In this study,the deformation and stress distribution of printed circuit board(PCB)with different thickness and composite materials under a shock loading were analyzed by the finite element analysis.The standard 8-lay...In this study,the deformation and stress distribution of printed circuit board(PCB)with different thickness and composite materials under a shock loading were analyzed by the finite element analysis.The standard 8-layer PCB subjected to a shock loading 1500 g was evaluated first.Moreover,the finite element models of the PCB with different thickness by stacking various number of layers were discussed.In addition to changing thickness,the core material of PCB was replaced from woven E-glass/epoxy to woven carbon fiber/epoxy for structural enhancement.The non-linear material property of copper foil was considered in the analysis.The results indicated that a thicker PCB has lower stress in the copper foil in PCBs under the shock loading.The stress difference between the thicker PCB(2.6 mm)and thinner PCB(0.6 mm)is around 5%.Using woven carbon fiber/epoxy as core material could lower the stress of copper foil around 6.6%under the shock loading 1500 g for the PCB with 0.6 mm thickness.On the other hand,the stress level is under the failure strength of PCBs with carbon fiber/epoxy core layers and thickness 2.6 mm when the peak acceleration changes from 1500 g to 5000 g.This study could provide a reference for the design and proper applications of the PCB with different thickness and composite materials.展开更多
The quality of printed circuit board(PCB)micro-hole processing directly determines the stability of the inner and outer circuit connections.Micro-hole drilling technology is a typical method for PCB micro-hole process...The quality of printed circuit board(PCB)micro-hole processing directly determines the stability of the inner and outer circuit connections.Micro-hole drilling technology is a typical method for PCB micro-hole processing.The problem of optimal control of its drilling force is one of the main factors affecting the quality of micro-hole machining.To address this problem,the thrust forces and torques in PCB drilling were first modeled and analyzed,and the corresponding prediction models were established.The drilling force analysis was carried out through the micro-hole drilling experiment,the specific cutting energy under different feed rates was calculated,the influence of the size effect was clarified,and the accuracy of the prediction model was verified.The result shows that during the drilling of glass fiber cloth,changes in the material removal mechanism are induced as the feed per revolution is varied.When the feed per revolution is less than the tool edge radius,the glass fiber is not cut by the main cutting edge,but is crushed and broken.When the feed per revolution is greater than the radius of the tool edge,the glass fiber is cut by the main cutting edge.At the same time,the established analytical model can accurately reflect the influence of the size effect on the drilling torque in PCB micro-hole drilling,and the error is within 10%.This method has certain practical application value in controlling PCB micro hole processing quality.展开更多
基金the support from Ministry of Science and Technology,Taiwan,R.O.C.,through grant MOST-105-2221-E-007-031-MY3.
文摘In this study,the deformation and stress distribution of printed circuit board(PCB)with different thickness and composite materials under a shock loading were analyzed by the finite element analysis.The standard 8-layer PCB subjected to a shock loading 1500 g was evaluated first.Moreover,the finite element models of the PCB with different thickness by stacking various number of layers were discussed.In addition to changing thickness,the core material of PCB was replaced from woven E-glass/epoxy to woven carbon fiber/epoxy for structural enhancement.The non-linear material property of copper foil was considered in the analysis.The results indicated that a thicker PCB has lower stress in the copper foil in PCBs under the shock loading.The stress difference between the thicker PCB(2.6 mm)and thinner PCB(0.6 mm)is around 5%.Using woven carbon fiber/epoxy as core material could lower the stress of copper foil around 6.6%under the shock loading 1500 g for the PCB with 0.6 mm thickness.On the other hand,the stress level is under the failure strength of PCBs with carbon fiber/epoxy core layers and thickness 2.6 mm when the peak acceleration changes from 1500 g to 5000 g.This study could provide a reference for the design and proper applications of the PCB with different thickness and composite materials.
基金National Natural Science Foundation of China(No.51805079)Fundamental Research Funds for the Central Universities,China(No.2232021D-15)Shanghai Science and Technology Program(No.20DZ2251400)。
文摘The quality of printed circuit board(PCB)micro-hole processing directly determines the stability of the inner and outer circuit connections.Micro-hole drilling technology is a typical method for PCB micro-hole processing.The problem of optimal control of its drilling force is one of the main factors affecting the quality of micro-hole machining.To address this problem,the thrust forces and torques in PCB drilling were first modeled and analyzed,and the corresponding prediction models were established.The drilling force analysis was carried out through the micro-hole drilling experiment,the specific cutting energy under different feed rates was calculated,the influence of the size effect was clarified,and the accuracy of the prediction model was verified.The result shows that during the drilling of glass fiber cloth,changes in the material removal mechanism are induced as the feed per revolution is varied.When the feed per revolution is less than the tool edge radius,the glass fiber is not cut by the main cutting edge,but is crushed and broken.When the feed per revolution is greater than the radius of the tool edge,the glass fiber is cut by the main cutting edge.At the same time,the established analytical model can accurately reflect the influence of the size effect on the drilling torque in PCB micro-hole drilling,and the error is within 10%.This method has certain practical application value in controlling PCB micro hole processing quality.
