This article discusses the silicon lattice damage induced during H-plasma in-situ cleaning and finds that the substrate temperature, plasma power, processing time, all affect the extent of the distortion of the surfac...This article discusses the silicon lattice damage induced during H-plasma in-situ cleaning and finds that the substrate temperature, plasma power, processing time, all affect the extent of the distortion of the surface and its curability.展开更多
文摘This article discusses the silicon lattice damage induced during H-plasma in-situ cleaning and finds that the substrate temperature, plasma power, processing time, all affect the extent of the distortion of the surface and its curability.
