GaN/metal/Si heterostructure fabricated by metal bonding and laser lift-off

A process methodology has been adopted to transfer GaN thin films grown on sapphire substrates to Si substrates using metal bonding and laser lift-off techniques. After bonding, a single KrF （248 nm） excimer laser pulse was directed through the transparent sapphire substrates followed by low-temperature heat treatment to remove the substrates. The influence of bonding temperature and energy density of the excimer laser on the structure and optical properties of GaN films were investigated systemically. Atomic force microscopy, X-ray diffraction and photoluminescence measurements showed that （1） the quality of the GaN film was higher at a lower bonding temperature and lower energy density; （2） the threshold of the energy density of the excimer laser lift-off GaN was 300 mJ/cm^2. The root-mean-square roughness of the transferred GaN surface was about 50 nm at a bonding temperature of 400 ℃.

Atomically Precise Insights into Metal–Metal Bonds Using Comparable Endo-Units of Sc_(2) and Sc_(2)C_(2)

The precise identification of metal-metal bonds is critical to fully understanding the nature of metal-metal bonding but remains a fundamental challenge.Herein,we show the essence of Sc-Sc bonds with a metal-metal distance of 3.36 Å in a C_(3v)(8)-C_(82) fullerene cage using crystallography.

Metal-ceramic Bond Mechanism of the Co-Cr Alloy Denture with Original Rough Surface Produced by Selective Laser Melting

The porcelain fracture caused by low metal-ceramic bond strength is a critical issue in porcelain fused to metal（PFM） restorations. Surface roughening methods, such as sand blasting, acid etching and alkaline degreasing for the metal matrix are used to increase bond strength. However, the metal matrix of PFM processed by selective laser melting（SLM） has natural rough surface. To explore the effect of the original roughness on metal-ceramic bond strength, two groups of specimen are fabricated by SLM. One group of specimen surface is polished smooth while another group remains the original rough surface. The dental porcelain is fused to the specimens＇ surfaces according to the ISO 9693：1999 standard. To gain the bond strength, a three-point bending test is carried out and X ray energy spectrum analysis（EDS）, scanning electron microscope（SEM） are used to show fracture mode. The results show that the mean bond strength is 116.5 16 MPa of the group with rough surface（Ra= 17.2）, and the fracture mode is cohesive. However, when the surface is smooth （Ra =3.8）, the mean bond strength is 74.5 MPa _＋ 5 MPa and the fracture mode is mixed. The original surface with prominent structures formed by the partly melted powder particles, not only increases surface roughness but also significantly improves the bond strength by forming strong mechanical lock effect. Statistical analysis （Student＇s t-test） demonstrates a significant difference （p〈0.05） of the mean value of bond strength between the two groups. The experiments indicate the natural rough surface can enhance the metal-ceramic bond strength to over four times the minimum value （25 MPa） of the ISO 9693：1999 standard. It is found that the natural rough surface of SLM-made PFM can eliminate the porcelain collapse defect produced by traditional casting method in PFM restorations.

Electro-Discharge Fine Truing of Metal-Bonded Fine-Grain Diamond Wheel Based on Real-Time Monitoring

A data acquisition system based on LabVIEW is designed and implemented, and electro-discharge(ED) fine truing of metal-bonded fine-grain diamond wheel based on real-time monitoring is researched. Real-time monitoring not only makes efficient impulse specification of ED truing easily obtained, but also is good for timely identifying no-load, avoiding short circuit and arc discharge phenomena and then for obtaining normal machining state. ED fine truing of the fine-grain wheel includes two steps: rough truing for high efficiency and fine truing for high precision. Final ED truing precision and efficiency not only depend on electric process specification, but also is concerned with electrode shape, insulated performance of operating fluid and vertical feed quantity value and frequency. Experiments indicate that ED fine truing based on real-time monitoring can improve the truing precision and efficiency. Average machining efficiency of W10 wheel is about 0.95 μm/min; the final run-out by ED truing is less than 2 μm.

JOINING MECHANISM OF FIELD-ASSISTED BONDING OF ELECTROLYTE GLASS TO METALS

Investigations of technological characteristics and bonding mechanism of field-assisted bonding are done, which are for bonding of electrolytes (Pyrex glass) to monocrystal silicon and aluminum. The features of microstructure and the distribution of the diffused elements in the bonding interface area are studied by means of SEM, EDX and XRD, and the influence of the technological factors on the bonding process is also studied. The model of 'metal-oxides-glass' of bonding structure and ions diffusion and bonding in the condition of electrical field-assisted are indicated.

Synthesis of Novel Polymer-Bonded Water-Soluble Metal Porphyrins

The reaction of 5, 10, 15, 20-tetra-(4-pyridyl) porphyrin 1 with triruthenium dodecacarbonyl [Ru3(CO)12], zinc(II) acetate, copper(II) acetate, cobalt(II) acetate afforded complexes 2a?2d respectively. Treatment of 2a?2d with Merrifield’s peptide resin obtained 3a?3d. The compounds 3a?3d reacted with methyl iodide respectively gave 4a?4d. New complexes 4a?4d have been identified by IR, UV-visible spectra, and AES.

Formation process, microstructure and mechanical property of transient liquid phase bonded aluminium-based metal matrix composite joint

The formation process, microstructure and mechanical properties of transient liquid phase (TLP) bonded aluminium based metal matrix composite (MMC) joint with copper interlayer were investigated. The formation process of the TLP joint comprises a number of stages: plastic deformation and solid diffusion (stage 1), dissolution of interlayer and base metal (stage 2), isothermal solidification (stage 3) and homogenization (stage 4). The microstructure of the joint depends on the joint formation process (distinct stages). The plastic deformation and solid diffusion in stage 1 favoure the intimate contact at interfaces and liquid layer formation. The microstructure of joint consists of aluminium solid solution, alumina particle, Al 2Cu and MgAl 2O 4 compounds in stage 2. The most pronounced feature of joint microstructure in stage 3 is the alumina particle segregation in the center of the joint. The increase of joint shear strength with increasing bonding temperature is mainly attributed to improving the fluidity and wettability of liquid phase and decreasing the amount of Al 2Cu brittle phase in the joint. The principal reason of higher bonding temperature (>600 ℃) resulting in lowering obviously the joint shear strength is the widening of alumina particle segregation region that acts as a preferential site for failure. The increase of joint shear strength with increasing holding time is mainly associated with decreasing the amount of Al 2Cu brittle phase and promoting homogenization of joint.

Microstructure and strength of TiAl/40Cr joint diffusion bonded with vanadium-copper filler metal

Intermetallics TiAl was diffusion-bonded to steel 40Cr in vacuum furnace with interlayer V/Cu. The results show that infinite sosoloid that made for bond performance is formed at the interface of V/Cu and Cu/40Cr, and three acting layers are formed at the interface of TiAl/V including Ti 3Al layer at TiAl side, intermittent V 5Al 8 layer in the middle and Ti-V sosoloid at V side. Fragile reactors V 5Al 8 arising at the interface lead to bad performance of joints, and the strength of the joint is 200 MPa, while it was still higher than the strength of the joint intermetallics TiAl to 40Cr steel diffusion-bonded directly. Intermetallic TiAl and 40Cr steel are diffusion-bonded successfully by using a composite isolation layer V/Cu.

Features of microstructure and fracture in the transient liquid phase bonded aluminium-based metal matrix composite joints

Transient liquid phase (TLP) bonded aluminium based metal matrix composite (MMC) joints can be classified into three distinct regions, i.e. the particulate segregation region, the denuded particulate region and the base material region. The microstructure of the particulate segregation region consists of alumina particulate and Al alloy matrix with the Al 2Cu and MgAl 2O 4. It contains more and smaller alumina particulates compared with the base material region. The TLP bonded joints have the tensile strength of 150 MPa ～200 MPa and the shear strength of 70 MPa ～100 MPa . With increasing tensile stress, cracks initiate in the particulate segregation region, especially in the particulate/particulate interface and the particulate/matrix interface, and propagate along particulate/matrix interface, througth thin matrix metal and by linking up the close cracks. The particulate segregation region is the weakest during tensile testing and shear testing due to obviously increased proportion of weak bonds (particulate particulate bond and particulate matrix bond).

AROMATIC BOND INCLUDING METALLIC ATOM IN COORDINATE COMPOUNDS AND SOME OF ITS PROPERTIES

Aromatic bond including metallic atom (Ni) is investigated by EHMO calculation.The NMR spectra and the mechanism for hydrolysis are discussed on the ground of results of computation.

FEM simulation on residual stress distribution during diffusion bonding between Ti （ C, N） metallic ceramic/interlayer/40Cr steel

Based on ANSYS FEM software, the distribution of residual stress in the diffusion bonding joints between Ti（ C,N） metallic ceramic/interlayer/4OCr steel was calculated and experimentally ver^ed. The results showed that the trend on the distribution of residual stress field in the joints was not changed with the use of interlayer. The maximum residual stress was always located in metallic ceramic with area ranging from 1 mm to 4 mm to the interlayer. The maximum residual stress in the joints was also affected by diffusion temperature. The satellite pulse current during the initial stage on diffusion bonding can promote the formation of liquid film at the interface, by which diffusion temperature and loading pressure can be greatly decreased. The crack initiation was easily produced at the corner of Ti （ C, N） metallic ceramic close to the interlayer. If a higher residual stress produced in the joints, the crack was propagated into the whole ceramic.

EFEECT OF METALLIC CATIONS ON Si-O BONDS IN SILICATES

The effect of metallic cations on the Si-O(br) bond and the Si-O(ter) bond was studied with CNDO/2 MO calculations. The characteristics of them were discussed, which were found to vary with the bonding and coordi nation situation of oxygen as well as the effect of metallic cations on oxygen. The conclusions obtained may be well used in the fields of mineralogy, geochemistry, silicate materials, pyrometallurgy and so on.

Synthesis,Structure and Bonding Feature of New Metallic Zintl Phases RE_3Cu_3Sb_4(RE= Nd ,Sm ,Tb , Dy , Ho)

RE 3Cu 3Sb 4(RE=Nd, Sm, Tb, Dy, Ho) was synthesized by arc melting method and their crystal structures were characterized by powder X ray method. The compounds crystallize in cubic system, Y 3Au 3Sb 4 type, space group I43d (No.220), Pearson code cI40. The unit cell parameters are: Nd 3Cu 3Sb 4: a =0 96749(1) nm, V =0 90561(3) nm 3; Sm 3Cu 3Sb 4: a =0 96145(1) nm, V =0 88875(3) nm 3; Tb 3Cu 3Sb 4: a =0 95362(1) nm, V =0 86721(3) nm 3; Dy 3Cu 3Sb 4: a =0 95088(1) nm, V =0 85975(3) nm 3; Ho 3Cu 3Sb 4: a =0 9488(2) nm, V =0 8541(5) nm 3; Z =4. The structures are characterized by covalent bonded Cu Sb tetrahedra which form three dimensional networks by sharing corners. The rare earth atoms are distributed in the cages. The formula with the charge balance can be written as RE 3+ 3Cu 1+ 3Sb 3- 4 which are metallic Zintl phases having the weak metallic conductivity. The bonds have typical transitional features. General atomic coordination environment rules are followed. The unit cell parameters show the lanthanide contraction.

The molecular orbital investigation of the metal triply bonded compounds M＿2X＿2（NMe＿2）＿4

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Transient liquid phase bonding of TiC particulate reinforced magnesium metal matrix composite (TiC_p/AZ91D)

Microstructures and mechanical properties of transient liquid phase （TLP） bonded magnesium metal matrix composite （ MMC） joints using copper interlayer have been investigated. With an increase of bonding times from 5 min to 50 min at bonding temperature of 510 ℃ , the average concentration of copper in the bonded zone decreased, the microstructure in the zone changed from Cu, α-Mg and CuMg2 to α-Mg, CuMg2 and TiC, and mechanical properties of the joint increased. The shear strength of the joint bonded at 510 ℃ for 50 min reached 64 MPa due to the metallurgical bonding of the joint and improving its homogeneity of composition and microstructure. It is favorable to increase the bonding time for improving mechanical properties of TLP bonded magnesium MMC joint.

Joining mechanism of field-assisted diffusion bonding of solid electrolyte ceramic to metals

Field assisted diffusion bonding applied in the joining of solid electrolyte borosilicate glass, β ″ Al 2O 3, Y 2O ZrO 2 to monocrystal silicate and aluminum were proceeded with bonding machine in the assistance of static electric field. TEM, SEM, XRD and other means were applied to investigate and analyze microstructure of interface. It is supposed that the interfacial area is a model of metal oxides ceramic, and the joining mechanism is solid diffusion joining and static electric bonding. The process of ions migration and accumulation under electric field is the most essential factor for the anodic oxidation and interfacial joining. Temperature and voltage are the basic factors of the solid diffusion bonding of interfacial oxidation. And voltage, temperature, pressure and the condition of surface are the most important factors that govern the bonding process.

Synthesis of Polymer-Bonded Quaternary Ammonium Type Metal Porphyrins

The reaction of pyrrole with 4-hydroxybenzaldehyde and 4-pyridinecarboxaldehyde afforded new porphyrin ligand 1. Treatment of 1 with copper( II ) acetate, cobalt ( II ) acetate gave complexes 2-3 respectively. 2 and 3 reacted with Merrifield's peptide resin produced 4 and 5. Complexes 4 and 5 reacted with methyl iodide respectively gave 6-7. The new compounds 1-7 have been identified by H-1 NMR, IR, MS and UV-visible spectra, elemental analysis and AES.

Study of diffusion bonding of Ti-6Al-4V and ZQSn10-10 with metal interlayer

The diffusion bonding was carried out to join Ti alloy （Ti-6Al-4V） and tin-bronze （ ZQSn10-10 ） with Ni and Ni ＋ Cu interlayer. The microstructures of the diffusion bonded joints were analyzed by scanning electron microscope （SEM）, energy dispersive spectroscopy （ EDS ） and X-ray diffraction （ XRD ）. The results show that when the interlayer is Ni or Ni ＋ Cu transition metals both could effectively prevent the diffusion between Ti and Cu and avoid the formation of the Cu-Ti intermetallic compounds （Cu3Ti, CuTi etc. ）. But the Ni-Ti intermetallic compounds （NiTi, Ni3Ti） are formed on the Ti-6Al-4V/Ni interface. When the interlayer is Ni, the optimum bonding parameters are 830 ℃/10 MPa/30 min. And when the interlayer is Ni ＋ Cu, the optimum bonding parameters are 850 ℃/10 MPa/20 min. With the optimum bonding parameters, the tensile strength of the joints with Ni and Ni ＋ Cu interlayer both are 155.8 MPa, which is 65 percent of the strength of ZQSn10-10 base metal.

CN bond orientation in metal carbonitride endofullerenes：A density functional theory study

The geometric and electronic structures of scandium carbonitride endofullerene Sc3CN@C2n （2n=68, 78, 80, 82, and 84） and Sc（Y）NC@C76 have been systematically investigated to identify the preferred position of internal C and N atoms by density functional theory （DFT） calculations combined with statistical mechanics treatments. The CN bond orientation can generally be inferred from the molecule stability and electronic configuration. It is found that Sc3CN@C2n molecules have the most stable structure with C atom locating at the center of Sc3CN cluster. The CN bond has trivalent form of[CN]3- and connects with adjacent three Sc atoms tightly. However, in Sc（Y）NC@C76 with[NC]-, the N atom always resides in the center of the whole molecule. In addition, the stability of Sc3CN@C2n has been further compared in terms of the organization of the corresponding molecular energy level. The structural differences between Sc3CN@C2n and Sc3NC@C2n are highlighted by their respected infrared spectra.