报道了用 MBE技术生长的 Ga As基 In Al As/In Ga As改变结构高电子迁移率晶体管 (MHEMT)的制作过程和器件的直流性能。对于栅长为 0 .8μm的器件 ,最大非本征跨导和饱和电流密度分别为 3 5 0 m S/mm和1 90 m A/mm。源漏击穿电压和栅反...报道了用 MBE技术生长的 Ga As基 In Al As/In Ga As改变结构高电子迁移率晶体管 (MHEMT)的制作过程和器件的直流性能。对于栅长为 0 .8μm的器件 ,最大非本征跨导和饱和电流密度分别为 3 5 0 m S/mm和1 90 m A/mm。源漏击穿电压和栅反向击穿电压分别为 4V和 7.5 V。这些直流特性超过了相同的材料和工艺条件下 Ga As基 PHEMT的水平 ,与 In P基 In Al As/In Ga As展开更多
1.0μm gate-length GaAs-based MHEMTs have been fabricated by MBE epitaxial material and contact-mode lithography technology. Pt/Ti/Pt/Au and Ti/Pt/Au were evaporated to form gate metals. Excellent DC and RF performanc...1.0μm gate-length GaAs-based MHEMTs have been fabricated by MBE epitaxial material and contact-mode lithography technology. Pt/Ti/Pt/Au and Ti/Pt/Au were evaporated to form gate metals. Excellent DC and RF performances have been obtained, and the transconductance, maximum saturation drain current density, threshold voltage, current cut-off frequency,and maximum oscillation frequency of Pt/Ti/Pt/Au and Ti/Pt/Au MHEMTs were 502 （503） mS/mm, 382（530）mA/mm,0.1（ - 0.5）V,13.4（14.8）GHz,and 17.0（17.5）GHz,respectively. DC-10GHz single-pole double-throw （SPDT） switch MMICs have been designed and fabricated by Ti/Pt/Au MHEMTs. Insertion loss,isolation,input,and out- put return losses of SPDT chips were better than 2.93,23.34,and 20dB.展开更多
采用普通接触曝光研制成栅长为 0 .2 5 μm的 Ga As基 In Al As/ In Ga As变组分高电子迁移率晶体管(MHEMT) ,测得其跨导为 5 2 2 m S/ m m,沟道电流密度达 4 90 m A/ mm,截止频率为 75 GHz,比同样工艺条件下Ga As基 In Ga P/ In Ga As ...采用普通接触曝光研制成栅长为 0 .2 5 μm的 Ga As基 In Al As/ In Ga As变组分高电子迁移率晶体管(MHEMT) ,测得其跨导为 5 2 2 m S/ m m,沟道电流密度达 4 90 m A/ mm,截止频率为 75 GHz,比同样工艺条件下Ga As基 In Ga P/ In Ga As PHEMT的性能有很大的提高 .对该器件工艺及结果进行了分析 ,提取了器件的交流小信号等效电路模型参数 ,并提出了进一步得到高稳定性、高性能器件的方法 .展开更多
GaAs-based metamorphic HEMTs (MHEMT) consist of GaAs substrates and InP-based epitaxial structure, and have the advantages of both InP HEMT's excellent performances and GaAs-based HEMT's mature processes. GaAs...GaAs-based metamorphic HEMTs (MHEMT) consist of GaAs substrates and InP-based epitaxial structure, and have the advantages of both InP HEMT's excellent performances and GaAs-based HEMT's mature processes. GaAs-based MHEMTs were applied to millimeter-wave low-noise, high-power applications and systems. The current gain cut-off frequency (fT) and the maximum oscillation frequency (fmax) are important performance parameter of GaAs-based MHEMTs, and they are limited by the gate-length mainly. Electron beam lithography is one of the lithography technologies which can be used to realize the deep submicron gate-length. The 200 nm gate-length GaAs-based MHEMTs have been fabricated by electron beam lithography. In order to reduce the parasite gate capacitance and gate resistance, a trilayer resist structure was used to pattern the T-gate resist profile. Excellent DC, high frequency and power performances have been obtained. FT and fmax are 105 GHz, 70 GHz respectively. The research is very helpful to obtain higher performance GaAs-based MHEMTs.展开更多
High performance 150-nm gate-length metamorphic Al0.48In0.52As/Ga0.47In0.53 As high electron mobility transistors(mHEMTs) with very good device performance have been successfully fabricated.A T-shaped gate is fabricat...High performance 150-nm gate-length metamorphic Al0.48In0.52As/Ga0.47In0.53 As high electron mobility transistors(mHEMTs) with very good device performance have been successfully fabricated.A T-shaped gate is fabricated by using a combined technique of optical and e-beam photolithography,which is beneficial to decreasing parasitic capacitance and parasitic resistance of the gate.The ohmic contact resistance R c is as low as 0.03 mm when using a novel ohmic contact metal system(Ni/Ge/Ti/Au).The devices exhibit excellent DC and RF performance.A peak extrinsic transconductance of 775 mS/mm and a maximum drain current density of 720 mA/mm are achieved.The unity current gain cut-off frequency(fT) and the maximum oscillation frequency(f max) are 188.4 and 250 GHz,respectively.展开更多
本文设计了一款W波段单片低噪声放大器(LNA),采用100 nm In0.52Al0.48As/In0.53Ga0.47As Ga As MHEMT(渐变组分高电子迁移率晶体管)工艺。该MMIC LNA采用4级放大电路结构,器件栅宽为2×20um,电路版图联合仿真结果表明该LNA在75-100...本文设计了一款W波段单片低噪声放大器(LNA),采用100 nm In0.52Al0.48As/In0.53Ga0.47As Ga As MHEMT(渐变组分高电子迁移率晶体管)工艺。该MMIC LNA采用4级放大电路结构,器件栅宽为2×20um,电路版图联合仿真结果表明该LNA在75-100GHz频带内,输入输出回波损耗均大于5d B,噪声系数小于5d B,增益大于17d B,带内增益平坦度小于1.5d B,W波段全频带内增益大于12d B。芯片面积为2.6mm×1.6mm。展开更多
200nm gate-length GaAs-based InAlAs/InGaAs MHEMTs are fabricated by MBE epitaxial material and EBL （electron beam lithography） technology. Ti/Pt/Au is evaporated to form gate metals. A T-shaped gate is produced usin...200nm gate-length GaAs-based InAlAs/InGaAs MHEMTs are fabricated by MBE epitaxial material and EBL （electron beam lithography） technology. Ti/Pt/Au is evaporated to form gate metals. A T-shaped gate is produced using a novel PMMA/PMGI/PMMA trilayer resist structure to decrease parasitic capacitance and parasitic resistance of the gate. Excellent DC and RF performances are obtained and the transconductance （gm） ,maximum saturation drain current density （Joss）, threshold voltage （ VT）, current cut-off frequency （fT） , and maximum oscillation frequency （fmax） of InAlAs/ InGaAs MHEMTs are 510mS/mm,605mA/mm, -1.8V, 110GHz, and 72GHz, respectively.展开更多
提出了一种晶体管器件模型修正方法,校准了Ommic公司D007IH工艺中D波段晶体管模型和D波段共面波导传输线电路模型。该校准方法中通过与共面波导(CPW)三维模型仿真结果的曲线拟合,确定了D波段传输线电路模型的介电常数;通过与CGY2191UH...提出了一种晶体管器件模型修正方法,校准了Ommic公司D007IH工艺中D波段晶体管模型和D波段共面波导传输线电路模型。该校准方法中通过与共面波导(CPW)三维模型仿真结果的曲线拟合,确定了D波段传输线电路模型的介电常数;通过与CGY2191UH芯片的S参数测试结果拟合,修正了晶体管器件模型。为了验证了设计方法的有效性,基于修正模型设计了一款低噪声放大器芯片,仿真结果表明,工作频率为110 GHz^170 GHz,增益大于29 d B,噪声系数小于6 d B。展开更多
文摘报道了用 MBE技术生长的 Ga As基 In Al As/In Ga As改变结构高电子迁移率晶体管 (MHEMT)的制作过程和器件的直流性能。对于栅长为 0 .8μm的器件 ,最大非本征跨导和饱和电流密度分别为 3 5 0 m S/mm和1 90 m A/mm。源漏击穿电压和栅反向击穿电压分别为 4V和 7.5 V。这些直流特性超过了相同的材料和工艺条件下 Ga As基 PHEMT的水平 ,与 In P基 In Al As/In Ga As
文摘1.0μm gate-length GaAs-based MHEMTs have been fabricated by MBE epitaxial material and contact-mode lithography technology. Pt/Ti/Pt/Au and Ti/Pt/Au were evaporated to form gate metals. Excellent DC and RF performances have been obtained, and the transconductance, maximum saturation drain current density, threshold voltage, current cut-off frequency,and maximum oscillation frequency of Pt/Ti/Pt/Au and Ti/Pt/Au MHEMTs were 502 （503） mS/mm, 382（530）mA/mm,0.1（ - 0.5）V,13.4（14.8）GHz,and 17.0（17.5）GHz,respectively. DC-10GHz single-pole double-throw （SPDT） switch MMICs have been designed and fabricated by Ti/Pt/Au MHEMTs. Insertion loss,isolation,input,and out- put return losses of SPDT chips were better than 2.93,23.34,and 20dB.
文摘采用普通接触曝光研制成栅长为 0 .2 5 μm的 Ga As基 In Al As/ In Ga As变组分高电子迁移率晶体管(MHEMT) ,测得其跨导为 5 2 2 m S/ m m,沟道电流密度达 4 90 m A/ mm,截止频率为 75 GHz,比同样工艺条件下Ga As基 In Ga P/ In Ga As PHEMT的性能有很大的提高 .对该器件工艺及结果进行了分析 ,提取了器件的交流小信号等效电路模型参数 ,并提出了进一步得到高稳定性、高性能器件的方法 .
基金the National Basic Research Program of China (Grant No. G2002CB311901)Equipment Advance Research Project (Grant No. 61501050401C)Institute of Microelectronics, Chinese Academy of Sciences, Dean Fund (Grant No. 06SB124004)
文摘GaAs-based metamorphic HEMTs (MHEMT) consist of GaAs substrates and InP-based epitaxial structure, and have the advantages of both InP HEMT's excellent performances and GaAs-based HEMT's mature processes. GaAs-based MHEMTs were applied to millimeter-wave low-noise, high-power applications and systems. The current gain cut-off frequency (fT) and the maximum oscillation frequency (fmax) are important performance parameter of GaAs-based MHEMTs, and they are limited by the gate-length mainly. Electron beam lithography is one of the lithography technologies which can be used to realize the deep submicron gate-length. The 200 nm gate-length GaAs-based MHEMTs have been fabricated by electron beam lithography. In order to reduce the parasite gate capacitance and gate resistance, a trilayer resist structure was used to pattern the T-gate resist profile. Excellent DC, high frequency and power performances have been obtained. FT and fmax are 105 GHz, 70 GHz respectively. The research is very helpful to obtain higher performance GaAs-based MHEMTs.
基金supported by the National Natural Science Foundation of China(Grant Nos.61274026,60274077 and 60976068)the Scientific Research Fund of Hunan Provincial Education Department(Grant No. 10C0709)the Science and Technology Plan Foundation of Hunan Province(Grant No.2011GK3058)
文摘High performance 150-nm gate-length metamorphic Al0.48In0.52As/Ga0.47In0.53 As high electron mobility transistors(mHEMTs) with very good device performance have been successfully fabricated.A T-shaped gate is fabricated by using a combined technique of optical and e-beam photolithography,which is beneficial to decreasing parasitic capacitance and parasitic resistance of the gate.The ohmic contact resistance R c is as low as 0.03 mm when using a novel ohmic contact metal system(Ni/Ge/Ti/Au).The devices exhibit excellent DC and RF performance.A peak extrinsic transconductance of 775 mS/mm and a maximum drain current density of 720 mA/mm are achieved.The unity current gain cut-off frequency(fT) and the maximum oscillation frequency(f max) are 188.4 and 250 GHz,respectively.
基金the State Key Development Program for Basic Research of China(No.G2002CB311901)the Equipment Investigation Program in Advance(No.61501050401C)the Dean Fund of the Institute of Microelectronics,Chinese Academy of Sciences(No.O6SB124004)~~
文摘200nm gate-length GaAs-based InAlAs/InGaAs MHEMTs are fabricated by MBE epitaxial material and EBL （electron beam lithography） technology. Ti/Pt/Au is evaporated to form gate metals. A T-shaped gate is produced using a novel PMMA/PMGI/PMMA trilayer resist structure to decrease parasitic capacitance and parasitic resistance of the gate. Excellent DC and RF performances are obtained and the transconductance （gm） ,maximum saturation drain current density （Joss）, threshold voltage （ VT）, current cut-off frequency （fT） , and maximum oscillation frequency （fmax） of InAlAs/ InGaAs MHEMTs are 510mS/mm,605mA/mm, -1.8V, 110GHz, and 72GHz, respectively.
文摘提出了一种晶体管器件模型修正方法,校准了Ommic公司D007IH工艺中D波段晶体管模型和D波段共面波导传输线电路模型。该校准方法中通过与共面波导(CPW)三维模型仿真结果的曲线拟合,确定了D波段传输线电路模型的介电常数;通过与CGY2191UH芯片的S参数测试结果拟合,修正了晶体管器件模型。为了验证了设计方法的有效性,基于修正模型设计了一款低噪声放大器芯片,仿真结果表明,工作频率为110 GHz^170 GHz,增益大于29 d B,噪声系数小于6 d B。
