A 700 V triple RESURF nLDMOS with a low specific on-resistance of 100 mΩ.cm^2 is designed. Compared with a conventional double RESURF nLDMOS whose P-type layer is located on the surface of the drift region, the P-typ...A 700 V triple RESURF nLDMOS with a low specific on-resistance of 100 mΩ.cm^2 is designed. Compared with a conventional double RESURF nLDMOS whose P-type layer is located on the surface of the drift region, the P-type layer of a triple RESURF nLDMOS is located within it. The difference between the locations of the P-type layer means that a triple RESURF nLDMOS has about a 30% lower specific on-resistance at the same given breakdown voltage of 700 V. Detailed research of the influences of various parameters on breakdown voltage, specific on-resistance, as well as process tolerance is involved. The results may provide guiding principles for the design of triple RESURF nLDMOS.展开更多
Degradation behaviors of 20 V NLDMOS operated under off-state avalanche breakdown conditions are presented.A constant current pulse stressing test is applied to the device.Two different degradation mechanisms are iden...Degradation behaviors of 20 V NLDMOS operated under off-state avalanche breakdown conditions are presented.A constant current pulse stressing test is applied to the device.Two different degradation mechanisms are identified by analysis of electrical data,technology computer-aided design（TCAD） simulations and charge pumping measurements.The first mechanism is attributed to positive oxide-trapped charges in the N-type drift region,and the second one is due to decreased electron mobility upon interface state formation in the drift region.Both of the mechanisms are enhanced with increasing avalanche breakdown current.展开更多
提出一种600 V N型双栅LDMOS新器件结构,能够减小总剂量(TID)辐照导致的阈值电压漂移。与常规600 V NLDMOS相比,所提出的双栅由厚栅和薄栅构成,其中薄栅位于p阱的N+有源区上方,厚栅为原器件结构的栅,在受到TID辐照时,薄栅结构可以抑制...提出一种600 V N型双栅LDMOS新器件结构,能够减小总剂量(TID)辐照导致的阈值电压漂移。与常规600 V NLDMOS相比,所提出的双栅由厚栅和薄栅构成,其中薄栅位于p阱的N+有源区上方,厚栅为原器件结构的栅,在受到TID辐照时,薄栅结构可以抑制阈值电压漂移,厚栅结构能保证器件耐压,提高了器件可靠性。利用Sentaurus TCAD进行仿真验证,仿真结果表明,双栅器件在保持原有器件转移、输出、开关等电学特性的基础上,在1 Mrad(Si)剂量辐射时,常规结构器件阈值电压漂移量为105.8%,而双栅新结构器件的阈值电压漂移量仅为10.2%。展开更多
基金supported by the National Natural Science Foundation of China(No.60906038)the Pre-Research Foundation,China(No. 9140A08010309DZ02)the Science-Technology Foundation for Young Scientist of University of Electronic Science and Technology of China(No.L08010301JX0830)
文摘A 700 V triple RESURF nLDMOS with a low specific on-resistance of 100 mΩ.cm^2 is designed. Compared with a conventional double RESURF nLDMOS whose P-type layer is located on the surface of the drift region, the P-type layer of a triple RESURF nLDMOS is located within it. The difference between the locations of the P-type layer means that a triple RESURF nLDMOS has about a 30% lower specific on-resistance at the same given breakdown voltage of 700 V. Detailed research of the influences of various parameters on breakdown voltage, specific on-resistance, as well as process tolerance is involved. The results may provide guiding principles for the design of triple RESURF nLDMOS.
基金supported by the National Science & Technology Major Project of China(No.2009ZX01033-001-003)
文摘Degradation behaviors of 20 V NLDMOS operated under off-state avalanche breakdown conditions are presented.A constant current pulse stressing test is applied to the device.Two different degradation mechanisms are identified by analysis of electrical data,technology computer-aided design（TCAD） simulations and charge pumping measurements.The first mechanism is attributed to positive oxide-trapped charges in the N-type drift region,and the second one is due to decreased electron mobility upon interface state formation in the drift region.Both of the mechanisms are enhanced with increasing avalanche breakdown current.
文摘提出一种600 V N型双栅LDMOS新器件结构,能够减小总剂量(TID)辐照导致的阈值电压漂移。与常规600 V NLDMOS相比,所提出的双栅由厚栅和薄栅构成,其中薄栅位于p阱的N+有源区上方,厚栅为原器件结构的栅,在受到TID辐照时,薄栅结构可以抑制阈值电压漂移,厚栅结构能保证器件耐压,提高了器件可靠性。利用Sentaurus TCAD进行仿真验证,仿真结果表明,双栅器件在保持原有器件转移、输出、开关等电学特性的基础上,在1 Mrad(Si)剂量辐射时,常规结构器件阈值电压漂移量为105.8%,而双栅新结构器件的阈值电压漂移量仅为10.2%。
