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Breaking Through Bottlenecks for Thermally Conductive Polymer Composites:A Perspective for Intrinsic Thermal Conductivity,Interfacial Thermal Resistance and Theoretics 被引量:19
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作者 Junwei Gu Kunpeng Ruan 《Nano-Micro Letters》 SCIE EI CAS CSCD 2021年第7期118-126,共9页
Rapid development of energy,electrical and electronic technologies has put forward higher requirements for the thermal conductivities of polymers and their composites.However,the thermal conductivity coefficient(λ)va... Rapid development of energy,electrical and electronic technologies has put forward higher requirements for the thermal conductivities of polymers and their composites.However,the thermal conductivity coefficient(λ)values of prepared thermally conductive polymer composites are still difficult to achieve expectations,which has become the bottleneck in the fields of thermally conductive polymer composites.Aimed at that,based on the accumulation of the previous research works by related researchers and our research group,this paper proposes three possible directions for breaking through the bottlenecks:(1)preparing and synthesizing intrinsically thermally conductive polymers,(2)reducing the interfacial thermal resistance in thermally conductive polymer composites,and(3)establishing suitable thermal conduction models and studying inner thermal conduction mechanism to guide experimental optimization.Also,the future development trends of the three above-mentioned directions are foreseen,hoping to provide certain basis and guidance for the preparation,researches and development of thermally conductive polymers and their composites. 展开更多
关键词 thermally conductive polymer composites Intrinsic thermal conductivity interfacial thermal resistance thermal conduction models thermal conduction mechanisms
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Interfacial thermal resistance between high-density polyethylene(HDPE) and sapphire 被引量:1
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作者 郑鲲 祝捷 +2 位作者 马永梅 唐大伟 王佛松 《Chinese Physics B》 SCIE EI CAS CSCD 2014年第10期493-498,共6页
To improve the thermal conductivity of polymeric composites, the numerous interfacial thermal resistance (ITR) inside is usually considered as a bottle neck, but the direct measurement of the ITR is hardly reported.... To improve the thermal conductivity of polymeric composites, the numerous interfacial thermal resistance (ITR) inside is usually considered as a bottle neck, but the direct measurement of the ITR is hardly reported. In this paper, a sandwich structure which consists of transducer/high density polyethylene (HDPE)/sapphire is prepared to study the interface characteristics. Then, the ITRs between HDPE and sapphire of two samples with different HDPE thickness values are measured by time-domain thermoreflectance (TDTR) method and the results are -- 2 × 10-7 m2.K.W-1. Furthermore, a model is used to evaluate the importance of ITR for the thermal conductivity of composites. The model's analysis indicates that reducing the ITR is an effective way of improving the thermal conductivity of composites. These results will provide valuable guidance for the design and manufacture of polymer-based thermally conductive materials. 展开更多
关键词 polymer composites interfacial thermal resistance time domain thermalreflectance
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Self-Modifying Nanointerface Driving Ultrahigh Bidirectional Thermal Conductivity Boron Nitride-Based Composite Flexible Films 被引量:2
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作者 Taoqing Huang Xinyu Zhang +5 位作者 Tian Wang Honggang Zhang Yongwei Li Hua Bao Min Chen Limin Wu 《Nano-Micro Letters》 SCIE EI CAS CSCD 2023年第1期14-24,共11页
While boron nitride(BN) is widely recognized as the most promising thermally conductive filler for rapidly developing high-power electronic devices due to its excellent thermal conductivity and dielectric properties,a... While boron nitride(BN) is widely recognized as the most promising thermally conductive filler for rapidly developing high-power electronic devices due to its excellent thermal conductivity and dielectric properties,a great challenge is the poor vertical thermal conductivity when embedded in composites owing to the poor interracial interaction causing severe phonon scattering.Here,we report a novel surface modification strategy called the "self-modified nanointerface" using BN nanocrystals(BNNCs) to efficiently link the interface between BN and the polymer matrix.Combining with ice-press assembly method,an only 25 wt% BNembedded composite film can not only possess an in-plane thermal conductivity of 20.3 W m-1K-1but also,more importantly,achieve a through-plane thermal conductivity as high as 21.3 W m-1K-1,which is more than twice the reported maximum due to the ideal phonon spectrum matching between BNNCs and BN fillers,the strong interaction between the self-modified fillers and polymer matrix,as well as ladder-structured BN skeleton.The excellent thermal conductivity has been verified by theoretical calculations and the heat dissipation of a CPU.This study provides an innovative design principle to tailor composite interfaces and opens up a new path to develop high-performance composites. 展开更多
关键词 thermal management materials Boron nitride thermal conductivity interfacial thermal resistance
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Thermal rectification induced by Wenzel–Cassie wetting state transition on nano-structured solid–liquid interfaces
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作者 李海洋 王军 夏国栋 《Chinese Physics B》 SCIE EI CAS CSCD 2023年第5期520-526,共7页
Thermal rectification refers to the phenomenon by which the magnitude of the heat flux in one direction is much larger than that in the opposite direction.In this study,we propose to implement the thermal rectificatio... Thermal rectification refers to the phenomenon by which the magnitude of the heat flux in one direction is much larger than that in the opposite direction.In this study,we propose to implement the thermal rectification phenomenon in an asymmetric solid–liquid–solid sandwiched system with a nano-structured interface.By using the non-equilibrium molecular dynamics simulations,the thermal transport through the solid–liquid–solid system is examined,and the thermal rectification phenomenon can be observed.It is revealed that the thermal rectification effect can be attributed to the significant difference in the interfacial thermal resistance between Cassie and Wenzel states when reversing the temperature bias.In addition,effects of the liquid density,solid–liquid bonding strength and nanostructure size on the thermal rectification are examined.The findings may provide a new way for designs of certain thermal devices. 展开更多
关键词 thermal rectification wetting transition interfacial thermal resistance solid–liquid interfaces
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Unusual thermal properties of graphene origami crease:A molecular dynamics study 被引量:2
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作者 Ning Wei Yang Chen +5 位作者 Kun Cai Yingyan Zhang Qingxiang Pei Jin-Cheng Zheng Yiu-Wing Mai Junhua Zhao 《Green Energy & Environment》 SCIE EI CSCD 2022年第1期86-94,共9页
Graphene is a two-dimensional material that can be folded into diverse and yet interesting nanostructures like macro-scale paper origami.Folding of graphene not only makes different morphological configurations but al... Graphene is a two-dimensional material that can be folded into diverse and yet interesting nanostructures like macro-scale paper origami.Folding of graphene not only makes different morphological configurations but also modifies their mechanical and thermal properties.Inspired by paper origami,herein we studied systemically the effects of creases,where sp^(2)to sp^(3)bond transformation occurs,on the thermal properties of graphene origami using molecular dynamics(MD)simulations.Our MD simulation results show that tensile strain reduces(not increases)the interfacial thermal resistance owing to the presence of the crease.This unusual phenomenon is explained by the micro-heat flux migration and stress distribution.Our findings on the graphene origami enable the design of the next-generation thermal management devices and flexible electronics with tuneable properties. 展开更多
关键词 GRAPHENE ORIGAMI Bond transformation interfacial thermal resistance Molecular dynamics
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Accomplishment and challenge of materials database toward big data 被引量:2
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作者 Yibin Xu 《Chinese Physics B》 SCIE EI CAS CSCD 2018年第11期130-135,共6页
The history and current status of materials data activities from handbook to database are reviewed, with introduction to some important products. Through an example of prediction of interfacial thermal resistance base... The history and current status of materials data activities from handbook to database are reviewed, with introduction to some important products. Through an example of prediction of interfacial thermal resistance based on data and data science methods, we show the advantages and potential of material informatics to study material issues which are too complicated or time consuming for conventional theoretical and experimental methods. Materials big data is the fundamental of material informatics. The challenges and strategy to construct materials big data are discussed, and some solutions are proposed as the results of our experiences to construct National Institute for Materials Science(NIMS) materials databases. 展开更多
关键词 material database big data material informatics machine learning interfacial thermal resistance material identification
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Thermal transport in organic/inorganic composites 被引量:2
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作者 Bin LIU Lan DONG +3 位作者 Qing Xi Xiangfan XU Jun ZHOU Baowen LI 《Frontiers in Energy》 SCIE CSCD 2018年第1期72-86,共15页
Composite materials, which consist of organic and inorganic components, are widely used in various fields because of their excellent mechanical properties, resistance to corrosion, low-cost fabrication, etc. Thermal p... Composite materials, which consist of organic and inorganic components, are widely used in various fields because of their excellent mechanical properties, resistance to corrosion, low-cost fabrication, etc. Thermal properties of organic/inorganic composites play a crucial role in some applications such as thermal interface materials for micro-electronic packaging, nano-porous materials for sensor development, thermal insulators for aerospace, and high-performance thermoelectric materials for power generation and refrigeration. In the past few years, many studies have been conducted to reveal the physical mechanism of thermal transport in organic/ inorganic composite materials in order to stimulate their practical applications. In this paper, the theoretical and experimental progresses in this field are reviewed. Besides, main factors affecting the thermal conductivity of organic/ inorganic compositcs are discussed, including the intrinsic properties of organic matrix and inorganic fillers, topolo- gical structure of composites, loading volume fraction, and the interfacial thermal resistance between fillers and organic matrix. 展开更多
关键词 thermal conductivity organic/inorganic com-posites effective medium theory thermal percolationtheory interfacial thermal resistance
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The lattice Boltzmann Peierls Callaway equation for mesoscopic thermal transport modeling
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作者 Jonghoon Lee Sangwook Sihn +1 位作者 Ajit K.Roy Barry L.Farmer 《International Journal of Smart and Nano Materials》 SCIE EI 2012年第1期47-63,共17页
The lattice Boltzmann Peierls Callaway(LBPC)method is a recent development of the versatile lattice Boltzmann formalism aimed at a numerical experiment on mesoscale thermal transport in a multiphase phonon gas.Two asp... The lattice Boltzmann Peierls Callaway(LBPC)method is a recent development of the versatile lattice Boltzmann formalism aimed at a numerical experiment on mesoscale thermal transport in a multiphase phonon gas.Two aspects of mesoscopic thermal trans-port are discussed:the finite phonon mean free path and the interface thermal resistance.Based on the phonon momentum screening length measured in the LBPC computa-tional apparatus,the validity of the Umklapp collision relaxation time in the Callaway collision operator is examined quantitatively.The discrete nature of the spatio-temporal domain in the LBPC method,along with the linear approximation of the exponential screening mechanism in the Callaway operator,reveals a large discrepancy between the effective phonon mean free path and the analytic phonon mean free path when the relaxation time is small.The link bounce back interface phonon collision rule is used to realize the interface thermal resistance between phonon gases with dissimilar dispersion relations.Consistent with the Callaway collision operator for the bulk phonon dynam-ics,the interface phonon collision process is regarded as a linear relaxation mechanism toward the local pseudo-equilibrium phonon distribution uniquely defined by the energy conservation principle.The interface thermal resistance is linearly proportional to the relaxation time of the proposed phonon interface collision rule. 展开更多
关键词 lattice Boltzmann method link bounce back collision rule Boltzmann Peierls equation phonon hydrodynamics Kapitza length interfacial thermal resistance
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Tuning graphene thermal modulator by rotating
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作者 Ning Wei Yixin Zhang +1 位作者 Yang Chen Yingyan Zhang 《International Journal of Smart and Nano Materials》 SCIE EI 2020年第3期310-323,共14页
Exploring the thermal transport of graphene is significant for the application of its thermal properties.However,it is still a challenge to regulate the thermal conductivity of graphene interface.We study the interfac... Exploring the thermal transport of graphene is significant for the application of its thermal properties.However,it is still a challenge to regulate the thermal conductivity of graphene interface.We study the interfacial thermal transport mechanism of the bilayer graphene by utilizing the molecular dynamics simulations.During the simulation,the interfacial thermal conductivity is regulated and controlled by lattice matching and tailoring.The lattice mismatched bilayer graphene model,combining the straining and torsion,can increase the interfacial thermal resistance(ITR)about 3.7 times.The variation trend of the ITR is explained by utilizing the vibrational spectra and the overlap factor.Besides,the thermal conductivity is proportional to the overlapping area.Our results show that the tailoring models can regularly control the thermal conductivity in a wide range by twisting the angle between upper and lower layers.These findings can provide a guideline for thermoelectric manage-ment and device design of thermal switch. 展开更多
关键词 interfacial thermal resistance bilayer graphene TORSION
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Molecular Dynamics Simulations of the Effects of Surface Sinusoidal Nanostructures on Nanoscale Liquid Film Phase-Change 被引量:3
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作者 CAO Qun CUI Zheng 《Journal of Thermal Science》 SCIE EI CAS CSCD 2020年第4期1076-1084,共9页
Nanostructures on heat transfer surfaces can enhance micro/nanoscale phase-change heat transfer processes. To understand the enhancement mechanisms provided by nanostructures, evaporation processes of nanoscale liquid... Nanostructures on heat transfer surfaces can enhance micro/nanoscale phase-change heat transfer processes. To understand the enhancement mechanisms provided by nanostructures, evaporation processes of nanoscale liquid films on periodic sinusoidal-shaped surfaces were investigated via molecular dynamics simulations. By changing the amplitudes(A) and periods(T) of the curves describing the sinusoidal shapes, which possess shapes similar to f(x)=h0+Asin(2πx/T), sinusoidal surfaces of different sizes were constructed. An unevaporated region always existed on the copper plate for all surfaces during phase-change processes. Moreover, we calculated the interfacial thermal resistances and the mismatches between the vibrational density of states of the solid and liquid for different surfaces. The results show that the argon temperature changes and evaporation rates during the phase-change process on sinusoidal surfaces are higher than those on flat surfaces, and these results increase with the increase in amplitudes and the decrease in periods within certain limits mainly because of the thermal resistance decrease at the solid-liquid interface. Furthermore, the corresponding mismatches between the vibrational density of states of the solid and liquid also decrease, which indicates that the existence of sinusoidal nanostructures enhances the heat transfer of the phase-change process. 展开更多
关键词 molecular dynamics simulation sinusoidal surface PHASE-CHANGE interfacial thermal resistance NANOSCALE
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A Molecular Analysis of Critical Factors for Interface and Size Effects on Heat Conduction in Nanoconfined Water Film
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作者 JIN Lu ZHOU Leping DU Xiaoze 《Journal of Thermal Science》 SCIE EI CAS CSCD 2022年第4期1155-1166,共12页
Heat conduction of nanoconfined liquid may differ from its bulk because of the effects of size,geometry,interface,temperature,etc.In this study,the roles of some critical factors for the heat conduction of nanoconfine... Heat conduction of nanoconfined liquid may differ from its bulk because of the effects of size,geometry,interface,temperature,etc.In this study,the roles of some critical factors for the heat conduction of nanoconfined water film are systematically analyzed by using the molecular dynamics method.With decreasing thickness,the normal thermal conductivity of nanoconfined water film between two copper plates decreases exponentially,while the thermal resistance,peak of the radial distribution function,and atomistic heat path increase exponentially.The average bond order,radial distribution function,mean squared displacement,and vibrational density of states are calculated to analyze the effects of structure,distribution,molecular diffusion,and vibration of water molecules on heat conduction especially in a region having no oxygen atoms(which is observed by the near-wall density profile).The results show that phonon scattering is dominant for determining the reduced thermal conductivity in this near-wall region.The thermal conductivity ratio of confined water film to bulk water has a roughly linear relationship with the logarithm of the proportion of the near-wall region.Moreover,the high interfacial thermal resistance is positively correlated to the film thickness,but it has a negligible impact on heat conduction.This work provides insights into the contribution of water molecules near the solid/liquid interface to the heat conduction of nanoconfined liquid for process intensification. 展开更多
关键词 near-wall region molecular dynamics study thermal conductivity interfacial thermal resistance nanoconfined liquid
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Mechanically exfoliated MoS_(2) nanoflakes for optimizing the thermoelectric performance of SrTiO_(3)-based ceramic composites
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作者 Jilong Huang Yongping Liu +3 位作者 Peng Yan Jie Gao Yuchi Fan Wan Jiang 《Journal of Materiomics》 SCIE 2022年第4期790-798,共9页
As a semiconducting material with relatively low thermal conductivity,MoS_(2) nanoflake has the potential to serve as a modulator for optimizing the performance of thermoelectric(TE)materials.However,the low yield of ... As a semiconducting material with relatively low thermal conductivity,MoS_(2) nanoflake has the potential to serve as a modulator for optimizing the performance of thermoelectric(TE)materials.However,the low yield of MoS_(2) nanoflakes prepared by conventional methods has constrained the development of MoS_(2) optimized TE materials.We propose a mechanical exfoliation method for mass production of MoS_(2) nanoflakes using attrition mill.After mixed with La and Nb co-doped SrTiO_(3)(SLNT)powder,the MoS_(2)/SLNT composites are fabricated by spark plasma sintering.It is found that the heterojunctions formed at MoS_(2)/SLNT interfaces with proper band offset can effectively scatter the low-energy electrons,resulting in enhanced Seebeck coefficient without significantly undermining the electrical conductivity.The power factor of composites is improved when the MoS_(2) content is lower than 1.5 vol%.Meanwhile,the thermal conductivity of composites is significantly decreased due to the phonon scattering induced large thermal resistance at MoS_(2)/SLNT interfaces,which is much higher than that in graphene embedded SrTiO_(3) composites.Consequently,a maximum ZT-0.24 is obtained at 800 K in 1.5 vol%MoS_(2)/SLNT composite,which is~26%higher compared with pristine matrix.This work paves the way for application of TE materials modulated by transition metal dichalcogenides. 展开更多
关键词 THERMOELECTRIC MoS_(2) SrTiO_(3) Energy scattering interfacial thermal resistance
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