studied by using transmission electron microscopy (TEM). Most of the interfaces are even and well bonded. The (001) planes of 2223 phase are parallel to the interfaces. Some step like interfaces were observed. There is occasionally a layer of one half unit cell of 2201 phase at the interface. No orientation relationship between the superconductor and the silver exists in the tapes.

降温速率对Bi-2223/AgAu带材微观结构和传输性能的影响（英文）

采用PIT工艺制备了单芯Bi-2223/AgAu带材,系统地研究了第二次热处理阶段(HT2)降温速率对带材相组成、微观结构和传输性能的影响。结果表明:随着降温速率的减小,富铅相3321不断增加,CuO颗粒尺寸逐渐增大。当冷却速率从600℃/h减小到1℃/h时,临界电流密度Jc从7 kA/cm^2增加到11.5 kA/cm^2,增加了64%。由于晶间连接性能和磁通钉扎性能的提高,在较低的降温速率下,Bi-2223/AgAu带材在磁场下的临界电流密度也得到了提高。