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Electrochemical formation of holmium-copper alloys on copper cathode in molten KCl-HoCl_3 被引量:1
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作者 苏育志 杨绮琴 刘冠昆 《中国有色金属学会会刊:英文版》 EI CSCD 2006年第5期1213-1217,共5页
Cyclic voltammetry, open circuit potential— time curve after potentiostatic electrolysis and potential step chronoamperometry were used to investigate the electrochemical formation processes of holmium-copper alloys ... Cyclic voltammetry, open circuit potential— time curve after potentiostatic electrolysis and potential step chronoamperometry were used to investigate the electrochemical formation processes of holmium-copper alloys on copper cathode in molten HoCl3-KCl. Intermetallic compounds HoCu5, HoCu4, HoCu2 and HoCu are formed in sequence and then the metallic Ho is deposited when Ho3+ is reduced on copper electrode in molten KCl-HoCl3 at 1066 K. The first charge-transfer reaction is reversible. The structure of holmium-copper alloy film deposited on copper electrode by potentiostatic electrolysis was characterized by X-ray diffraction. The standard free energies of formation for the intermetallic compounds HoCu5, HoCu4, HoCu2 and HoCu are - 95.5, - 92.6, - 73.8 and - 44.0 kJ/mol, respectively. The diffusion coefficient and diffusion activation energy of Ho atom in the alloy are estimated to be 10-10- 10-11 cm2/s and 75.35 kJ/mol, respectively, from the chronoamperometry data. 展开更多
关键词 钬铜合金 电化学加工 生成自由能 扩散系数 kcl-hocl3
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