A well-established method is highly desirable for growing topological insulator thin films with low carrier density on a wafer-level scale. Here, we present a simple, scalable method based on magnetron sputtering to o...A well-established method is highly desirable for growing topological insulator thin films with low carrier density on a wafer-level scale. Here, we present a simple, scalable method based on magnetron sputtering to obtain high-quality Bi_(2) Te_(3) films with the carrier density down to 4.0 × 10^(13) cm^(-2). In contrast to the most-used method of high substrate temperature growth, we firstly sputtered Bi_(2) Te_(3) thin films at room temperature and then applied post-annealing. It enables the growth of highly-oriented Bi_(2) Te_(3) thin films with larger grain size and smoother interface. The results of electrical transport show that it has a lower carrier density as well as a larger coherent length(~ 228 nm, 2 K). Our studies pave the way toward large-scale, cost-effective production of Bi_(2) Te_(3) thin films to be integrated with other materials in wafer-level scale for electronic and spintronic applications.展开更多
基金supported by the National Natural Science Foundation of China (Grant Nos. 52072030, 52071025, and 51871018)the Beijing Outstanding Young Scientists Projects (Grant No. BJJWZYJH01201910005018)+2 种基金Beijing Natural Science Foundation,China (Grant No. Z180014)the Science and Technology Innovation Team Program of Foshan (Grant No. FSOAA-KJ919-4402-0087)Beijing Laboratory of Metallic Materials and Processing for Modern Transportation。
文摘A well-established method is highly desirable for growing topological insulator thin films with low carrier density on a wafer-level scale. Here, we present a simple, scalable method based on magnetron sputtering to obtain high-quality Bi_(2) Te_(3) films with the carrier density down to 4.0 × 10^(13) cm^(-2). In contrast to the most-used method of high substrate temperature growth, we firstly sputtered Bi_(2) Te_(3) thin films at room temperature and then applied post-annealing. It enables the growth of highly-oriented Bi_(2) Te_(3) thin films with larger grain size and smoother interface. The results of electrical transport show that it has a lower carrier density as well as a larger coherent length(~ 228 nm, 2 K). Our studies pave the way toward large-scale, cost-effective production of Bi_(2) Te_(3) thin films to be integrated with other materials in wafer-level scale for electronic and spintronic applications.
