At present, high internal stress in SU-8 photoresist layer has become one of the most primary problems and restricted structure stability and higher aspect ratio of SU-8 photoresist. However, the existing studies all ...At present, high internal stress in SU-8 photoresist layer has become one of the most primary problems and restricted structure stability and higher aspect ratio of SU-8 photoresist. However, the existing studies all focused on optimizing the process pa-rameters or mask design, and could not be popularized. The purpose of this paper is to reduce the internal stress in cured SU-8 photoresist layer by ultrasonic stress relief technology. The ultrasonic stress relief mechanism in SU-8 photoresist layer was presented. Based on improved Stoney’s formula, the profile mothod calculation model for SU-8 internal stress was proposed. The effect of ultrasonic stress relief on SU-8 layers was studied by experiments. Some important factors, such as amplitude of vibration, power input and relief time, were discussed. The values of internal stress before and after the ultrasonic stress relief process were compared. The research results show that the internal stress in cured SU-8 layer can be reduced effectively if the proper experimental parameters are chosen, and ultrasonic stress relief technology in nonmetal field has some practical value.展开更多
In this paper,we report the study of the process of fabricating a multi-layermetal micro-structure using UV-LIGA overlay technology,includingmask fabrication,substrate treatment,and UV-LIGA overlay processes.To solve ...In this paper,we report the study of the process of fabricating a multi-layermetal micro-structure using UV-LIGA overlay technology,includingmask fabrication,substrate treatment,and UV-LIGA overlay processes.To solve the process problems in the masking procedure,the swelling problemof the first layer of SU-8 thick photoresist was studied experimentally.The 5μmline-width compensation and closed 20μmand 30μmisolation strips were designed and fabricated around the micro-structure pattern.The pore problemin the Ni micro-electroforming layer was analyzed and the electroforming parameters were improved.The pH value of the electroforming solution should be controlled between 3.8 and 4.4 and the current density should be below 3 A/dm^2.To solve the problems of high inner stress and incomplete development of the micro-cylinder hole array with a diameter of 30μm,the lithography process was optimized.The pre-baking temperature was increased via gradient heating and rose every 5℃ from 65℃ to 85℃ and then remained at 85℃ for 50 min–1 h.In addition,the full contact exposure was used.Finally,a multi-layer metal micro-structure with high precision and good quality of microelectroforming layer was fabricated using UV-LIGA overlay technology.展开更多
基金supported by the National Natural Science Foundation of China (Grant No50675025)
文摘At present, high internal stress in SU-8 photoresist layer has become one of the most primary problems and restricted structure stability and higher aspect ratio of SU-8 photoresist. However, the existing studies all focused on optimizing the process pa-rameters or mask design, and could not be popularized. The purpose of this paper is to reduce the internal stress in cured SU-8 photoresist layer by ultrasonic stress relief technology. The ultrasonic stress relief mechanism in SU-8 photoresist layer was presented. Based on improved Stoney’s formula, the profile mothod calculation model for SU-8 internal stress was proposed. The effect of ultrasonic stress relief on SU-8 layers was studied by experiments. Some important factors, such as amplitude of vibration, power input and relief time, were discussed. The values of internal stress before and after the ultrasonic stress relief process were compared. The research results show that the internal stress in cured SU-8 layer can be reduced effectively if the proper experimental parameters are chosen, and ultrasonic stress relief technology in nonmetal field has some practical value.
文摘In this paper,we report the study of the process of fabricating a multi-layermetal micro-structure using UV-LIGA overlay technology,includingmask fabrication,substrate treatment,and UV-LIGA overlay processes.To solve the process problems in the masking procedure,the swelling problemof the first layer of SU-8 thick photoresist was studied experimentally.The 5μmline-width compensation and closed 20μmand 30μmisolation strips were designed and fabricated around the micro-structure pattern.The pore problemin the Ni micro-electroforming layer was analyzed and the electroforming parameters were improved.The pH value of the electroforming solution should be controlled between 3.8 and 4.4 and the current density should be below 3 A/dm^2.To solve the problems of high inner stress and incomplete development of the micro-cylinder hole array with a diameter of 30μm,the lithography process was optimized.The pre-baking temperature was increased via gradient heating and rose every 5℃ from 65℃ to 85℃ and then remained at 85℃ for 50 min–1 h.In addition,the full contact exposure was used.Finally,a multi-layer metal micro-structure with high precision and good quality of microelectroforming layer was fabricated using UV-LIGA overlay technology.
