Thermal property is one of the most important properties of light-emitting diode （LED）. Thermal property of LED packaging material determines the heat dissipations of the phosphor and the chip surface, accordingly h...Thermal property is one of the most important properties of light-emitting diode （LED）. Thermal property of LED packaging material determines the heat dissipations of the phosphor and the chip surface, accordingly having an influence on the light-emitting efficiency and the life-span of the device. In this paper, photoacoustic piezoelectric （PAPE） technique has been employed to investigate the thermal properties of polyvinyl alcohol （]？VA） and silicon dioxide, which are the new and the traditional packaging materials in white LED, respectively. Firstly, the theory of PAPE technique has been developed for two-layer model in order to investigate soft materials; secondly, the experimental system has been set up and adjusted by measuring the reference sample; thirdly, the thermal diffusivities of PVA and silicon dioxide are measured and analysed. The experimental results show that PVA has a higher thermal diffusivity than silicon dioxide and is a better packaging material in the sense of thermal diffusivity for white LED.展开更多
In this work, low-temperature vulcanized, transparent silane modified epoxy resins for LED filament bulb package were prepared. Firstly, transparent silane modified epoxy resins were produced through a controllable so...In this work, low-temperature vulcanized, transparent silane modified epoxy resins for LED filament bulb package were prepared. Firstly, transparent silane modified epoxy resins were produced through a controllable sol-gel method using γ-（2,3-epoxypropoxy）propytrimethoxysilane and dimethyldiethoxylsilane. The features of the reaction were investigated and the products were characterized in detail. Subsequently, various curing agents were explored to prepare transparent silane modified epoxy resins. The silane modified epoxy resins cured by PEA-230 at a fairly low temperature（40 °C/2 h then 60 °C/1 h） exhibited excellent thermal stability with a thermal degradation temperature as high as 316.5 °C and adjustable hardness between 40-60 shore A. The application tests showed the materials obtained were good candidates for LED filament bulb package.展开更多
基金Project supported by the National Nature Science Foundation of China (Grant No. 50506006)the National High Technology Research and Development Program of China (Grant No. 2006AA03A116)the Youth Foundation of University of Electronic Science and Technology of China (Grant No. JX05024)
文摘Thermal property is one of the most important properties of light-emitting diode （LED）. Thermal property of LED packaging material determines the heat dissipations of the phosphor and the chip surface, accordingly having an influence on the light-emitting efficiency and the life-span of the device. In this paper, photoacoustic piezoelectric （PAPE） technique has been employed to investigate the thermal properties of polyvinyl alcohol （]？VA） and silicon dioxide, which are the new and the traditional packaging materials in white LED, respectively. Firstly, the theory of PAPE technique has been developed for two-layer model in order to investigate soft materials; secondly, the experimental system has been set up and adjusted by measuring the reference sample; thirdly, the thermal diffusivities of PVA and silicon dioxide are measured and analysed. The experimental results show that PVA has a higher thermal diffusivity than silicon dioxide and is a better packaging material in the sense of thermal diffusivity for white LED.
基金financial support from the Zhejiang Provincial Natural Science Foundation of China (No.Y14E030008)the Commonweal Technology Application Research Project of Zhejiang Province (No.2013C31079)
文摘In this work, low-temperature vulcanized, transparent silane modified epoxy resins for LED filament bulb package were prepared. Firstly, transparent silane modified epoxy resins were produced through a controllable sol-gel method using γ-（2,3-epoxypropoxy）propytrimethoxysilane and dimethyldiethoxylsilane. The features of the reaction were investigated and the products were characterized in detail. Subsequently, various curing agents were explored to prepare transparent silane modified epoxy resins. The silane modified epoxy resins cured by PEA-230 at a fairly low temperature（40 °C/2 h then 60 °C/1 h） exhibited excellent thermal stability with a thermal degradation temperature as high as 316.5 °C and adjustable hardness between 40-60 shore A. The application tests showed the materials obtained were good candidates for LED filament bulb package.
