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Bonding strength of Invar/Cu clad strips fabricated by twin-roll casting process 被引量:3
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作者 Peng CHEN Hua-gui HUANG +2 位作者 Ce JI Xu ZHANG Zhong-hua SUN 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2018年第12期2460-2469,共10页
Based on traditional twin-roll casting process,Invar/Cu clad strips were successfully fabricated by using solid Invar alloy strip and molten Cu under conditions of high temperature,high pressure and plastic deformatio... Based on traditional twin-roll casting process,Invar/Cu clad strips were successfully fabricated by using solid Invar alloy strip and molten Cu under conditions of high temperature,high pressure and plastic deformation.A series of tests including tensile test,bending test,T-type peeling test and scanning electron microscope(SEM)and energy dispersive spectrometer(EDS)measurements were carried out to analyze the mechanical properties of Invar/Cu clad strips and the micro-morphology of tensile fracture surfaces and bonding interfaces.The results indicate that no delamination phenomenon occurs during the compatible deformation of Invar/Cu in bending test and only one stress platform exists in the tensile stress-strain curve when the bonding strength is large.On the contrary,different mechanical properties of Invar and Cu lead to delamination phenomenon during the uniaxial tensile test,which determines that two stress platforms occur on the stress-strain curve of Invar/Cu clad strips when two elements experience necking.The average peeling strength can be increased from13.85to42.31N/mm after heat treatment at800℃for1h,and the observation of the Cu side at peeling interface shows that more Fe is adhered on the Cu side after the heat treatment.All above illustrate that heat treatment can improve the strength of the bonding interface of Invar/Cu clad strips. 展开更多
关键词 twin-roll casting invar/cu clad strip heat treatment bonding interface bonding strength
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Effects of rolling and annealing on microstructures and properties of Cu/Invar electronic packaging composites prepared by powder metallurgy 被引量:5
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作者 吴丹 杨磊 +2 位作者 史常东 吴玉程 汤文明 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2015年第6期1995-2002,共8页
The Cu/Invar composites of 40% Cu were prepared by powder metallurgy, and the composites were rolled with 70% reduction and subsequently annealed at 750 ℃. Phases, microstructures and properties of the composites wer... The Cu/Invar composites of 40% Cu were prepared by powder metallurgy, and the composites were rolled with 70% reduction and subsequently annealed at 750 ℃. Phases, microstructures and properties of the composites were then studied. After that, the amount of a-Fe(Ni,Co) in the composites is reduced, because a-Fe(Ni,Co) partly transfers into y-Fe(Ni,Co) through the diffusion of the Ni atoms into a-Fe(Ni,Co) from Cu. When the rolling reduction is less than 40%, the deformation of Cu takes place, resulting in the movement of the Invar particles and the seaming of the pores. When the rolling reduction is in the range from 40% to 60%, the deformations of Invar and Cu occur simultaneously to form a streamline structure. After rolling till 70% and subsequent annealing, the Cu/Invar composites have fine comprehensive properties with a relative density of 98.6%, a tensile strength of 360 MPa, an elongation rate of 50%, a thermal conductivity of 25.42 W/(m.K) (as-tested) and a CTE of 10.79× 10-6/K (20-100 ℃). 展开更多
关键词 electronic packaging material cu/invar composite ROLLING ANNEALING
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Cu-Invar-Cu印制板在功率SMT电路中的应用
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作者 姜军 《电讯技术》 EI 北大核心 1997年第6期25-28,共4页
本文介绍了Cu-Invar-Cu(铜铟瓦)印制板的特点。
关键词 印制板 SMT 电子材料 铜烟瓦
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Process optimization,microstructures and mechanical/thermal properties of Cu/Invar bi-metal matrix composites fabricated by spark plasma sintering 被引量:8
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作者 Qiang-qiang NIE Guo-hong CHEN +2 位作者 Bing WANG Lei YANG Wen-ming TANG 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2021年第10期3050-3062,共13页
An orthogonal experiment scheme was designed to investigate the effects of the Cu content,compaction pressure,and sintering temperature on the microstructures and mechanical and thermal properties of(30−50)wt.%Cu/Inva... An orthogonal experiment scheme was designed to investigate the effects of the Cu content,compaction pressure,and sintering temperature on the microstructures and mechanical and thermal properties of(30−50)wt.%Cu/Invar bi-metal matrix composites fabricated via spark plasma sintering(SPS).The results indicated that as the Cu content increased from 30 to 50 wt.%,a continuous Cu network gradually appeared,and the density,thermal conductivity(TC)and coefficient of thermal expansion of the composites noticeably increased,but the tensile strength decreased.The increase in the sintering temperature promoted the Cu/Invar interface diffusion,leading to a reduction in the TC but an enhancement in the tensile strength of the composites.The compaction pressure comprehensively affected the thermal properties of the composites.The 50wt.%Cu/Invar composite sintered at 700℃ and 60 MPa had the highest TC(90.7 W/(m·K)),which was significantly higher than the TCs obtained for most of the previously reported Cu/Invar composites. 展开更多
关键词 spark plasma sintering(SPS) cu/invar bi-metal composite microstructure interface diffusion mechanical property thermal property
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Microstructures and properties of Cu/Ag(Invar) composites fabricated by powder metallurgy
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作者 Xin ZHANG Dan WU +3 位作者 Lei YANG Chang-dong SHI Yu-cheng WU Wen-ming TANG 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2017年第8期1759-1766,共8页
The Ag(Invar)composite powder prepared by ball milling was used to fabricate the Cu/Ag(Invar)composites.Microstructures and properties of the composites were studied after sintering and thermo-mechanical treatment.The... The Ag(Invar)composite powder prepared by ball milling was used to fabricate the Cu/Ag(Invar)composites.Microstructures and properties of the composites were studied after sintering and thermo-mechanical treatment.The results indicatethat during ball milling,micro-forging weld and work-hardening fracture result in that the average particle size of the Ag(Invar)powder increases rapidly at first,and then decreases sharply,finally tends to be constant.Compared with the Cu/Invar ones,thesinterability of the composites is greatly improved,resulting in that the pores in them are smaller in amount and size.After thethermo-mechanical treatment,the Cu/Ag(Invar)composites are nearly fully dense with the optimum phase composition and elementdistribution.More importantly,Cu and the Invar alloy in the composites distribute continuously in a three-dimensional(3D)networkstructure.Cu/Invar interface diffusion is effectively inhibited by the Ag barrier layer,leading to a great improvement of themechanical and thermal properties of the Cu/Ag(Invar)composites. 展开更多
关键词 cu/invar composite Ag barrier layer SINTERING thermo-mechanical treatment 3D network structure mechanical properties thermal properties
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