Crack elongation and its width of large depth reinforced concrete beams

In order to meet the requirement of structural inspection,the crack spacing and crack width at various heights in the tensile zone of six large depth reinforced concrete beams were measured under several loading levels of serviceability state.The effects of the depth of normal section beams on the crack spacing and crack width were analyzed,and the modified model is proposed for calculating the average crack spacing by thinking about the depth of normal section,the reinforcement arrangement and the effective reinforcement ratio.The relationships of crack widths at any position in the tensile zone and at the reinforcement level on the side surface of beam were studied.By theoretical and statistical analysis,a method is proposed to calculate the ratios of crack widths between any position and the reinforcement level on the side surface of large depth reinforced concrete beams.

Research on Large Depth Diameter Ratio Ultra-precision Aspheric Grinding System

In this paper, the factors of affecting surface roughness and profiles accuracy of the machined larege depth diamter ratio aspheric surfaces in ultra-precision grinding process are analyzed theoretically. An ultra-precision aspheric grinding system is then designed and manufactured. Aerostatic form is adopted to build the spindle of the workpiece, transverse guideway, longitudinal guideway and the spindle of the grinder in this system. The following specification is achieved, such as the turning accuracy of the spindle of the workpiece is 0.05 μm, radial rigidity of the spindle is GE 220N/μm, axial rigidity is GE 160 N/μm, radial rigidity of the guideway is GE 200N/μm, the highest rotational speed of the grinder is 80 000 rev/min and its turning accuracy is 0.1 μm, the resolution of linear displacement of the transverse and longitudinal guideway is 4.9 nm. Adjusting range of this adjusting mechanism is 2 mm in the Y direction, the adjusting accuracy of the precise adjusting mechanism is 0.1 μm. Micro displacement measuring system of this ultra-precision aspheric grinding adopts two-backfeed strategy, and angle displacement back-feed is realized by photoelectric encoder, it’s resolution is 655 360 pulse/rev. after 4 frequency multiplication, it’s angle displacement resolution is achieved 2 621 440 pulse/rev. Straight-line displacement is monitored by single frequency laser interferometer (DLSTAX LTM-20B, made in Japan). This CNC system adopts inimitable bi-arc step length flex CN interpolation algorithm, it’s CN system resolution is 5 nm.So this aspheric grinding system ensures profile accuracy of the machined part. The resolution of this interferometer is 5 nm. Finally, lots of ultra-precision grinding experiments are carried out on this grinding system. Some optical aspheric parts, with profiles accuracy of 0.3 μm, surface roughness less than 0.01 μm, are obtained.

Secondary electron emission and photoemission from a negative electron affinity semiconductor with large mean escape depth of excited electrons

The formulae for parameters of a negative electron affinity semiconductor(NEAS)with large mean escape depth of secondary electrons A(NEASLD)are deduced.The methods for obtaining parameters such asλ,B,E_(pom)and the maximumδandδat 100.0 keV≥E_(po)≥1.0 keV of a NEASLD with the deduced formulae are presented(B is the probability that an internal secondary electron escapes into the vacuum upon reaching the emission surface of the emitter,δis the secondary electron yield,E_(po)is the incident energy of primary electrons and E_(pom)is the E_(po)corresponding to the maximumδ).The parameters obtained here are analyzed,and it can be concluded that several parameters of NEASLDs obtained by the methods presented here agree with those obtained by other authors.The relation between the secondary electron emission and photoemission from a NEAS with large mean escape depth of excited electrons is investigated,and it is concluded that the presented method of obtaining A is more accurate than that of obtaining the corresponding parameter for a NEAS with largeλ_(ph)(λ_(ph)being the mean escape depth of photoelectrons),and that the presented method of calculating B at E_(po)>10.0 keV is more widely applicable for obtaining the corresponding parameters for a NEAS with largeλ_(ph).

Design of a real-time fiber-optic infrared imaging system with wide-angle and large depth of field

A key limitation in the observation of instruments used in operations and heart sutures during a procedure is the scattering and absorption during optical imaging in the presence of blood.Therefore,we propose a novel real-time fiber-optic infrared imaging system simultaneously capturing a flexible wide field of view(FOV) and large depth of field infrared image in real time.The assessment criteria for imaging quality of the objective and coupling lens have been optimized and evaluated.Furthermore,the feasibility of manufacturing and assembly has been demonstrated with tolerance sensitivity and the Monte Carlo analysis.The simulated results show that the optical system can achieve a large working distance of 8 to25 mm,a wide FOV of 120°,and the relative illuminance is over 0.98 in the overall FOV.To achieve high imaging quality in the proposed system,the modulation transfer function is over 0.661 at 16.7 Ip/mm for a 320×256 short wavelength infrared camera sensor with a pixel size of 30 μm.

Speckle structured illumination endoscopy with enhanced resolution at wide field of view and depth of field

Structured illumination microscopy(SIM)is one of the most widely applied wide field super resolution imaging techniques with high temporal resolution and low phototoxicity.The spatial resolution of SIM is typically limited to two times of the diffraction limit and the depth of field is small.In this work,we propose and experimentally demonstrate a low cost,easy to implement,novel technique called speckle structured illumination endoscopy(SSIE)to enhance the resolution of a wide field endoscope with large depth of field.Here,speckle patterns are used to excite objects on the sample which is then followed by a blind-SIM algorithm for super resolution image reconstruction.Our approach is insensitive to the 3D morphology of the specimen,or the deformation of illuminations used.It greatly simplifies the experimental setup as there are no calibration protocols and no stringent control of illumination patterns nor focusing optics.We demonstrate that the SSIE can enhance the resolution 2–4.5 times that of a standard white light endoscopic(WLE)system.The SSIE presents a unique route to super resolution in endoscopic imaging at wide field of view and depth of field,which might be beneficial to the practice of clinical endoscopy.

Cold Atom Cloud with High Optical Depth Measured with Large Duty Cycle

We present a cold atom system with a dark-line two-dimensional magneto-optical trap, to increase the atomic density by suppressing the atomic radiation pressure. Optical depth （OD） and duty cycle are used to evaluate the system performance. We demonstrate a 100% increase in OD with the dark line, and obtain an ultrahigh OD of 264 with 10% for the duty cycle. Also, with an efficient dark line region, the OD could maintain above i00 with duty cycle as high as 30%. The cold atomic ensemble with an ultrahigh OD with a 10%-30% duty cycle is particularly advantageous in quantum i^formation processing and communication.

Study on creep deformation and energy development of underground surrounding rock under four‐dimensional support

There is an urgent need to develop optimal solutions for deformation control of deep high‐stress roadways,one of the critical problems in underground engineering.The previously proposed four‐dimensional support(hereinafter 4D support),as a new support technology,can set the roadway surrounding rock under three‐dimensional pressure in the new balanced structure,and prevent instability of surrounding rock in underground engineering.However,the influence of roadway depth and creep deformation on the surrounding rock supported by 4D support is still unknown.This study investigated the influence of roadway depth and creep deformation time on the instability of surrounding rock by analyzing the energy development.The elastic strain energy was analyzed using the program redeveloped in FLAC3D.The numerical simulation results indicate that the combined support mode of 4D roof supports and conventional side supports is highly applicable to the stability control of surrounding rock with a roadway depth exceeding 520 m.With the increase of roadway depth,4D support can effectively restrain the area and depth of plastic deformation in the surrounding rock.Further,4D support limits the accumulation range and rate of elastic strain energy as the creep deformation time increases.4D support can effectively reduce the plastic deformation of roadway surrounding rock and maintain the stability for a long deformation period of 6 months.As confirmed by in situ monitoring results,4D support is more effective for the long‐term stability control of surrounding rock than conventional support.

Transparent Thermally Tunable Microwave Absorber Prototype Based on Patterned VO2 Film

Transparent microwave absorbers that exhibit high optical transmittance and microwave absorption capability are ideal,although having a fixed absorption performance limits their applicability.Here,a simple,transparent,and thermally tunable microwave absorber is proposed,based on a patterned vanadium dioxide(VO_(2))film.Numerical calculations and experiments demonstrate that the proposed VO_(2)absorber has a high optical transmittance of 84.9%at 620 nm;its reflection loss at 15.06 GHz can be thermally tuned from–4.257 to–60.179 dB,and near-unity absorption is achieved at 523.750 K.Adjusting only the patterned VO_(2)film duty cycle can change the temperature of near-unity absorption.Our VO_(2)absorber has a simple composition,a high optical transmittance,a thermally tunable microwave absorption performance,a large modulation depth,and an adjustable temperature tuning range,making it promising for application in tunable sensors,thermal emitters,modulators,thermal imaging,bolometers,and photovoltaic devices.