Vertical GaN power MOSFET is a novel technology that offers great potential for power switching applications.Being still in an early development phase,vertical GaN devices are yet to be fully optimized and require car...Vertical GaN power MOSFET is a novel technology that offers great potential for power switching applications.Being still in an early development phase,vertical GaN devices are yet to be fully optimized and require careful studies to foster their development.In this work,we report on the physical insights into device performance improvements obtained during the development of vertical GaN-on-Si trench MOSFETs(TMOS’s)provided by TCAD simulations,enhancing the dependability of the adopted process optimization approaches.Specifically,two different TMOS devices are compared in terms of transfer-curve hysteresis(H)and subthreshold slope(SS),showing a≈75%H reduction along with a≈30%SS decrease.Simulations allow attributing the achieved improvements to a decrease in the border and interface traps,respectively.A sensitivity analysis is also carried out,allowing to quantify the additional trap density reduction required to minimize both figures of merit.展开更多
随着栅极长度、硅膜厚度以及埋氧层厚度的减小,MOS器件短沟道效应变得越来越严峻。本文首先给出了决定全耗尽绝缘体上硅短沟道效应的三种机制;然后从接地层、埋层工程、沟道工程、源漏工程、侧墙工程和栅工程等六种工程技术方面讨论了...随着栅极长度、硅膜厚度以及埋氧层厚度的减小,MOS器件短沟道效应变得越来越严峻。本文首先给出了决定全耗尽绝缘体上硅短沟道效应的三种机制;然后从接地层、埋层工程、沟道工程、源漏工程、侧墙工程和栅工程等六种工程技术方面讨论了为抑制短沟道效应而引入的不同UTBB SOI MOSFETs结构,分析了这些结构能够有效抑制短沟道效应(如漏致势垒降低、亚阈值摆幅、关态泄露电流、开态电流等)的机理;而后基于这六种技术,对近年来在UTBB SOI MOSFETs短沟道效应抑制方面所做的工作进行了总结;最后对未来技术的发展进行了展望。展开更多
Dynamic self-heating effect(SHE)of silicon-on-insulator(SOI)MOSFET is comprehensively evaluated by ultrafast pulsed I-V measurement in this work.It is found for the first time that the SHE complete heating response an...Dynamic self-heating effect(SHE)of silicon-on-insulator(SOI)MOSFET is comprehensively evaluated by ultrafast pulsed I-V measurement in this work.It is found for the first time that the SHE complete heating response and cooling response of SOI MOSFETs are conjugated,with two-stage curves shown.We establish the effective thermal transient response model with stage superposition corresponding to the heating process.The systematic study of SHE dependence on workload shows that frequency and duty cycle have more significant effect on SHE in first-stage heating process than in the second stage.In the first-stage heating process,the peak lattice temperature and current oscillation amplitude decrease by more than 25 K and 4%with frequency increasing to 10 MHz,and when duty cycle is reduced to 25%,the peak lattice temperature drops to 306 K and current oscillation amplitude decreases to 0.77%.Finally,the investigation of two-stage(heating and cooling)process provides a guideline for the unified optimization of dynamic SHE in terms of workload.As the operating frequency is raised to GHz,the peak temperature depends on duty cycle,and self-heating oscillation is completely suppressed.展开更多
Lateral type n-channel 4H-SiC metal–oxide–semiconductor field effect transistors(MOSFETs),fabricated using a current industrial process,are irradiated with gamma rays at different irradiation doses in this paper to ...Lateral type n-channel 4H-SiC metal–oxide–semiconductor field effect transistors(MOSFETs),fabricated using a current industrial process,are irradiated with gamma rays at different irradiation doses in this paper to carry out a profound study on the generation mechanism of radiation-induced interface traps and oxide trapped charges.Electrical parameters(e.g.,threshold voltage,subthreshold swing and channel mobility)of the device before and after irradiation are investigated,and the influence of the channel orientation([1100]and[1120])on the radiation effect is discussed for the first time.A positive threshold voltage shift is observed at very low irradiation doses(<100 krad(Si));the threshold voltage then shifts negatively as the dose increases.It is found that the dependence of interface trap generation on the radiation dose is not the same for doses below and above 100 krad.For irradiation doses<100 krad,the radiation-induced interface traps with relatively high generation speeds dominate the competition with radiation-induced oxide trapped charges,contributing to the positive threshold voltage shift correspondingly.All these results provide additional insight into the radiation-induced charge trapping mechanism in the SiO_(2)/SiC interface.展开更多
The synergistic effect of total ionizing dose(TID) and single event gate rupture(SEGR) in SiC power metal–oxide–semiconductor field effect transistors(MOSFETs) is investigated via simulation. The device is found to ...The synergistic effect of total ionizing dose(TID) and single event gate rupture(SEGR) in SiC power metal–oxide–semiconductor field effect transistors(MOSFETs) is investigated via simulation. The device is found to be more sensitive to SEGR with TID increasing, especially at higher temperature. The microscopic mechanism is revealed to be the increased trapped charges induced by TID and subsequent enhancement of electric field intensity inside the oxide layer.展开更多
On the basis of a detailed discussion of the development of total ionizing dose （TID） effect model, a new commercial-model-independent TID modeling approach for partially depleted silicon-on-insulator metal-oxide- s...On the basis of a detailed discussion of the development of total ionizing dose （TID） effect model, a new commercial-model-independent TID modeling approach for partially depleted silicon-on-insulator metal-oxide- semiconductor field effect transistors is developed. An exponential approximation is proposed to simplify the trap charge calculation. Irradiation experiments with 60Co gamma rays for IO and core devices are performed to validate the simulation results. An excellent agreement of measurement with the simulation results is observed.展开更多
Recent developments in the use of diamond materials as metal-oxide-semiconductor field-effect transistors (MOSFETs) are in- troduced in this article, including an analysis of the advantages of the device owing to the ...Recent developments in the use of diamond materials as metal-oxide-semiconductor field-effect transistors (MOSFETs) are in- troduced in this article, including an analysis of the advantages of the device owing to the unique physical properties of diamond materials, such as their high-temperature and negative electron affinity characteristics. Recent research progress by domestic and international research groups on performance improvement of hydrogen-terminated and oxygen-terminated diamond-based MOSFETs is also summarized. Currently, preparation of large-scale diamond epitaxial layers is still relatively difficult, and improvements and innovations in the device structure are still ongoing. However, the key to improving the performance of diamond-based MOSFET devices lies in improving the mobility of channel carriers. This mainly includes improvements in doping technologies and reductions in interface state density or carrier traps. These will be vital research goals for the future of diamond-based MOSFETs.展开更多
Based on the exact resultant solution of two-dimensional Poisson＇s equation in strained Si and Si1-xCex layer, a simple and accurate two-dimensional.analytical model including surface channel potential, surface chann...Based on the exact resultant solution of two-dimensional Poisson＇s equation in strained Si and Si1-xCex layer, a simple and accurate two-dimensional.analytical model including surface channel potential, surface channel electric field, threshold voltage and subthreshold swing for fully depleted gate stack strained Si on silicon-germanium-on-insulator （SGOI） MOSFETs has been developed. The results show that this novel structure can suppress the short channel effects （SCE）, the drain-induced barrier-lowering （DIBL） and improve the subthreshold performance in nanoelectronics application. The model is verified by numerical simulation. The model provides the basic designing guidance of gate stack strained Si on SGOI MOSFETs.展开更多
A continuous yet analytic channel potential solution is proposed for doped symmetric double-gate （DG） MOSFETs from the accumulation to the strong-inversion region. Analytical channel potential relationship is derive...A continuous yet analytic channel potential solution is proposed for doped symmetric double-gate （DG） MOSFETs from the accumulation to the strong-inversion region. Analytical channel potential relationship is derived from the complete 1-D Poisson equation physically, and the channel potential solution of the DG MOSFET is obtained analytically. The extensive comparisons between the presented solution and the numerical simulation illustrate that the solution is not only accurate and continuous in the whole operation regime of DG MOSFETs, but also valid to wide doping concentration and various geometrical sizes, without employing any fitting parameter.展开更多
基金funding from the Electronic Component Systems for European Leadership Joint Undertaking (ECSEL JU),under grant agreement No.101007229support from the European Union’s Horizon 2020 Research and Innovation Programme,Germany,France,Belgium,Austria,Sweden,Spain,and Italy
文摘Vertical GaN power MOSFET is a novel technology that offers great potential for power switching applications.Being still in an early development phase,vertical GaN devices are yet to be fully optimized and require careful studies to foster their development.In this work,we report on the physical insights into device performance improvements obtained during the development of vertical GaN-on-Si trench MOSFETs(TMOS’s)provided by TCAD simulations,enhancing the dependability of the adopted process optimization approaches.Specifically,two different TMOS devices are compared in terms of transfer-curve hysteresis(H)and subthreshold slope(SS),showing a≈75%H reduction along with a≈30%SS decrease.Simulations allow attributing the achieved improvements to a decrease in the border and interface traps,respectively.A sensitivity analysis is also carried out,allowing to quantify the additional trap density reduction required to minimize both figures of merit.
文摘随着栅极长度、硅膜厚度以及埋氧层厚度的减小,MOS器件短沟道效应变得越来越严峻。本文首先给出了决定全耗尽绝缘体上硅短沟道效应的三种机制;然后从接地层、埋层工程、沟道工程、源漏工程、侧墙工程和栅工程等六种工程技术方面讨论了为抑制短沟道效应而引入的不同UTBB SOI MOSFETs结构,分析了这些结构能够有效抑制短沟道效应(如漏致势垒降低、亚阈值摆幅、关态泄露电流、开态电流等)的机理;而后基于这六种技术,对近年来在UTBB SOI MOSFETs短沟道效应抑制方面所做的工作进行了总结;最后对未来技术的发展进行了展望。
文摘Dynamic self-heating effect(SHE)of silicon-on-insulator(SOI)MOSFET is comprehensively evaluated by ultrafast pulsed I-V measurement in this work.It is found for the first time that the SHE complete heating response and cooling response of SOI MOSFETs are conjugated,with two-stage curves shown.We establish the effective thermal transient response model with stage superposition corresponding to the heating process.The systematic study of SHE dependence on workload shows that frequency and duty cycle have more significant effect on SHE in first-stage heating process than in the second stage.In the first-stage heating process,the peak lattice temperature and current oscillation amplitude decrease by more than 25 K and 4%with frequency increasing to 10 MHz,and when duty cycle is reduced to 25%,the peak lattice temperature drops to 306 K and current oscillation amplitude decreases to 0.77%.Finally,the investigation of two-stage(heating and cooling)process provides a guideline for the unified optimization of dynamic SHE in terms of workload.As the operating frequency is raised to GHz,the peak temperature depends on duty cycle,and self-heating oscillation is completely suppressed.
基金the National Natural Science Foundation of China(Grant Nos.52107190 and 62101181)China Postdoctoral Science Foundation(Grant No.2021M700203)。
文摘Lateral type n-channel 4H-SiC metal–oxide–semiconductor field effect transistors(MOSFETs),fabricated using a current industrial process,are irradiated with gamma rays at different irradiation doses in this paper to carry out a profound study on the generation mechanism of radiation-induced interface traps and oxide trapped charges.Electrical parameters(e.g.,threshold voltage,subthreshold swing and channel mobility)of the device before and after irradiation are investigated,and the influence of the channel orientation([1100]and[1120])on the radiation effect is discussed for the first time.A positive threshold voltage shift is observed at very low irradiation doses(<100 krad(Si));the threshold voltage then shifts negatively as the dose increases.It is found that the dependence of interface trap generation on the radiation dose is not the same for doses below and above 100 krad.For irradiation doses<100 krad,the radiation-induced interface traps with relatively high generation speeds dominate the competition with radiation-induced oxide trapped charges,contributing to the positive threshold voltage shift correspondingly.All these results provide additional insight into the radiation-induced charge trapping mechanism in the SiO_(2)/SiC interface.
基金Project supported by the National Natural Science Foundation of China(Grant No.12004329)Open Project of State Key Laboratory of Intense Pulsed Radiation Simulation and Effect(Grant No.SKLIPR2115)+1 种基金Postgraduate Research and Practice Innovation Program of Jiangsu Province(Grant No.SJCX22_1704)Innovative Science and Technology Platform Project of Cooperation between Yangzhou City and Yangzhou University,China(Grant Nos.YZ202026301 and YZ202026306)。
文摘The synergistic effect of total ionizing dose(TID) and single event gate rupture(SEGR) in SiC power metal–oxide–semiconductor field effect transistors(MOSFETs) is investigated via simulation. The device is found to be more sensitive to SEGR with TID increasing, especially at higher temperature. The microscopic mechanism is revealed to be the increased trapped charges induced by TID and subsequent enhancement of electric field intensity inside the oxide layer.
基金Supported by the National Natural Science Foundation of China(No.60576066,No.60644007)the Natural Science Foundation of Anhui Province(No.2006kj012a).
基金Project supported by Key Project of National Natural Science Foundation of China（50531060） National Science Found for Distinguished Young Scholars of China（10525211）+2 种基金 National Natural Science Foundation of China（10572124 10472099） Key Project of Scientific and Technological Department of Hunan Province （05FJ2005）, and the Open Project Program of Low Dimensional Materials ＆ Application Technology （Xiangtan University）, Ministry of Education, China （KF0602）.
基金Supported by the National Natural Science Foundation of China under Grant Nos 61404151 and 61574153
文摘On the basis of a detailed discussion of the development of total ionizing dose （TID） effect model, a new commercial-model-independent TID modeling approach for partially depleted silicon-on-insulator metal-oxide- semiconductor field effect transistors is developed. An exponential approximation is proposed to simplify the trap charge calculation. Irradiation experiments with 60Co gamma rays for IO and core devices are performed to validate the simulation results. An excellent agreement of measurement with the simulation results is observed.
基金financially supported by the National Key Research and Development Program of China (No.2018YFB0406501)the Beijing Municipal Science and Technology Commission (No. Z181100004418009)the National Natural Science Foundation of China (No.51702313)
文摘Recent developments in the use of diamond materials as metal-oxide-semiconductor field-effect transistors (MOSFETs) are in- troduced in this article, including an analysis of the advantages of the device owing to the unique physical properties of diamond materials, such as their high-temperature and negative electron affinity characteristics. Recent research progress by domestic and international research groups on performance improvement of hydrogen-terminated and oxygen-terminated diamond-based MOSFETs is also summarized. Currently, preparation of large-scale diamond epitaxial layers is still relatively difficult, and improvements and innovations in the device structure are still ongoing. However, the key to improving the performance of diamond-based MOSFET devices lies in improving the mobility of channel carriers. This mainly includes improvements in doping technologies and reductions in interface state density or carrier traps. These will be vital research goals for the future of diamond-based MOSFETs.
基金Project supported by the National Natural Science Foundation of China (Grant Nos. 60976068 and 60936005)the Cultivation Fund of the Key Scientific and Technical Innovation Project, Ministry of Education of China (Grant No. 708083)the Specialized Research Fund for the Doctoral Program of Higher Education of China (Grant No. 200807010010)
文摘Based on the exact resultant solution of two-dimensional Poisson＇s equation in strained Si and Si1-xCex layer, a simple and accurate two-dimensional.analytical model including surface channel potential, surface channel electric field, threshold voltage and subthreshold swing for fully depleted gate stack strained Si on silicon-germanium-on-insulator （SGOI） MOSFETs has been developed. The results show that this novel structure can suppress the short channel effects （SCE）, the drain-induced barrier-lowering （DIBL） and improve the subthreshold performance in nanoelectronics application. The model is verified by numerical simulation. The model provides the basic designing guidance of gate stack strained Si on SGOI MOSFETs.
基金Project supported by the National Natural Science Foundation of China(Grant No.60876027)the Open Funds of Jiangsu Province Key Lab of ASIC Design(JSICK1007)
文摘A continuous yet analytic channel potential solution is proposed for doped symmetric double-gate （DG） MOSFETs from the accumulation to the strong-inversion region. Analytical channel potential relationship is derived from the complete 1-D Poisson equation physically, and the channel potential solution of the DG MOSFET is obtained analytically. The extensive comparisons between the presented solution and the numerical simulation illustrate that the solution is not only accurate and continuous in the whole operation regime of DG MOSFETs, but also valid to wide doping concentration and various geometrical sizes, without employing any fitting parameter.
